2010年 
1) M.B. Zhou, X. Ma and X.P. Zhang, Undercooling behavior and solidification microstructure evolution of Sn-Cu-Ni solders modified by minute amount of mixed rare earth La-Ce, Materials Science Forum, 2010, 654: 1373-1376.
2) C.B. Ke, X. Ma and X.P. Zhang, Phase field simulation of Ni4Ti3 precipitation in porous NiTi shape memory alloys under applied stresses, Materials Science Forum, 2010, 654:1504-1507.
3) D.S. Li, X.P. Zhang, Z.P. Xiong and Y.W. Mai, Lightweight NiTi shape memory alloy based composites with high damping capacity and high strength, Journal of Alloys and Compounds, 2010, 490(1-2), L15-L19.
4) 关锐峰，李大圣，张新平，采用新型硬脂酸造孔剂烧结制备多孔NiTi合金的结构及性能，机械工程材料，2010, 34(11): 37-41.
5) 刘亮岐，徐金华，陈胜，马鑫，张新平，添加Ag元素对铝软钎焊用Sn-1.5Zn系钎料性能的影响，材料工程，2010, 329: 22-26.
6) 徐炜，赵克，张新平，牙科镍钛形状记忆合金的表面改性，国际口腔医学杂志，2010, 37(2): 221-224.
7) 周敏波，李勋平，马骁，张新平，Sn-3.5Ag/Cu体系早期界面反应及焊点凝固过冷行为的研究，金属学报，2010, 46 (5): 569-574.
8) 黎滨，杨艳， 尹立孟， 张新平. 无铅微焊点界面断裂行为的尺寸效应，机械工程学报，2010, 46(5): 177-185.
9) 柯常波，马骁，张新平，外应力对NiTi合金中共格Ni4Ti3沉淀相长大行为影响的相场法模拟，金属学报，2010, 46(8): 921-929.
10) 柯常波，马骁，张新平，NiTi形状记忆合金中共格Ni4Ti3沉淀相生长动力学行为的相场法模拟，金属学报，2010, 46(1): 84-90.
11) 尹立孟, 张新平. 无铅微互连焊点力学行为尺寸效应的实验及数值模拟. 机械工程学报, 2010, 46(2): 55-60.
12) 杨艳，尹立孟，马晓，张新平，电迁移致SnAgCu微焊点强度退化及尺寸效应研究，电子元件与材料，2010, 29(2): 70-73.
13) C.B. Ke, X.P. Zhang, X. Ma, N. Zhou, Y. Wang, Phase field simulation of Ni4Ti3 precipitation during aging of bi-crystalline NiTi alloy, 11th IUMRS International Conference in Asia, Oral Presentation, Sept. 25-28, 2010.
14) M.B. Zhou, H.B. Qin, X. Ma, X.P. Zhang, Interfacial Reaction and Melting/solidification Characteristics between Sn and different metallizations of Cu, Ag, Ni and Co, the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010), Xi’an, China, 16-19 Aug 2010, 202-207.
15) H.B. Qin, B. Li, X.P. Zhang, Finite element simulation of dynamic fracture behaviour and crack deflection in electronic packaging materials and micro-interconnections, the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010), Xi’an, China, 16-19 Aug 2010, 594-600.
16) X.P. Li, J.M. Xia, M.B. Zhou, X. Ma, X.P. Zhang, The influence of solder volume and pad size on the shear fracture behavior of BGA structured Cu/Sn3.0Ag0.5Cu/Cu interconnects, the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010), Xi’an, China, 16-19 Aug 2010, 1118-1123.

2009年 
1) L.M. Yin, X.P. Zhang, C.S Lu. Size and volume effects on the strength of microscale lead-free solder joints. Journal of Electronic Materials, 2009, 38(4): 2179-2183.
2) D.S. Li, Y.P. Zhang, X. Ma and X.P. Zhang, Space-holder engineered porous NiTi shape memory alloys with improved pore characteristics and mechanical properties, Journal of Alloys and Compounds, 2009, 474(1-2), L1-L5.
3) D.S. Li, Y.P. Zhang, G. Eggeler and X.P. Zhang, High porosity and high strength porous NiTi shape memory alloys with controllable pore characteristics, Journal of Alloys and Compounds, 2009, 470(1-2), L1-L5.
4) 柯常波，张新平，第二相颗粒对多晶材料晶粒生长影响的元胞自动机(CA)模拟，中国有色金属学报，2009, 19(12): 2173-2178.
5) 王宏芹，D. P. Sekulic， 赵慧，张新平，SnPb钎料在铜及金属间化合物基板上润湿动力学研究，中国有色金属学报，2009, 19(12): 2186-2191.
6) 尹立孟， 杨艳， 刘亮岐， 张新平. 电子封装微互连焊点力学行为的尺寸效应. 金属学报, 2009, 45(4): 422-427.
7) 张宇鹏，赵四勇，马骁，张新平，高线性超弹性多孔NiTi合金的压缩力学行为，中国有色金属学报，2009, 19(12): 2167-2172.
8) 张宇鹏，张新平，可变孔隙率多孔NiTi合金的内耗行为，中国有色金属学报，2009, 19(10): 1872-1879.
9) 杨艳，尹立孟，张新平，热时效和焊点尺寸对SnAgCu微焊点强度的影响，电子元件与材料，2009, 28(10):54-56.
10) 马良，尹立孟，冼健威，张新平，高温电子封装无铅化的研究进展，焊接技术，2009, 38(5): 6-10.
11) 吴晓平，李大圣，张骏，马骁，赵克，张新平，不同代型材料对全瓷冠断裂强度和断裂类型的影响，中华口腔医学杂志，2009, 44: 483-487.
12) 黄觉辉，赵克，张新平，全瓷冠桥疲劳行为的有限元分析研究进展，国际口腔医学杂志，2009, 36(3): 347-350.
13) 程绮婷，赵克，张新平，牙科陶瓷力学性能与可靠性的研究方法，中华口腔医学研究杂志，2009, 3(3): 63-66.
14) B. Li, L.M. Yin, Y. Yang, X.P. Zhang. FE simulation of size effects on interface fracture characteristics of microscale lead-free solder interconnects. 10th International Conference on Electronic Packaging Technology-High Density Packaging (ICEPT-HDP), 11-14 August 2009, Beijing, China, pp.242-247.

2008年 
1) X.P. Zhang, H.Y. Liu, B. Yuan and Y.P. Zhang, Superelasticity decay behavior of the porous NiTi shape memory alloys under cyclic strain controlled fatigue, Materials Science and Engineering, 2008, A481-482: 170-173.
2) X.P. Zhang, L.M. Yin and C.B. Yu, Thermal creep and fracture behaviors of the lead-free Sn-Ag-Cu-Bi solder interconnections under different stress levels, Journal of Materials Science: Materials in Electronics, 2008, 19: 393-398.
3) X. Ma and R.C. Pond. Defect modelling of martensitic interfaces in plate martensite. Materials Science and Engineering, 2008, A481-482: 404-408.
4) 李大圣，张宇鹏，熊志鹏，张新平，轻质高强NiTi形状记忆合金的制备及其超弹性行为,金属学报，2008, 44(8): 995-1000.
5) 尹立孟，张新平. 电迁移致无铅钎料微互连焊点的脆性蠕变断裂行为. 电子学报，2009, 37(2): 253-257.
6) 张新平，尹立孟，于传宝，电子及光子封装无铅钎料研究和应用进展，材料研究学报，2008, 22(1): 1-9.
7) 尹立孟，张新平，电子封装微互连中的电迁移，电子学报，2008, 36(8): 1610-1614.
8) 刘亮歧，尹立孟，张新平，电子垃圾问题面临的挑战与解决途径，材料导报，2008, 22: 1-3.
9) 杨艳，尹立孟，冼健威，马鑫，张新平，绿色电子制造及绿色电子封装材料，电子工艺技术，2008, 29(5): 256-261.
10) 王勤琴, 张骏,赵克,张新平, 磨牙全瓷冠断裂类型的力学实验与三维有限元分析研究, 中华口腔医学杂志，2008, 43(11): 680-683.
11) 王勤琴，赵克，张新平，全瓷冠桥修复体的应力分布、疲劳及断裂失效分析有限元方法的研究和应用，国际口腔医学杂志，2008, 35: 130-133.
12) 张骏，赵克，王勤琴，范丹妮，吴小平，张新平，不同直径压头对磨牙e.max全瓷冠失效模式的影响，中华口腔医学研究杂志，2008, 2(4): 21-23.
13)吴晓平，程绮婷，赵克，张新平，牙陶瓷材料及修复体循环疲劳的损伤模式，中华口腔医学研究杂志，2008, 2(1): 79-82.
14) D.S. Li, Z.P. Xiong, Y.P. Zhang and X.P. Zhang, Damping behaviors of the second-phase engineered NiTi shape memory alloys, International Conference on Martensitic Transformations, June 29 to July 5, 2008, New Mexico, USA.
15) Y.P. Zhang, D.S. Li, X. Ma and X.P. Zhang, Phase transformation and internal friction behaviors of gradient porosity Ni50.8Ti49.2 shape memory alloys, International Conference on Martensitic Transformations, June 29-July5, 2008, New Mexico, USA.