2007年 
1) Y.P. Zhang, D.S. Li and X.P. Zhang, Gradient porosity and large pore size NiTi shape memory alloys, Scripta Materialia, 2007, 57: 1020-1023.
2) Y.P. Zhang, C.Y. Chung and X.P. Zhang, Porous titanium-nickel alloys with adjustable porosity fabricated by use of pore-forming agent and conventional sintering, Journal of Materials Science and Engineering, 2007, 25(6): 938-942.
3) Y.P. Zhang, B. Yuan, M.Q. Zeng, C.Y. Chung and X.P. Zhang, High porosity and large pore-size shape memory alloys fabricated by using pore-forming agent (NH4HCO3) and capsule-free hot isostatic pressing, Journal of Materials Processing Technology, 2007, 192: 439-442.
4) X.P. Zhang, C.B. Yu, Y.P. Zhang, S. Shrestha and L. Dorn, Processing treatment of a lead-free Sn-Ag-Cu-Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection, Journal of Materials Processing Technology, 2007, 192: 539-542.
5) X.P. Zhang, C.B. Yu, S. Shrestha and L. Dorn, Creep and fatigue behaviours of the lead-free Sn-Ag-Cu-Bi and Sn60Pb40 solder interconnections at elevated temperatures, Journal of Materials Science: Materials in Electronics, 2007, 18(8): 665-670.
6) 张宇鹏, 张新平, 钟志源，梯度孔隙率与大孔隙尺寸NiTi形状记忆合金制备及其相变和超弹性行为，金属学报，2007, 43(11): 1221-1227.
7) 张新平，张宇鹏，多孔NiTi形状记忆合金研究进展, 材料研究学报, Vol.21, No.6, 2007，1-9.
8) 张新平，于传宝，张宇鹏等，两种无铅钎料的抗蠕变性能与Sn60Pb40钎料的对比分析, 焊接学报, 2007, 28(2): 1-4.
9) 赵克，张新平, 李湘霞等，氧化锆含量对牙科复相铝瓷强度和断裂韧性的影响，华西口腔医学杂志，2007, 25(3): 295-298.
10) Y.P. Zhang, X.P. Zhang and C.Y. Chung, Effects of frequency and phase transition behavior on internal friction of porous Ni50.8Ti49.2 shape memory alloys, The International Conference on Shape Memory and Superelastic Technologies, 3-5 December 2007, Tsukuba, Japan.
11) Y.P. Zhang, C.Y. Chung, D.S. Li and X.P. Zhang, Effects of strain amplitude, thermal dynamic cycle and ageing treatment on internal friction behavior of porous NiTi shape memory alloys, The International Conference on Shape Memory and Superelastic Technologies, 3-5 December 2007, Tsukuba, Japan.

2006年 
1) B. Yuan, X.P. Zhang, C.Y. Chung and M. Zhu, The effect of porosity on phase transformation behavior of porous Ti-50.8at.%Ni shape memory alloys prepared by capsule-free hot isostatic pressing, Materials Science and Engineering, 2006, A438-440: 585-588.
2)B. Yuan, X.P. Zhang, C.Y. Chung, M.Q. Zeng and M. Zhu, A comparative study of the porous TiNi shape memory alloys fabricated by three different processes, Metallurgical and Materials Transactions, 2006, A37: 755-761.
3) X.P. Zhang, C.S. H. Lim, Y.W. Mai and Y.W. Shi, Thermal fatigue and creep fracture behaviors of a nanocomposite solder in microelectronic/optoelectronic packaging, Key Engineering Materials, 2006, 312: 237-242.
4) J.H. Yang, X.P. Zhang, Y.W. Mai and W. Yan, Observation of dislocation microstructures and simulation of stress field during fatigue crack initiation in a copper single crystal, Key Engineering Materials, 2006, 312: 71-76.
5) B. Yuan, C. Y. Chung, X. P. Zhang et al, Superelastic Porous NiTi Shape Memory Alloy Fabricated by Capsule-Free Hot Isostatic Pressing Process, International Conference on Shape Memory and Superelastic Technologies, 7-11 May 2006, Asilomar Conference Grounds Pacific Grove, California USA.
6) Y. P. Zhang, B. Yuan, C. Y. Chung, H. Y. Liu and X. P. Zhang, Superelasticity decay induced by cyclic strain for a porous NiTi shape memory alloy, the International Conference on Structural Integrity and Failure, Sydney, Australia, 27-29 September 2006.

