工程中心近年来（2011-2016）在电子封装研究领域出版专著和学术论文发表情况

专著：
 1) 张新平，于大全，尹立孟，周敏波，电子封装和光子封装用金属材料，《新型材料科学与技术》：金属材料卷, 华南理工大学出版社，2012 年9 月，898-975（14 万字)
 2) X.Q. Shi, G. Y. Li, Q.J. Yang, Reliability Assessment of Microelectronics Packages Using Dynamic Testing Methods, Chapter 21 Reliability assessment of microelectronics packages using dynamic testing method, John Willey and Sons Inc., Hoboken, New Jersey, 2011, 485-517.  

发表论文：

2016年
   1) Shui-Bao Liang, Chang-bo Ke, Wen-jing Ma, Min-Bo Zhou, Xin-Ping Zhang. Phase field simulation of segregation of the Bi-riched phase in Cu/Sn-Bi/Cu solder interconnects under electric current stressing. Proceedings of 66th Electronic Components & Technology Conference (ECTC 2016), Las Vegas, NV, USA, pp. 264-270, May. 31 - Jun. 3, 2016.     

2011-2015年
         1) H.B. Qin, X.P. Zhang, M. B. Zhou, X.P. Li, Y.-W. Mai, Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, Microelectronics Reliability, 2015, 55 (in press).
 2) L.F. Wang, W.S. Ma, D.F. Lei, D.Q. Zhang, Preparation and characterization of para-tertiary-butylphenol formaldehyde resins using dual catalytic-extraction method, Progress in Organic Coatings，2015,87:1-9.
 3) D.F. Lei, W.S. Ma, L.F. Wang, D.Q. Zhang, Preparation of 2-ethyl-4-methylimidazole derivatives as latent curing agents and their application in curing epoxy resin, Journal of Applied Polymer Science, 2015, 132, 42563(1-9).
 4) H.B. Qin, X.P. Zhang, M.B. Zhou, J.B. Zeng, Y.-W, Mai, Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints, Materials Science and Engineering-A, 2014, 617: 14-23.
 5) H.B. Qin, W.Y. Li, M. B. Zhou, X.P. Zhang, Low cycle fatigue performance of ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, Microelectronics Reliability, 2014, 54: 2911-2921.
 6) W. Yue, H.B. Qin, M.B. Zhou, X. Ma, X.P. Zhang, Electromigration Induced microstructure evolution and damage in asymmetric Cu/Sn-58Bi/Cu solder interconnect under current stressing, Transactions of the Nonferrous Metals Society of China, 2014, 24(5): 1619-1628.
 7) Y. Tang, G. Y. Li, D. Q. Chen, Y. C. Pan, Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5CuxTiO2 solder joints during isothermal aging process, Journal of Materials Science-Materials in Electronics, 2014; 25(2):981-991.
 8) Y. Tang, G.Y. Li, Y.C. Pan, Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints in reflow process, Journal of Materials Science-Materials in Electronics, 2014; 554(2):195-203.
 9) J.W. Yang, B. Cao, X.C. He, H.S. Luo, Microstructure evolution and mechanical properties of Cu-Al joints by ultrasonic welding. Science and Technology of Welding and Joining, 2014, 19(6): 500-504.
 10) 柯常波, 周敏波, 张新平. Sn/Cu 互连体系界面金属间化合物Cu6Sn5 演化和生长动力学的相场法模拟. 金属学报, 2014, 50(3): 294-304.
 

11) 秦红波, 李望云, 李勋平, 张新平, BGA 结构无铅微焊点的低周疲劳行为研究, 机械工程学报, 2014, 50(20): 54-62.
 12) 汪林峰, 马文石, 肖舒文, 乙醇胺功能化石墨烯及其PVB 复合材料的制备，高分子学报，2014, (2): 255-261.
 13) 吴力, 马文石, 咪唑基离子液体非共价修饰的石墨烯结构与分散性, 无机化学学报, 2014, 30(8): 1875-1882.
