机敏材料与电子封装研究组发表论文
 
发布时间： 2019-07-27 浏览次数： 1059

 机敏材料与电子封装研究组发表论文

2020/21：

1) H. J. Huang, X. Ning, M.B. Zhou, T. Sun, X. Wu, X.P. Zhang, A 3D printable liquid metal-like Ag nanoparticle ink for making super-stretchable and highly cyclic durable strain sensor, ACS Applied Materails and Interface, 2021,13(15):18021–18032.

2) H.J. Huang, X. Wu, M.B. Zhou, X.P. Zhang, Superior strength and strengthening mechanism of die attachment joints by using bimodal-sized Cu nanoparticle paste capable of low-temperature pressureless sintering, Journal of Materials Science: Materials in Electronics, 2021, 32: 3391–3401.

3) H.J. Huang, M.B. Zhou, X.P. Zhang, Extraordinarily enhanced sintering performance of pressureless sinterable Cu nanoparticle paste for achieving robust die-attach bonding by using reducing hybrid solvent, Proceedings of 71th Electronic Components and Technology Conference (ECTC), IEEE, 2021 (in press).

4) B.X. Yang, J.B. Fei, S.B. Liang, M.B. Zhou, W.L. Hu, H.J. Huang, X.P. Zhang, 3D finite element simulation study of chip stacking structure considering different numbers of stacked dies and the effects of underfill and intermetallic compound layer of micro-joints, Proceedings of 71th Electronic Components and Technology Conference (ECTC), IEEE, 2021 (in press).

5) W.L. Hu, J.B. Fei, M.B. Zhou, B.X. Yang, X.P. Zhang, Comprehensive characterization of warpage and fatigue performance of fan-out wafer level package by taking into account the viscoelastic behavior of EMC and the dielectric layer, Proceedings of 71th Electronic Components and Technology Conference (ECTC), IEEE, 2021 (in press).

6) W.K. Le, J.Y. Zhou, C.B. Ke, M.B. Zhou, X.P. Zhang, Study of accelerated shear creep behavior and fracture process of micro-scale ball grid array (BGA) structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electro-thermo-mechanical loads, Journal of Materials Science: Materials in Electronics, 2020, 31: 15575–15588.

7) C. Wei, C.B. Ke, S.B. Liang, S. Cao, H.T. Ma, X.P. Zhang, An improved phase field method by using statistical learning theory-based optimization algorithm for simulation of martensitic transformation in NiTi alloy, Computational Materials Science, 2020, 172: 109292-1–8.

8) Z.X. Zhao, X.Ma, S.Cao, Y.Y. Li,C.Y. Zeng,D.X. Wang, X. Yao, Z.J. Deng, X.P. Zhang, Identification of nano-width variants in a fully monoclinic martensitic Ni50Ti50 alloy by scanning electron microscope-based transmission Kikuchi diffraction and improved groupoid structure approach, Materials Letters, 2020, 281: 128624-1–4.

9) S. Cao, C.Y. Zeng, Y.Y. Li, X. Yao, X. Ma, V. Samaee, D. Schryvers, X.P. Zhang, Quantitative FIB/SEM three-dimensional characterization of a unique Ni4Ti3 network in a porous Ni50.8Ti49.2 alloy undergoing a two-step martensitic transformation, Materials Characterization, 2020, 169: 110595-1–9.

10) E. Zaiser, X.Y. Zhou, A.M. Manzoni, S. Haas, U. Glatzel, X.P. Zhang, G.B. Thompson, W. Li, F. Vogel, Hierarchical phase separation behavior in a Ni-Si-Fealloy, Acta Materialia, 2020, 195: 327–340.

11) J.B. Fei, T. Xu, J.Y. Zhou, C.B. Ke, X.P. Zhang, Interfacial crack initiation and delamination propagation in Cu-filled TSV structure by incorporating cohesive zone model and finite element method, Proceedings of 70th Electronic Components and Technology Conference (ECTC), IEEE, 2020, 1186–1191.

12) J.Y. Zhou, Z. Wang, C. Wei, J.B. Fei, C.B. Ke, X.P. Zhang, Three-dimensional simulation of effects of electro-thermo-mechanical multi- physical fields on Cu protrusion and performance of micro-bump joints in TSVs based high bandwidth memory (HBM) structures, Proceedings of 70th Electronic Components and Technology Conference (ECTC), IEEE, 2020, 1659–1664.

