机敏材料与电子封装研究组发表论文
 
发布时间： 2019-07-27 浏览次数： 1059

2012年 
1) M.B. Zhou, X. Ma and X.P. Zhang, Undercooling behavior and intermetallic compound coalescence in microscale Sn-3.0Ag-0.5Cu solder balls and Sn-3.0Ag-0.5Cu/Cu joints, Journal of Electronic Materials, 2012, 41(11):3169-3178.
2) S. Cao, S. Pourbabak, D. Schryvers, Quantitative 3D Morphologic and Distributional; Study of Ni4Ti3 Precipitates in a Ni51Ti49 Single Crystal Alloy, Scripta Materialia,2012, 66: 650-653.
3) M.B. Zhou, X. Ma and X.P. Zhang, Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process, Journal of Materials Science: Materials in Electronics, 2012, 23(8): 1543-1551.
4)K. Zhao, Y. Pan, P. Guess, X.P. Zhang and M.G. Swain, Influence of veneer application on fracture behavior of lithium-disilcate-based ceramic crowns, Dental Materials, 2012, 28(6):653-660.
5) C.B. Ke, S.S. Cao, X. Ma and X.P. Zhang, Modeling of Ni4Ti3 precipitation during stress-free and stress-assisted aging of bi-crystalline NiTi shape memory alloys, Transaction of Nonferrous Metals Society of China, 2012, 22: 2578-2585.
6) 岳武，秦红波，周敏波，马骁，张新平，结构变化对Cu/Sn-58Bi/Cu微焊点电迁移行为和组织演变的影响，金属学报，2012, 48(6): 678-686.
7) 张静娴，洪秋虹，孙学通，张新平，医用多孔TiO2/HA/TiO2复合涂层的制备和性能，材料研究学报，2012, 26(6): 572-576.
8) 杜倩，周敏波，张新平，赵克，前牙全瓷冠饰瓷崩裂断口形貌分析，中华口腔医学杂志，2012, 47(4): 1-4.
9) 石新莹，田恬，毛学理，张静娴，张新平，赵克，羟基磷灰石涂层处理的多孔镍钛合金溶血性及细胞粘附性评价，中华口腔医学研究杂志，2012，6(3):266-271.
10) H.B. Qin and X.P. Zhang, Effect of the growth of interfacial IMC layer on fatigue life of the BGA interconnects, The 14th International Conference on Electronics Materials And Packaging (EMAP2012), 13-16 December 2012, Hong Kong, 360-366.（Ei收录）
11) J.B. Zeng, M.B. Zhou and X.P. Zhang, Volume Effect on interfacial microstructure and mechanical properties of Ni(UBM)-Sn3.0Ag0.5Cu-Ni(UBM) sandwich structure interconnects, The 14th International Conference on Electronics Materials And Packaging (EMAP2012), 13-16 December2012, Hong Kong, 182-186.（Ei收录）
12) G.S. Xu, J.B. Zeng, M.B. Zhou, S.S. Cao, X. Ma and X.P. Zhang, Influence of soldering temperature and dwelling time on morphological evolution of Cu6Sn5 intermetallic compound at the Sn-3.0Ag-0.5Cu/Cu interface, 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 289-293.（Ei收录）
13) J.Q. Huang, M.B. Zhou, C.Z. Li, X. Ma, X.P. Zhang, Processing performance and microstructure of Sn-Zn based solders modified by Bi and mixed rare earth elements, 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 352-355.（Ei收录）
14) X.P. Li, J.M. Xia, H.B. Qin, X.Q. He and X.P. Zhang, Study of critical factors influencing the solidification undercooling behavior of Sn-3.0Ag-0.5Cu (SAC) lead-free solder and SAC/Cu joints, 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 356-360. （Ei收录）
15) H.B. Qin, X.P. Li and X.P. Zhang, Influence of thickness of interfacial IMC layer and solder mask layer on mechanical reliability of micro-scale BGA structure interconnects, 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 714-719.（Ei收录）