 14) H.B. Qin, B. Li, C.B. Ke, W. Yue, M.B. Zhou, X.P. Zhang. Interaction effect between electromigration and microstructure evolution in Cu/Sn-58Bi/Cu solder interconnect. The Electronic Components and Technology Conference (ECTC), Florida, USA, 27- 30 May 2014.
 15) L. Zhang, M.B. Zhou, X.P. Zhang, Influence of solder volume and interfacial reaction on the undercooling and solidification microstructure of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints, 15th International Conference on Electronic Packaging Technology (ICEPT), Chengdu, 12-15 August 2014, 251-255.
 16) J.D. Wang, X.Q. He, X.P. Li, Y.F. En, X.P. Zhang, Hermetic packaging of Kovar alloy and low-carbon steel structure in hybrid integrated circuit(HIC) system using parallel seam welding process, 15th International Conference on Electronic Packaging Technology (ICEPT), Chengdu, 12-15 August 2014, 347-351.
 17) H.B. Qin, W. Yue, C.B. Ke, X.P. Zhang, B. Li, Interaction effect between electromigration and microstructure evolution in BGA structure Cu/Sn-58Bi/Cu solder interconnects, 15th International Conference on Electronic Packaging Technology (ICEPT), Chengdu, 12-15 August 2014, 587-591.
 18) W.Y. Li, H.B. Qin, M.B. Zhou, X.P. Zhang, The influence of imposed electric current on the tensile fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, 15th International Conference on Electronic Packaging Technology (ICEPT), Chengdu, 12-15 August 2014, 1030-1034.
 19) S.B. Liang, C.B. Ke, W.J. Ma, M.B. Zhou, X.P. Zhang, Phase field simulation of Kirkendall voids at the interface of microscale Sn/Cu system lead-free interconnects, 15th International Conference on Electronic Packaging Technology (ICEPT), Chengdu, 12-15 August 2014, 641-645.
 20) B. Li, X.P. Zhang, Y. Yang, L.M. Yin, M.G. Pecht. Size and constraint effects on interfacial fracture behavior of microscale solder interconnects. Microelectronics Reliability, 2013, 53 (1) 154-163.
 21) Y. Tang, G.Y. Li, X.Q. Shi, Low-cycle fatigue behavior of 95.8Sn-3.5Ag-0.7Cu solder joints, Journal of Electronic Materials, 2013, 42(1):192-200.
 22) Y. Tang, Y.C. Pan, G.Y. Li, Influence of TiO2 nanoparticles on thermal property, wettability and interfacial reaction in Sn-3.0Ag-0.5Cu-xTiO2 composite solder, Journal of Materials Science-Materials in Electronics, 2013, 24(5):1587-1594.
 23) G.Q. Wei, L. Wang, X.Q. Peng, M.Y. Xue, Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder joints, International Journal of Minerals, Metallurgy and Materials, 2013, 20(9): 883-889.
 24) W.S. Ma, L. Wu, D.Q. Zhang, S.F. Wang, Preparation and properties of 3-aminopropyltriethoxysilane functionalized graphene/polyurethane nanocomposite coatings. Colloid Polym Sci, 2013,291:2765-2773.
 25) W.S. Ma, F. Yang, J.J. Shi, F.X. Wang, Z.G. Zhang, S.F. Wang. Silicone based nanofluids containing functionalized grapheme Nanosheets. Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2013, 431:120-126.

 26) W.S. Ma, D.Q. Zhang, Y. Duan, H. Wang, Highly monodisperse polysilsesquioxane spheres: Synthesis and application in cotton fabrics. Journal of Colloid and Interface Science, 2013(392):194-200.
 27) W.S. Ma, J. Li, B.J. Deng, X.S. Zhao, Preparation and characterization of long-chain alkyl silane-functionalized graphene film. Journal Materials Science, 2013, 48:156–161.
 28) W.S. Ma, J. Li, B.J. Deng, X.D. Lin, S.S. Zhao, Properties of functionalized graphene/room temperature vulcanized silicone rubber composites prepared by an in-situ reduction method, Journal of Wuhan University of Technology-Mater.Sci.Ed, 2013, 28(1):127-131.