13) H.J. Huang, X. Wu, M. B. Zhou, X.P. Zhang, A highly reliable die bonding approach for high power devices by low temperature pressureless sintering using a novel Cu nanoparticle paste, Proceedings of 70th Electronic Components and Technology Conference (ECTC), IEEE, 2020, 1697–1702.

14)L. Sun, M.B. Zhou, T. Sun, X.P. Zhang, Effects of underfill thickness on mechanical properties and fracture behavior of Si/underfill/Si adhesion structures, Proceedings of 21st International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2020, 271-1–271-4.

 

2019：

1) W.K. Le, X. Ning, C.B. Ke, M.B. Zhou, X.P. Zhang, Current density dependent shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads, Journal of Materials Science: Materials in Electronics, 2019, 30: 15184–15197(DOI: 10.1007/s10854-019-01891-z).

2) S.B. Liang, C.B. Ke, C. Wei, J.Q. Huang, M.B. Zhou,.X.P. Zhang, Microstructural evolution and change inmacroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress, Journal of Materials Research, 2019, 34(16): 2775–2788 (DOI: 10.1557/jmr.2019.201).

3) M.B. Zhou, X.F. Zhao, W. Yue, X.P. Zhang, Unique interfacial reaction and so-induced change in mechanical performance of Sn–3.0Ag–0.5Cu/Cu solder joints formed during undercooled and eutectic liquid soldering processes, Journal of Materials Science: Materials in Electronics, 2019, 30: 4770–4781.

   4) S.B. Liang, C.B. Ke, M.B. Zhou, X.P. Zhang, Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient, Microelectronics Reliability, 2019, 92: 1–11.

   5) S.B. Liang, C.B. Ke, C. Wei, M.B. Zhou, X.P. Zhang, Study of the influence of elastic anisotropy of Cu on thermo-mechanical behavior and Cu protrusion of through silicon vias using combined phase field and finite element methods, IEEE Transactions on Device and Materials Reliability, 2019, 19(2): 322–332 (DOI: 10.1109/TDMR.2019.2911362).

6) C.Y. Zeng, S. Cao, Y.Y. Li, Z.X Zhao, X.Y. Yao, X. Ma, X.P. Zhang, A hidden single-stage martensitic transformation from B2 parent phase to B19’ martensite phase in an aged Ni51Ti49 alloy, Materials Letters, 2019, 253: 99–101.

7) J.Y. Zhou, S.B. Liang, C. Wei, W.K. Le, C.B. Ke, M.B. Zhou, X., Ma, X.P. Zhang, Three-dimensional simulation of the thermo-mechanical interaction between the micro-bump joints and Cu protrusion in Cu-filled TSVs of the high bandwidth memory (HBM) structure, Proceedings of 69th Electronic Components and Technology Conference, IEEE, 28-31 May 2019.

8) C.Y. Zeng, S. Cao, Y.Y. Li, Z.X. Zhao, Z.W. Zhu, D.X. Wang, X. Ma, X.P. Zhang, Two-step constrained aging treatment enabled superior two-way shape memory effect and elevated R-phase transformation temperatures in a rapidly solidified Ni51Ti49 alloy, Journal of Alloys and Compounds, 2019, 785: 1180–1188.

9) Y.T. Yao, S. Liu, M.V. Swain, X.P. Zhang, K. Zhao, Y.T. Jian, Effects of acid-alkali treatment on bioactivity and osteoinduction of porous titanium: aAn in vitro study, Materials Science and Engineering-C, 2019, 94: 200–210.

10) Y.T. Jian, L. Dao, X.D. Wang, X.P. Zhang, M.V. Swain, K. Zhao, Influence of veneer pore defects on fracture behavior of bilayered lithium disilicate glass-ceramic crowns, Dental Materials, 2019, 35(4): e83–e95.

11) 郭丽娜，王晓东，张新平，简裕涛，赵克,代型材料力学性能对磨牙氧化锆全瓷冠断裂失效行为的影响，中华口腔医学研究杂志，2019，13(1): 7–12.