16) W. Li, M.B. Zhou, H.B. Qin, X. Ma and X.P. Zhang, Experimental and numerical study of the size effect on microstructure and mechanical behavior of Cu/Sn0.7Cu0.05Ni/Cu joints with very small solder volume, 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 749-754.（Ei收录）
17) M.B. Zhou, J.B. Zeng, X. Ma and X.P. Zhang, Dissolution behavior of Cu UBM in BGA structure Sn-3.0Ag-0.5Cu/Cu joints during liquid isothermal aging at and above the solder’s melting temperature, 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 872-876. （Ei收录）
18) H.B. Qin and X.P. Zhang, Three-dimensional finite element analysis of mechanical and fracture behavior of micro-scale BGA structure solder joints containing cracks in the intermetallic compound layer, 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 1244-1249. （Ei收录）
19) X.P. Li, H.B. Qin, Y.F. En, J.M. Xia and X.P. Zhang, Loading rate and size effect on the fracture behavior of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu interconnects, 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 1298-1302.（Ei收录）
20) J.B. Zeng, G.S. Xu, M.B. Zhou, X. Ma and X.P. Zhang, Microstructural evolution and mechanical behavior of line-type Ni/Sn3.0Ag0.5Cu/Ni interconnects with a small thickness during isothermal aging, 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 1303-1307. （Ei收录）
21) W. Yue, H.B. Qin, M.B. Zhou, G.S. Xu, S.S. Cao, X. Ma and X.P. Zhang, Influences of the initial thickness of the interfacial IMC layer on electromigration behavior of Cu/Sn/Cu microscale joints, 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 1320-1325. （Ei收录）

2011年 
1) X.P. Li, J.M. Xia, M.B. Zhou, X. Ma and X.P. Zhang, Solder volume effects on the microstructure evolution and shear fracture behavior of ball grid array structure Sn3.0Ag0.5Cu solder interconnects, Journal of Electronic Materials, 2011, 40(12): 2425-2435.
2) X.T. Sun, Z.X. Kang, X.L. Zhang, H.J. Jiang, R.F. Guan and X.P. Zhang, A comparative study on the corrosion behavior of porous and dense NiTi shape memory alloys in NaCl solution, Electrochimica Acta, 2011, 56:6389-6396
3) X. Ma and R.C. Pond, Martensitic interfaces and transformation crystallography in Pu-Ga alloys. Journal of Materials Science, 2011, 46: 4236-4242.
4) J.X. Zhang, R.F. Guan and X.P. Zhang, Synthesis and characterization of sol-gel hydroxyapatite coatings on porous NiTi alloys, Journal of Alloys and Compounds, 2011, 509(13):4643-4648.
5) Z.Z. Wei, X. Ma and X.P. Zhang, Defect structure and martensitic transformationcrystallography in a Ni2MnGa alloy, Materials Science Forum, 2011, 687: 463-466 (doi:10.4028/www.scientific.net/MSF.687.463)
6)M.B. Zhou, X. Ma and X.P. Zhang, Early interfacial reaction and formation of intermetallic compounds in the Sn-3.5Ag/Cu soldering system, Journal of Electronic Materials, 2011, 40(2): 189-194.
7) Z.L. Tang and X.P. Zhang, Effect of rare earth on 30CrMnSi steel investment castings cracking, Advanced Materials Research, 2011, 160: 692-697.
8) 周敏波，马骁，张新平，稀土改性Sn-Cu-Ni无铅钎料的凝固过冷行为与组织演化，稀 有金属材料与工程，2011, 40(S2): 25-30.
9) 江鸿杰，柯常波，曹姗姗，马骁，张新平. 纳米SiC颗粒增强NiTi形状记忆复合材料制备及其力学性能和阻尼行为，金属学报, 2011, 47(9): 1105-1111.
10) 孙学通，江鸿杰，杨萌蕾，关锐峰，张新平，多孔NiTi记忆合金的化学氧化和热氧化表面改性的对比研究，功能材料. 2011, 42 (3): 1539-1542.