 29) 周敏波, 马骁, 张新平. BGA 结构Sn-3.0Ag-0.5Cu/Cu 焊点低温回流时界面反应和IMC 生长行为.金属学报, 2013, 49 (3): 341-350.
 30) 李吉, 马文石, 硅烷功能化石墨烯/硅树脂纳米复合材料的制备与表征, 高分子学报, 2013, (3):327-334.
 31) C.B. Ke, M.B. Zhou, X.P. Zhang. A multi-phase field study of the role of grain boundary diffusion in growth of Cu6Sn5 intermetallic compound during early stage of soldering reaction. The 14th International Conference on Electronic Packaging Technology (ICEPT), Dalian, 11-14 August 2013, 572-578.
 32) C.Z. Li, M.Y. Yan, M.B. Zhou, X. Ma, X.P. Zhang, Q.S. Ye, Y. R. Huang. Effect of activators and surfactants in halogen-free fluxes on wettability of Sn-0.7Cu-0.05Ni solder on Cu substrate. The 14th International Conference on Electronic Packaging Technology (ICEPT), Dalian, 11-14 August 2013, 321-324.
 33) G.S. Xu, J.B. Zeng, M.B. Zhou, X.P. Zhang. Undercooling and solidification behavior of Sn-Ag-Cu solder balls and Sn-Ag-Cu/UBM joints. The 14th International Conference on Electronic Packaging Technology (ICEPT), Dalian, 11-14 August 2013, 325-329.
 34) W.J. Ma, C.B. Ke, M.B. Zhou, X.P. Zhang. Phase field simulation of solidification behavior and microstructure evolution of Sn-58Bi/Cu solder interconnect during reflow soldering process. The 14th International Conference on Electronic Packaging Technology (ICEPT), Dalian, 11-14 August 2013, 330-333.
 35) J.B. Zeng, G.S. Xu, M.B. Zhou, X.P. Zhang. Isothermal aging effect on microstructure and mechanical properties of Ni/Sn3.0Ag0.5Cu/Ni interconnects with the decreasing height. The 14th International Conference on Electronic Packaging Technology (ICEPT), Dalian, 11-14 August 2013, 997-1004.
 36) W. Yue, M.B. Zhou, H.B. Qin, X. Ma, X.P. Zhang. Influence of pre-existing void in the solder joint on electromigration behavior of Cu/Sn58Bi/Cu joints. The 14th International Conference on Electronic Packaging Technology (ICEPT), Dalian, 11-14 August 2013, 1005-1009.
 37) H.B. Qin, H.H. Yuwen, M.B. Zhou, X.P. Zhang. Influence of geometry of microbump interconnection thermal stress and fatigue life of interconnects in copper filled through silicon via structure. The 14th International Conference on Electronic Packaging Technology (ICEPT), Dalian, 11-14 August 2013, 1019-1024.
 38) C.R. Yang, G.S. Xu, S.W. Lee, X.P. Zhang. Brittle fracture of intermetallic compounds in SAC solder joints under high speed ball pull/pin pull and Charpy impact tests. IEEE Electronic Components and Technology Conference (ECTC2013), 28-31 May 2013, Las Vegas, NV USA, pp.1294-1299.
 39) 秦红波, 宇文惠惠, 李望云, 张新平. TSV 结构微凸点互连热疲劳寿命的研究. 2013 中国力学大会, 西安, CSTAM2013-A31-0842.
 40) M.B. Zhou, X. Ma, X.P. Zhang. Undercooling behavior and intermetallic compound coalescence in microscale Sn-3.0Ag-0.5Cu solder balls and Sn-3.0Ag-0.5Cu/Cu joints. Journal of Electronic Materials, 2012, 41(11):3169-3178.

 41) M.B. Zhou, X. Ma, X.P. Zhang. Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process. Journal of Materials Science: Materials in Electronics, 2012, 23(8): 1543- 1551.
 42) 岳武, 秦红波, 周敏波, 马骁, 张新平. 结构变化对Cu/Sn-58Bi/Cu 微焊点电迁移行为和组织演变的影响. 金属学报, 2012, 48(6): 678-686.