12) 闫丽静，周敏波，赵星飞，凝固条件和应变速率对Sn-58Bi钎料拉伸性能和断裂行为的影响，焊接学报，2019，40(5): 20180131002-1-6. (doi:10.12073/j.hjxb)

13) J.Y. Zhou, S.B. Liang, C. Wei, W.K. Le, C.B. Ke, M.B. Zhou, X., Ma, X.P. Zhang, Three-dimensional simulation of the thermo-mechanical interaction between the micro-bump joints and Cu protrusion in Cu-filled TSVs of the high bandwidth memory (HBM) structure, Proceedings of 69th Electronic Components and Technology Conference (ECTC), IEEE, 2019, 410–416.

14) T. Xu, M.B. Zhou, Z.J. Zhang, X.F. Zhao, X.P. Zhang, Solder size effect on interfacial reaction and growth behavior of Cu-Sn intermetallic compounds in cross-scale Sn3.0Ag0.5Cu/Cu joints between stacking TSV chips during step-reflow processes, Proceedings of 20th International Conference on Electronic Packaging Technology, IEEE, 2019, 268-1–4.

15) W.K. Le, T. Sun, J.Y. Zhou, M.B. Zhou, X.P. Zhang, Effect of loading rate on the shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads, Proceedings of 20th International Conference on Electronic Packaging Technology, IEEE, 2019, 158-1–4.

16)H.J. Huang, X. Wu, X. Ma, M.B. Zhou, X.P. Zhang, A bimodal core-shell structured Cu–Ag nanoparticles based conductive ink capable of low temperature sintering for printed flexible electronics, Proceedings of 20th International Conference on Electronic Packaging Technology, IEEE, 2019, 155-1–4.

17)X. Wu, H.J. Huang, Z.J. Zhang, C.B. Chang, M.B. Zhou, X.P. Zhang, Effects of size distributions of copper nanoparticles on the pressureless bonding performance of the copper paste for die attachment, Proceedings of 20th International Conference on Electronic Packaging Technology, IEEE, 2019, 254-1–4.

18) T. Sun, M.B. Zhou, Z.J. Zhang, X.P. Zhang, Ultrasound-assisted soldering process performance of Sn-Ag-Ti(Ce, Ga) active solders on thin film ZnO substrate, Proceedings of 20th International Conference on Electronic Packaging Technology, IEEE, 2019, 374-1–4.

19) Z.J. Zhang, M.B. Zhou, T. Sun, X. Wu, X.P. Zhang, Influences of Ag and Zn contents on interfacial microstructure and corrosion behavior of Sn–Zn–Ag/6061Al joints in antenna module packages, Proceedings of 20th International Conference on Electronic Packaging Technology, IEEE, 2019, 396-1–4.

20) M.B. Zhou, H.Q. Zhang, X.P. Zhang, W. Yue, Shear strength and fracture behavior of locally-melted hybrid Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu joints under different loading rates, Proceedings of 20th International Conference on Electronic Packaging Technology, IEEE, 2019, 408-1–4.

 

2018：

1) S.B. Liang, C.B. Ke, C. Wei, M.B. Zhou, X.P. Zhang, Phase field modeling of grain boundary migration and preferential grain growth driven by electric current stressing, Journal of Applied Physics, 2018, 124(17), 175109-1-10.

2) J.Q. Huang M.B. Zhou, S.B. Liang and X.P. Zhang, Size effect on the interfacial reaction and microstructural evolution of Sn-ball/Sn3.0Ag0.5Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing temperature, Journal of Materials Science: Materials in Electronics, 2018, 29(9): 7651–7660.

3) W.Y. Li, X.P. Zhang, H.B. Qin, Y.W. Mai, Joule heating dominated fracture behavior change in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads, Microelectronics Reliability, 2018, 82(3): 224–227.

4) W.Y. Li, S. Cao, X.P. Zhang, Novel and facile synthesis of nano SnO2 with various morphologies by electric current stressing, Rare Metal Materials and Engineering, 2018, 47(9): 2647–2651.

5) Y.Y. Li, X.Y. Yao, S. Cao, X. Ma, C.Y. Zeng and X.P. Zhang, An abnormal two-way shape memory effect in a rapidly solidified Ni51Ti49 alloy induced by low temperature constrained aging, Scripta Materialia, 2018, 149:117–120.

6) Z.X. Zhao, X. Ma, S. Cao, C.B. Ke, X.P. Zhang, Anisotropic negative thermal expansion behavior of the as-fabricated Ti-rich and equiatomic Ti-Ni alloys induced by preferential grain orientation, Shape Memory and Superelasticity, 2018, 4(1): 218–223.

7) 韦昭召，马骁，张新平，NiTi合金B2-B19'马氏体相变晶体学的拓扑模拟研究，金属学报，2018, 54(10): 1461–1470.

8) 魏铖，柯常波，马海涛，张新平，基于序参量梯度的改进相场模型及对大尺度体系马氏体相变的模拟研究，金属学报，2018, 54(8): 1204–1214.

9) 马骁，祝星，赵仲勋，曹姗姗，柯常波，张新平，显微组织不均匀性对富Ti含量Ti-Ni 合金负热膨胀行为的影响，中国有色金属学报，2018, 28(3): 446–456.

10) C.Y. Zeng, Z.X. Zhao, Y.Y. Li, S. Cao, X. Ma, X.P. Zhang, Thermal cycling induced instability of martensitic transformation and the micro-mechanism in solution-treated Ni51Ti49 alloy, Proceedings of the International Conference on Martensitic Transformation (ICOMAT), Chicago, 2018, 89–94.

11) Y.Y. Li, C.Y. Zeng, S. Cao, X. Ma and X.P. Zhang, Functional stability of the Ni51Ti49 two-way shape memory alloy as artificial anal sphincter during thermo-mechanical cycling, Proceedings of the International Conference on Martensitic Transformation (ICOMAT), Chicago, 2018, 201–205.

12) S. Cao, Y.Y. Li, C.Y. Zeng, X.P. Zhang, Porous Ni–Ti–Nb shape memory alloys with tunable damping performance controlled by martensitic transformation, Proceedings of the International Conference on Martensitic Transformation (ICOMAT), Chicago, 2018, 275–279.

13) Z.X. Zhao, X. Ma, C.Y. Zeng, S. Cao, C.B. Ke, X.P. Zhang, Reversible negative thermal expansion response and phase transformation behavior of a Ti-rich Ti54Ni46 alloy prepared by rapid solidification, Proceedings of the International Conference on Martensitic Transformation (ICOMAT), Chicago, 2018, 189–193.

14) S.B. Liang, C.B. Ke, C. Wei, M.B. Zhou and X.P. Zhang, Three-Dimensional Simulation of Effects of Microstructure Evolution and Interfacial Delamination on Cu Protrusion in Copper Filled Through Silicon Vias by Combined Monte Carlo and Finite Element Methods. Proceedings of 68th Electronic Components and Technology Conference, IEEE, 29 May–1 June 2018, 2134–2141.

15) S.B. Liang, X.P. Zhang, C. Wei1, C.B. Ke, C.Q. Liu, Interaction effects between the preferred growth of β-Sn grains and thermo-mechanical response in microbump interconnects under thermal cycling, Electronics System-integration Technology Conference, 18-21 September 2018, Dresden, 179-1-7.

16) W.Y. Li and X.P. Zhang, Low and cryogenic temperature mechanical performance and fracture behavior of micro-scale Cu/Sn–3.0 Ag–0.5 Cu/Cu joints with the decreasing dimension, Proceedings of 19th International Conference on Electronic Packaging Technology, IEEE, Shanghai, 8–11 August 2018, 324–328.

17) Q.W. Chen, X. Ma, H.J. Huang, C. Yin, M.B. Zhou, X.P. Zhang, Tin nanoparticles modified nano-silver paste for pressureless low-temperature sintering process, Proceedings of 19th International Conference on Electronic Packaging Technology, IEEE, Shanghai, 8–11 August 2018, 356–360.

18) J.Y. Zhou, C. Wei, S.B. Liang, X. Ma, X.P. Zhang, Three-dimensional simulation of the effects of Cu protrusion of Cu-filled TSVs on thermal fatigue behavior of micro-bump joints in 3D integration, Proceedings of 19th International Conference on Electronic Packaging Technology, IEEE, Shanghai, 8–11 August 2018, 361–366.

19) S.B. Liang, C.B. Ke, C. Wei, M.B. Zhou, X.P. Zhang, Phase field study of the combined effects of electromigration and thermomigration on phase segregation and physical properties of Sn58Bi solder joints under electric current stressing coupled with temperature gradient, Proceedings of 19th International Conference on Electronic Packaging Technology, IEEE, Shanghai, 8–11 August 2018, 376–382.

20) J.G. Li, X. Ma, M.B. Zhou, X. Ning, X.P. Zhang, Effects of Sb addition on the microstructure and mechanical performance of Sn58Bi based alloys and the solder joints, Proceedings of 19th International Conference on Electronic Packaging Technology, IEEE, Shanghai, 8–11 August 2018, 457–461.

21) H.J. Huang, M.B. Zhou, C. Yin, Q.W. Chen, X.P. Zhang, Preparation of a low temperature sintering silver nanoparticle ink and fabrication of conductive patterns on PET substrate, Proceedings of 19th International Conference on Electronic Packaging Technology, IEEE, Shanghai, 8–11 August 2018, 482–485.

22) H.J. Huang, M.B. Zhou, C. Yin, Q.W. Chen, X.P. Zhang, Fabrication of oxidation-resistant submicron copper particles and the conductive ink as well as its sintering behavior on the flexible substrate, Proceedings of 19th International Conference on Electronic Packaging Technology, IEEE, Shanghai, 8–11 August 2018, 491–495.

23) J.Q. Huang, M.B. Zhou, X.F. Zhao, X.P. Zhang, Effect of electromigration on the microstructural evolution and shear fracture behavior of mixed assembled Cu/Sn–3.0Ag–0.5 Cu-ball/Sn–58Bi-paste/Cu joints in board-level packaging, Proceedings of 19th International Conference on Electronic Packaging Technology, IEEE, Shanghai, 8–11 August 2018, 531–535.

24) X. Ning X, M.B. Zhou, J.G. Li, X.P. Zhang, Effect of some N-heterocyclic inhibitors in the soldering flux on the corrosion behavior of eutectic Sn–58Bi alloy and its solder paste, Proceedings of 19th International Conference on Electronic Packaging Technology, Shanghai, 8–11 August 2018, 540–545.

25) X.F. Zhao, M.B. Zhou, T. Sun, X.P. Zhang, Size effect on the interfacial reaction and IMC growth of Sn–3.0 Ag–0.5 Cu/Cu joints with the decreasing joint size to several tens of microns during reflowing soldering, Proceedings of 19th International Conference on Electronic Packaging Technology, Shanghai, 8–11 August 2018, 562–565.

26) W. K. Le, X. Ning X, J.Q. Huang, M.B. Zhou, X.P. Zhang, Effect of electric current stressing on the shear strength and fracture behavior of micro-scale BGA structured Cu/Sn–3.0 Ag–0.5 Cu/Cu joints, Proceedings of 19th International Conference on Electronic Packaging Technology, Shanghai, 8–11 August 2018, 610–614.

27)  W.K. Le, Z.W. Zhu, S.S. Cao, X.P. Zhang,, Shear creep and fracture behavior of micro-scale BGA structured Cu/Sn–3.0 Ag–0.5 Cu/Cu joints under electro-thermo-mechanical coupled loads, Proceedings of 19th International Conference on Electronic Packaging Technology, Shanghai, 8–11 August 2018, 620–624.

28) H. Jiang, M.B. Zhou, X.P. Zhang, Study of the curing kinetics and heat resistance of isotropic conductive adhesive, Proceedings of 19th International Conference on Electronic Packaging Technology, IEEE, Shanghai, 8–11 August 2018, 633–637.

29) K. Wang , G. L. Chen, M.B. Zhou, X.P. Zhang, A cost-effective and high performance assembly technology for interconnecting the Cu/Al bilayer electrode and lead wire of ZnO varistor using a low Ag-containing solder paste, Proceedings of 19th International Conference on Electronic Packaging Technology, IEEE, Shanghai, 8–11 August 2018, 642–647.

30) W. Yue, M.B. Zhou, X.P. Zhang, Influence of solder ball volume on mechanical shock reliability of right-angle solder interconnects, Proceedings of 19th International Conference on Electronic Packaging Technology, IEEE, Shanghai, 8–11 August 2018, 1472–1475.

 

2017：

1) Y.Y. Li, S.S. Cao, X. Ma, C.B. Ke, X.P. Zhang, Influence of strongly textured microstructure on the all-round shape memory effect of rapidly solidified Ni51Ti49 alloy, Materials Science and Engineering-A, 2017, 705: 273–281.

2) S.B. Liang, C.B. Ke, W.J. Ma, M.B. Zhou, X.P. Zhang, Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects, Microelectronics Reliability, 2017, 71(4): 71–81.

3) Y.Y. Li, X.Y. Yao, S.S. Cao, X. Ma, C.B. Ke, X.P. Zhang, Rapidly solidified and optimally constraint-aged Ni51Ti49 shape memory alloy aiming at making a purpose-designed bio-actuator, Materials and Design, 2017, 118: 99–106.

4) Y.T Jian, Z.H. He, L. Dao, M.V. Swain, X.P. Zhang, K. Zhao, Three-dimensional characterization and distribution of fabrication defects in bilayered lithium disilicate glass-ceramic molar crowns, Dental Materials, 2017, 33: e178–e185.

5) W.J. Ma, C.B. Ke, S.B. Liang, M.B. Zhou and X.P. Zhang. Morphological evolution and growth kinetics of Kirkendall voids in a binary alloy system during deformation process — A phase field crystal simulation study, Transactions of the Nonferrous Metals Society of China, 2017, 27(3): 599–607.

6) J.Q. Huang, M.B. Zhou and X.P. Zhang. The melting characteristics and interfacial reactions of Sn-ball/Sn–3.0Ag–0.5Cu-paste/Cu joints during reflow soldering, Journal of Electronic Materials, 2017, 46(3): 1504–1515.

7) S.B. Liang, C.B. Ke, B. Li, H. Jiang, M.B. Zhou and X.P. Zhang, Microstructure simulation and thermo-mechanical behavior analysis of copper filled through silicon vias using coupled phase field and finite element methods, Proceedings of 67th Electronic Components & Technology Conference, IEEE, Lake Buena Vista, 2017, 1599–1604.

8) Z. Zhou, X. Ma, M.B. Zhou, C. Yin and X.P. Zhang, Effect of isothermal aging on mechanical properties and strain rate sensitivity of the eutectic Sn-58Bi solder alloy, Proceedings of 18th International Conference on Electronic Packaging Technology, IEEE, Harbin, 2017, 1586–1591.

9) C. Yin, H. Jin, Z. Zhou, M.B. Zhou and X.P. Zhang, Processing and electrical properties of sodium citrate capped silver nanoparticle based inks for flexible electronics, Proceedings of 18th International Conference on Electronic Packaging Technology, IEEE, Harbin, 2017, 1572–1576.

10) J.Q. Huang, M.B. Zhou, X.F. Zhao and X.P. Zhang, Microstructures and shear properties of mixed assembly BGA structure SnAgCu/SnBi(Ag)/Cu joints in board-level packaging, Proceedings of 18th International Conference on Electronic Packaging Technology, IEEE, Harbin, 2017, 1649–1654.

11) H. Jiang, M.B. Zhou, J.F. Zhu and X.P. Zhang, Preparation of core-shell structured  SiO2@Ag spheres and their role in improving micro-sized Ag flake filled electrically  conductive adhesive for LED packaging, Proceedings of 18th International Conference on Electronic Packaging Technology, IEEE, Harbin, 2017, 1607–1611.

12) S.B. Liang, C. Wei, C.B. Ke, M.B. Zhou and X.P. Zhang, Microstructure simulation and thermo-mechanical behavior analysis of Cu-filled through silicon vias (TSVs) using combined Monte Carlo and finite element method, Proceedings of 18th International Conference on Electronic Packaging Technology, IEEE, Harbin, 2017, 1617–1622.

13) S.B. Liang, C.B. Ke, M.B. Zhou and X.P. Zhang, Coupled finite element and phase field modeling of void evolution and physical property change of micro flip-chip solder joints under electromigration and elastic stress field, Proceedings of 18th International Conference on Electronic Packaging Technology, IEEE, Harbin, 2017, 1631–1636.

14)W.Y. Li, M.B. Zhou, X.P. Zhang, Abnormal creep behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints with different joint thicknesses under electro-thermo-mechanical coupled loads, Proceedings of 18th International Conference on Electronic Packaging Technology, IEEE, Harbin, 2017, 1642–1648.

15) M.B. Zhou, X.F. Zhao, W. Yue, C.B. Ke and X.P. Zhang, Size and boundary effects on the  growth  and morphology evolution of interfacial intermetallic compound of Sn0.3Ag0.7Cu/Cu micro-bump joints, Proceedings of 18th International Conference on Electronic Packaging Technology, IEEE, Harbin, 2017, 1667–1671.

16) W. Yue, M.B. Zhou, X.P. Zhang, Reliablity and failure analysis of electronic components induced by the reflection of laser beam in the laser jet solder ball bonding process, Proceedings of 18th International Conference on Electronic Packaging Technology, IEEE, Harbin, 2017, 1658–1662.

 

2016:

1) W.Y. Li, H. Jin, W. Yue, M.Y. Tan and X.P. Zhang. Creep behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads, Journal of Materials Science: Materials in Electronics, 2016, 27(12): 13022–13033.

2)  X.Y. Yao, B. Amin-Ahmadi, Y.Y. Li, S.S. Cao, X. Ma, X.P. Zhang, D. Schryvers, Optimization of automated crystal orientation mapping in a TEM for Ni4Ti3 precipitation in all-round SMA, Shape Memory and Superelasticity, 2016, 4(2): 286–297.

3) 李望云, 秦红波, 周敏波, 张新平. 电-力耦合作用下Cu/Sn-3.0Ag-0.5Cu/Cu微焊点的拉伸力学性能和断裂行为, 机械工程学报, 2016, 52(10): 46–53.

4) S.B. Liang, C.B. Ke, W.J. Ma, M.B. Zhou and X.P. Zhang. Phase field simulation of segregation of the Bi-riched phase in Cu/Sn-Bi/Cu solder interconnects under electric current stressing. Proceedings of 66th Electronic Components & Technology Conference, IEEE, Las Vegas, 2016, 264–270.

5) M.B. Zhou, J.Q. Feng, W. Yue and X.P. Zhang, Interfacial reaction and IMC growth between the undercooled liquid lead-free solder and Cu metallization, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 1023–1027.

6) H.H. Yuwen and X.P. Zhang. Numerical simulation of the TSV-Cu filling by electroplating process with the accelerator and suppressor, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 721–726.

7) H. Jiang, S.B. Liang, H.H. Yuwen and X.P. Zhang. Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 947–952.

8) J.Q. Huang, M.B. Zhou, W.Y. Li and X.P. Zhang. Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on BGA packaging, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 1010–1014.

9) W.Y. Li, S.S. Cao and X.P. Zhang. Creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan,  2016, 988–993.

10) J.Q. Huang, M.B. Zhou and X.P. Zhang. Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 968–973.

11) S.B. Liang, C.B. Ke, M.Y. Tan, M.B. Zhou and X.P. Zhang. Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 836–840.

12) W.Y. Li, S.S. Cao and X.P. Zhang. Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 860–864.

13) W.J. Ma, C.B. Ke, M.B. Zhou and X.P. Zhang. Phase field crystal simulation of morphological evolution and propagation of microcracks in the intermetallic compound layer of Sn/Cu solder interconnects, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 963–967.

14) S.B. Liang, C.B. Ke, M.B. Zhou and X.P. Zhang. Phase field simulation of morphological evolution and migration of the microvoid in small scale solder interconnects driven by temperature gradient, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 953–957.

15) H. Jin, J.F. Zhu, M.B. Zhou and X.P. Zhang. Fabrication of a hybrid paste consisting of microscale Ag-plated Cu flakes and nanoscale Ag particles and characterization of low-temperature sintered hybrid paste joints, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 927–932.

16) Y.J. Lin, M.B. Zhou, X. Ma and X.P. Zhang. Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al solder joints in packages of LED lighting components and structures, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 1028–1032.

17) M.Y. Tan, M.B. Zhou, J.Q. Huang, F.Q. Ma, X. Ma and X.P. