2014:
1) H.B. Qin, X.P. Zhang, M.B. Zhou, J.B. Zeng, Y.-W, Mai, Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints, Materials Science and Engineering-A, 2014, 617: 14-23.
2) H.B. Qin, W.Y. Li, M. B. Zhou, X.P. Zhang, Low cycle fatigue performance of ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, Microelectronics Reliability, 2014, 54: 2911-2921 (DOI: 10.1016/j.microrel.2014.07.052).
3) C.B. Ke, S. Cao, X.P. Zhang, Three-dimensional phase field simulation of the morphology and growth kinetics of Ni4Ti3 precipitates in a NiTi alloy, Modelling and Simulation in Materials Science and Engineering, 2014, 22: 055018 (1-16).
4) Z.Z. Wei, X. Ma, X.P. Zhang, A criterion for determining the optimum value of twist in the topological model. Philosophical Magazine Letter, 2014, 94(5): 288–295.
5) X. Ma, Z.Z. Wei, X.P. Zhang, Theoretical study on the dislocation structure of the parent-martensite interface in a magnetic shape memory alloy. Journal of Materials Science, 2014, 49(13):4648-4655.
6) W. Yue, H.B. Qin, M.B. Zhou, X. Ma, X.P. Zhang, Electromigration Induced microstructure evolution and damage in asymmetric Cu/Sn-58Bi/Cu solder interconnect under current stressing, Transactions of the Nonferrous Metals Society of China, 2014, 24(5): 1619-1628.
7) K. Zhao, Y.R. Wei, Y. Pan, X.P. Zhang, M.V. Swain, P.C. Guess. Influence of veneer and cyclic loading on failure behavior of lithium disilicate glass-ceramic molar crowns. Dental Materials, 2014, 30(2): 164-171.
8) X.D. Wang, Y.T. Jian, P.C. Guess, M.V. Swain, X.P. Zhang, K. Zhao, Effect of core ceramic grinding on fracture behavior of bilayered lithium disilicate glass-ceramic under two loading schemes, Journal of Dentistry, 2014, 42(11):1436-45(doi: 10.1016/j.jdent. 2014.03.014)
9) 柯常波，周敏波，张新平，Sn/Cu互连体系界面金属间化合物Cu6Sn5演化和生长动力学的相场法模拟，金属学报，2014, 50(3): 294-304.
10) 罗军平, 马骁, 关锐峰, 曹姗姗, 柯常波, 倪东惠, 张新平. 近零膨胀TiNi合金基复合材料的制备及其性能. 中国有色金属学报, 2014，24(2):461-467.
11) 秦红波，李望云，李勋平，张新平，BGA结构无铅微焊点的低周疲劳行为研究，机械工程学报，2014, 50(20): 54-62.
12) X.P. Zhang, A novel Ni-Ti shape memory alloy aiming at making artificial anal sphincter: Design, Fabrication, Characterization and Modeling. The 8th International Conference on Advanced Materials Processing (ICAMP8), 27-30 July 2014, Gold Coast, QLD, Australia.
13) H.B. Qin, B. Li, C.B. Ke, W. Yue, M.B. Zhou, X.P. Zhang. Interaction effect between electromigration and microstructure evolution in Cu/Sn-58Bi/Cu solder interconnect. The Electronic Components and Technology Conference (ECTC), Florida, USA, 27-30 May 2014, 2249-2254.
15) L. Zhang, M.B. Zhou and X.P. Zhang, Influence of solder volume and interfacial reaction on the undercooling and solidification microstructure of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints, 15th International Conference on Electronic Packaging Technology (ICEPT), Chengdu, 12-15 August 2014, 251-255.
16) J.D. Wang, X.Q. He, X.P. Li, Y.F. En and X.P. Zhang, Hermetic packaging of Kovar alloy and low-carbon steel structure in hybrid integrated circuit(HIC) system using parallel seam welding process, 15th International Conference on Electronic Packaging Technology (ICEPT), Chengdu, 12-15 August 2014, 347-351.
17) H.B. Qin, W. Yue, C.B. Ke, X.P. Zhang and B. Li, Interaction effect between electromigration and microstructure evolution in BGA structure Cu/Sn-58Bi/Cu solder interconnects, 15th International Conference on Electronic Packaging Technology (ICEPT), Chengdu, 12-15 August 2014, 587-591.
18) W.Y. Li, H.B. Qin, M.B. Zhou and X.P. Zhang, The influence of imposed electric current on the tensile fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, 15th International Conference on Electronic Packaging Technology (ICEPT), Chengdu, 12-15 August 2014, 1030-1034.
19) S.B. Liang, C.B. Ke, W.J. Ma, M.B. Zhou and X.P. Zhang, Phase field simulation of Kirkendall voids at the interface of microscale Sn/Cu system lead-free interconnects, 15th International Conference on Electronic Packaging Technology (ICEPT), Chengdu, 12-15 August 2014, 641-645.

2013：
1) H.J. Jiang, C.B. Ke, S.S Cao, X. Ma, X.P. Zhang, Phase transformation and damping behavior of lightweight porous TiNiCu alloys fabricated by powder metallurgy process, Transactions of the Nonferrous Metals Society of China, 2013, 23(7): 2029-2036.
2) H.J. Jiang, S. Cao, C.B. Ke, X. Ma, X.P. Zhang, Fine grained bulk NiTi shape memory alloy fabricated by rapid solidification process and its mechanical properties and damping performance, Journal of Materials Science and Technology, 2013, 29(9): 855-862.