 43) 杨景卫, 曹彪, 尹天罡. 基于DSP 控制的超声金属焊接电源. 焊接学报, 2012, 33(7): 29-33.
 44) 时镜镜, 马文石, 林晓, KH-570 功能化石墨烯的制备与表征, 无机化学学报, 2012, 28(1): 131-136.
 45) H.B. Qin, X.P. Zhang. Effect of the growth of interfacial IMC layer on fatigue life of the BGA interconnects. The 14th International Conference on Electronics Materials And Packaging (EMAP2012), 13-16 December 2012, Hong Kong, 360-366.
 46) J.B. Zeng, M.B. Zhou, X.P. Zhang. Volume Effect on interfacial microstructure and mechanical properties of Ni(UBM)-Sn3.0Ag0.5Cu-Ni(UBM) sandwich structure interconnects. The 14th International Conference on Electronics Materials And Packaging (EMAP2012), 13-16 December 2012, Hong Kong, 182-186.
 47) G.S. Xu, J.B. Zeng, M.B. Zhou, S.S. Cao, X. Ma, X.P. Zhang. Influence of soldering temperature and dwelling time on morphological evolution of Cu6Sn5 intermetallic compound at the Sn-3.0Ag-0.5Cu/Cu interface. The 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 289-293.
 48) G.Q. Wei, L. Wang, Effects of cooling rate on microstructure and microhardness of lead-free Sn-3.0Ag-0.5Cu solder, The 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 453-456.
 49) J.Q. Huang, M.B. Zhou, C.Z. Li, X. Ma, X.P. Zhang. Processing performance and microstructure of Sn-Zn based solders modified by Bi and mixed rare earth elements. The 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 352-355.
 50) X.P. Li, J.M. Xia, H.B. Qin, X.Q. He, X.P. Zhang. Study of critical factors influencing the solidification undercooling behavior of Sn-3.0Ag-0.5Cu (SAC) lead-free solder and SAC/Cu joints. The 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 356-360.
 51) H.B. Qin, X.P. Li, X.P. Zhang. Influence of thickness of interfacial IMC layer and solder mask layer on mechanical reliability of micro-scale BGA structure interconnects. The 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 714-719.
 52) W. Li, M.B. Zhou, H.B. Qin, X. Ma, X.P. Zhang. Experimental and numerical study of the size effect on microstructure and mechanical behavior of Cu/Sn0.7Cu0.05Ni/Cu joints with very small solder volume. The 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 749-754.
 53) M.B. Zhou, J.B. Zeng, X. Ma, X.P. Zhang. Dissolution behavior of Cu UBM in BGA structure Sn-3.0Ag- 0.5Cu/Cu joints during liquid isothermal aging at and above the solder’s melting temperature. The 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 872-876.
 54) Y. Tang, Y.C. Pang, J.X. Zhan, G.Y. Li, Effects of Sb addition on grain ripening growth at interface of Sn-Ag- Cu-xSb/Cu in wetting reactions, The 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 219 - 223.
 55) H.B. Qin, X.P. Zhang. Three-dimensional finite element analysis of mechanical and fracture behavior of microscale BGA structure solder joints containing cracks in the intermetallic compound layer. The 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 1244-1249.

 56) X.P. Li, H.B. Qin, Y.F. En, J.M. Xia, X.P. Zhang. Loading rate and size effect on the fracture behavior of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu interconnects. The 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 1298-1302.
 57) J.B. Zeng, G.S. Xu, M.B. Zhou, X. Ma, X.P. Zhang. Microstructural evolution and mechanical behavior of linetype Ni/Sn3.0Ag0.5Cu/Ni interconnects with a small thickness during isothermal aging. The 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 1303-1307.
 58) W. Yue, H.B. Qin, M.B. Zhou, G.S. Xu, S.S. Cao, X. Ma, X.P. Zhang. Influences of the initial thickness of the interfacial IMC layer on electromigration behavior of Cu/Sn/Cu microscale joints. The 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, 13-16 August 2012, 1320-1325.