2005年 
1) X.P. Zhang, C.H. Wang, L. Ye and Y.W. Mai, A study of the crack wake closure/opening behavior of short fatigue cracks and its influence on crack growth, Materials Science and Engineering,2005, A406(1-2): 195-204.
2) B. Yuan, C.Y. Chung, X.P. Zhang, M.Q. Zeng and M. Zhu, Control of porosity and superelasticity of porous NiTi shape memory alloys prepared by hot isostatic pressing, Smart Materials and Structures, 2005, 14(5): S210-206.
3) Z.F. Wu, M.Q. Zeng, L.Z. Ouyang, X.P. Zhang and M. Zhu, Ostwald ripening of Pb nanocrystalline phase in mechanically milled Al-Pb alloys and the influence of Cu additive, Scripta Materialia, 2005, 53(5): 529-533.
4) J.H. Yang, X.P. Zhang, Y.W. Mai, W.P. Jia, S.X. Li, Environmental effects on deformation mechanism and dislocation microstructure in fatigued copper single crystal, Materials Science and Engineering, 2005, A396: 403-408.
5) J.H. Yang, X.P. Zhang, Y.W. Mai, W.P. Jia, S.X. Li and W. Ke, Saturation dislocation microstructures of double-slip-oriented copper single crystal during the corrosion fatigue in a 0.5 N NaCl aqueous solution, Journal of Materials Science and Technology, 2005, 21(3): 343-346.
6) X. P. Zhang, Y. W. Mai, Y. W. Shi, S. Shrestha and L. Dorn, Creep fracture fracture behavior of joints soldered by a nano-composite solder, lead-free and conventional Sn-Pb solders,11th International Congress on Fracture (ICF11), Turin, Italy, March 20-25, 2005, 331-.

2004年 
1) X.P. Zhang, H.W. Wang and Y.W. Shi, Influence of elements Bi, Ag and In on surface tension and processing performance of tin-lead based solders, Journal of Materials Science: Materials in Electronics, 2004, 15(8): 511-517.
2) X.P. Zhang and Y.W. Shi, A dissolution model of base metal in liquid brazing filler metal during high temperature brazing, Scripta Materialia, Vol.50, 2004, 1003-1006.
3) X.P. Zhang, S. Galea, L.Ye, Y.W. Mai, Characterization of the effects of applied electric fields on fracture toughness and cyclic electric field induced fatigue crack growth for a piezoceramic PIC151, Smart Materials and Structures, 2004, 13: 9-16.
4) X. P. Zhang, L. Ye, Y.W. Mai and S. Galea, Fatigue crack growth and piezoelectric property decay induced by cyclic electric field for an actuator piezoceramic PIC151, The International Conference on Structural Integrity and Fracture (SIF2004), Brisbane, Australia, 26-29 Sept. 2004,395-400.
5) X. P. Zhang, Y. W. Mai and Y. W. Shi, Characterization of creep behaviours of soldered joints of a nano-composite solder, lead-free Sn-Ag-Bi and Sn60Pb40 solders, The International Conference on Structural Integrity and Fracture (SIF2004), Brisbane, Australia, 26-29 Sept. 2004, 401-405.
6) J. H. Yang, X. P. Zhang, Y. W. Mai et al., Saturation dislocation microstructures in a copper single crystal during the corrosion fatigue in HClO4 aqueous solutions, The International Conference on Structural Integrity and Fracture (SIF2004), Brisbane, Australia, 26-29 Sept. 2004, 381-386.
7) X. P. Zhang, Q. Yuan, W. Ngatimin, J. Whitbourn, L. Ye and Y. W. Mai, Environment effect of natural sisal fibre reinforced epoxy composites manufactured by resin transfer moulding, Composites Technologies for 2020, Proceedings of the 4th Asian-Australasian Conference on Composite Materials (ACCM-4), Sydney, Australia, 6-9 July 2004, 88-93.
8) X. P. Zhang, Y. W. Shi, L. Ye and Y. W. Mai, A tin-based composite solder reinforced by nano-particulates and its soldering ability, Composites Technologies for 2020, Proceedings of the 4th Asian-Australasian Conference on Composite Materials (ACCM-4), Sydney, Australia, 6-9 July 2004, 645-650.