3) H.J. Jiang, S. Cao, X. C.B. Ke, Ma, X.P. Zhang, Nano-sized SiC particle reinforced NiTi alloy matrix shape memory composite, Materials Letters, 2013, 100: 74-77. (Cited: 1 on 25 March 2014)
4) B. Li, X.P. Zhang, Y. Yang, L.M. Yin, M.G. Pecht, Size and constraint effects on interfacial fracture behavior of microscale solder interconnects, Microelectronics Reliability, 2013, 53 (1): 154-163.
5) S. Cao, C.B. Ke, X.P. Zhang and D. Schryvers, Morphological characterization and distribution of autocatalytic-grown Ni4Ti3 precipitates in a Ni-Ti single crystal, Journal of Alloys and Compounds, 2013, 577: S215-S218.
6) D. Schryvers, S. Cao, W Tirry, H. Idrissi and S. Van Aert, Advanced three-dimensional electron microscopy techniques in the quest for better structural and functional materials, Science and Technology of Advanced Materials, 2013, 14: 014206 (13pp)
7) 周敏波，马骁，张新平, BGA结构Sn-3.0Ag-0.5Cu/Cu焊点低温回流时界面反应和IMC生长行为，金属学报，2013, 49 (3): 341-350.
8) 韦昭召，马骁，张新平，Ni2MnGa合金相界面位错结构及马氏体相变晶体学研究，金属学报，2013, 49 (2): 187-198.
9) 柯常波，曹姗姗，马骁，黄平，张新平，NiTi形状记忆合金中Ni4Ti3共格沉淀相自催化生长效应的相场法模拟研究，金属学报，2013, 49 (1): 115-122.
10) 魏雅茹，潘娱，曹姗姗，张新平，赵克，饰瓷对磨牙二硅酸锂玻璃陶瓷冠疲劳失效与结构可靠性的影响，中华口腔医学杂志，2013, 48(2): 91-95.
11) 叶琦，石新莹，曹姗姗，赵克，张新平，多孔钛孔隙率和孔隙尺寸对其力学性能及细胞相容性的影响，口腔材料与器械杂志，2013，22(1):7-12, 21.
12) C.B. Ke, Shanshan Cao, Xiao Ma, Xin-Ping Zhang. Phase Field Simulation of Coherent Ni4Ti3 Precipitation during Stress-assisted Aging of Porous Near-equiatomic NiTi Shape Memory Alloys. IUMRS-ICAM2013 International Conference on Advanced Materials, 22-28 Sept. 2013, Qingdao, China.
13) C.Z. Li, M.Y. Yan, M.B. Zhou, X. Ma, X.P. Zhang, Q.S. Ye and Y. R. Huang. Effect of activators and surfactants in halogen-free fluxes on wettability of Sn-0.7Cu-0.05Ni solder on Cu substrate, 14th International Conference on Electronic Packaging Technology (ICEPT), Dalian, 11-14 August 2013, 321-324.
14) G.S. Xu, J.B. Zeng, M.B. Zhou and X.P. Zhang, Undercooling and solidification behavior of Sn-Ag-Cu solder balls and Sn-Ag-Cu/UBM joints, 14th International Conference on Electronic Packaging Technology (ICEPT), Dalian, 11-14 August 2013, 325-329.
15) W.J. Ma, C.B. Ke, M.B. Zhou and X.P. Zhang, Phase field simulation of solidification behavior and microstructure evolution of Sn-58Bi/Cu solder interconnect during reflow soldering process, 14th International Conference on Electronic Packaging Technology (ICEPT), Dalian, 11-14 August 2013, 330-333.
16) C.B. Ke, M.B. Zhou and X.P. Zhang, A multi-phase field study of the role of grain boundary diffusion in growth of Cu6Sn5 intermetallic compound during early stage of soldering reaction, 14th International Conference on Electronic Packaging Technology (ICEPT), Dalian, 11-14 August 2013, 572-578.
17) J.B. Zeng, G.S. Xu, M.B. Zhou and X.P. Zhang, Isothermal aging effect on microstructure and mechanical properties of Ni/Sn3.0Ag0.5Cu/Ni interconnects with the decreasing height, 14th International Conference on Electronic Packaging Technology (ICEPT), Dalian, 11-14 August 2013, 997-1004.
18) W. Yue, M.B. Zhou, H.B. Qin, X. Ma and X.P. Zhang. Influence of pre-existing void in the solder joint on electromigration behavior of Cu/Sn58Bi/Cu joints, 14th International Conference on Electronic Packaging Technology (ICEPT), Dalian, 11-14 August 2013, 1005-1009.
19) H.B. Qin, H.H. Yuwen, M.B. Zhou and X.P. Zhang, Influence of geometry of microbump interconnection thermal stress and fatigue life of interconnects in copper filled through silicon via structure, 14th International Conference on Electronic Packaging Technology (ICEPT), Dalian, 11-14 August 2013, 1019-1024.
20) C.R. Yang, G.S. Xu, S.W. Lee and X.P. Zhang, Brittle fracture of intermetallic compounds in SAC solder joints under high speed ball pull/pin pull and Charpy impact tests, IEEE Electronic Components and Technology Conference (ECTC2013), 28-31 May 2013, Las Vegas, NV USA, pp.1294-1299.
21) 秦红波，宇文惠惠，李望云，张新平,TSV结构微凸点互连热疲劳寿命的研究,2013中国力学大会，西安，CSTAM2013-A31-0842.