 59) X.P. Li, J.M. Xia, M.B. Zhou, X. Ma, X.P. Zhang. Solder volume effects on the microstructure evolution and shear fracture behavior of ball grid array structure Sn3.0Ag0.5Cu solder interconnects. Journal of Electronic Materials, 2011, 40(12): 2425-2435.
 60) M.B. Zhou, X. Ma, X.P. Zhang. Early interfacial reaction and formation of intermetallic compounds in the Sn- 3.5Ag/Cu soldering system. Journal of Electronic Materials, 2011, 40(2): 189-194.
 61) 周敏波, 马骁, 张新平. 稀土改性Sn-Cu-Ni 无铅钎料的凝固过冷行为与组织演化. 稀有金属材料与工程, 2011, 40(S2): 25-30.
 62) 李勋平, 周敏波, 马骁, 张新平. 界面耦合作用对Cu(Ni)/Sn-Ag-Cu/Cu(Ni)BGA 焊点界面IMC 形成与演化的影响. 金属学报, 2011, 47(5): 611-619.
 63) 姚健, 卫国强, 石永华,谷丰. 电迁移极性效应及其对Sn-3.0Ag-0.5Cu 无铅焊点拉伸性能的影响，中国有色金属学报，2011, 21(12): 3094-3099.
 64) G.Y. Li, X.D. Bi, Q. Chen and X.Q. Shi, Influence of dopant on growth of intermetallic layers in Sn-Ag-Cu solder joints, Journal of Electronic Materials, 2011, 40(2):165-176.
 65) J.Y. Liu, L. Reni1, Q. Wei, J. L. Wu, S. Liu, Y. J. Wang, G. Y. Li, Fabrication and characterization of polycaprolactone/calcium sulfate whisker composites, Polymer Letters, 2011, 5(8):742–752.
 66) X.L. Qi, B. Zhou, P.F. Zhang, Y.F. En, G.Y. Li, Effect of fixation method on solder joint vibration fatigue reliability of high density PCB assembly”, The 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 8-11 August 2011, Shanghai, China, 1-4.
 67) W. Li, M.B. Zhou, X. Ma, X.P. Zhang. Influence of mixed rare earth addition on the microstructure of the Sn- Cu-Ni solder and interfacial reaction of Cu/Sn-Cu-Ni/Cu joints. The 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 8-11 August 2011, Shanghai, China, 228-232.
 68) M.B. Zhou, X. Ma, X.P. Zhang. Size effect on the intermetallic compound coalescence in Sn-Ag-Cu solder and Sn-Ag-Cu/Cu solder joints. The 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 8-11 August 2011, Shanghai, China, 248-253.
 69) G.Q. Wei, J. Yao, Y.H. Shi, The influence of electromigration and aging on the reliability of SnAgCu lead-free solder joint at 100°C, 2011, The 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 8-11 August 2011, Shanghai, China, 1-5.
 70) G.Q. Wei, Z.H. Wan, M.Y. Xue, L. Wang, Investigation on microstructures and properties of low Ag contentlead-free solder alloy, The 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 8-11 August 2011, Shanghai, China, 1-4.
 71) J.M. Xia, X.P. Li, X. Ma, X.P. Zhang. FE simulation of joint volume effect on fracture behavior of BGA structure Cu/Sn3.0Ag0.5Cu/Cu interconnects under lap-shear loading. The 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 8-11 August 2011, Shanghai, China, 477-482.
 72) X.P. Li, J.M. Xia, X.P. Zhang. The solder volume effect on the creep behavior of BGA structure Cu/Sn-3.0Ag- 0.5Cu/Cu joints. The 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 8-11 August 2011, Shanghai, China, 867-873.
 73) W. Yue, M.B. Zhou, H.B. Qin, X.P. Li, X. Ma, X.P. Zhang. A comparative investigation of the electromigration behavior between wedge-type and line-type Cu/Sn3.0Ag0.5Cu/Cu interconnects. The 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 8-11 August 2011, Shanghai, China, 971-975.
 74) H.B. Qin, B. Li, X.P. Li, X.P. Zhang. Finite element simulation of fracture behavior of BGA structure solder interconnects. The 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 8-11 August 2011, Shanghai, China, 991-996.