11) 孙学通，江鸿杰，杨萌蕾，关锐峰，张新平，多孔NiTi合金的化学氧化处理表面改性研究，材料导报，2011, 7: 147-149.
12) 李勋平，周敏波，马骁，张新平. 界面耦合作用对Cu(Ni)/Sn-Ag-Cu/Cu(Ni)BGA焊点界 面IMC形成与演化的影响，金属学报, 2011, 47(5): 611-619.
13) 柯常波，马骁，张新平. 孔隙对NiTi形状记忆合金中B2-R相变影响的相场法模拟. 金属学报, 2011, 47(2): 129-139.
14) 张静娴，张新平，孙学通，刘应亮，医用多孔NiTi合金表面溶胶-凝胶法制备TiO2涂层，无机化学学报，2011, 27(2): 264-268.
15) 潘娱，M.V. Swain, 马骁，张新平，赵克，饰瓷对磨牙e.max双层全瓷冠断裂类型的影响，口腔医学研究，2011, 27(2): 97-100.
16) 田恬，关锐峰，赵克，张新平，孔隙尺寸对多孔镍钛合金弹性模量及压缩强度的影响，中华口腔医学研究杂志，2011, 5(3):268-273.
17) 徐炜，石新莹，关锐峰，张新平，赵克，孔隙率对多孔镍钛合金力学性能及离子析出量的影响，医用生物力学，2011, 26(6): 349-354.
18) 潘娱，赵克，张新平，瓷修复体循环疲劳失效行为的实验研究方法，国际口腔医学杂志，2011, 38(3): 34-37.
19) 吴玮琦，程绮婷，张骏，马骁，张新平，赵克，牙科陶瓷的动疲劳性能研究及循环疲劳寿命数值计算，中华口腔医学研究杂志，2011, 5(1): 37-43.
20) W. Li, M.B. Zhou, X. Ma and X.P. Zhang, Influence of mixed rare earth addition on the microstructure of the Sn-Cu-Ni solder and interfacial reaction of Cu/Sn-Cu-Ni/Cu joints, 2011 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP2011), 8-11 August, Shanghai, China, 228-232. （Ei收录）
21) M.B. Zhou, X. Ma and X.P. Zhang, Size effect on the intermetallic compound coalescence in Sn-Ag-Cu solder and Sn-Ag-Cu/Cu solder joints, 2011 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP2011), 8-11 August, Shanghai, China, 248-253.（Ei收录）
22) J.M. Xia, X.P. Li, X. Ma and X.P. Zhang, FE simulation of joint volume effect on fracture behavior of BGA structure Cu/Sn3.0Ag0.5Cu/Cu interconnects under lap-shear loading, 2011 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP2011), 8-11 August, Shanghai, China, 477-482.（Ei收录）
23) X.P. Li, J.M. Xia and X.P. Zhang, The solder volume effect on the creep behavior of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints, 2011 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP2011), 8-11 August, Shanghai, China, 867-873.（Ei收录）
24) W. Yue, M.B. Zhou, H.B. Qin, X.P. Li, X. Ma and X.P. Zhang, A comparative investigation of the electromigration behavior between wedge-type and line-type Cu/Sn3.0Ag0.5Cu/Cu interconnects, 2011 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP2011), 8-11 August, Shanghai, China, 971-975.（Ei收录）
25) H.B. Qin, B. Li, X.P. Li and X.P. Zhang, Finite element simulation of fracture behavior of BGA structure solder interconnects, 2011 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP2011), 8-11 August, Shanghai, China, 991-996.（Ei收录）
25) J.X. Zhang, R.F. Guan and X.P. Zhang, TiO2 anatase coatings on porous NiTi shape memory alloy prepared by a dipping sol–gel method, The 5th International Conference on Bioinformatics and Biomedical Engineering, 10-12 May 2011, Wuhan, China.（Ei收录）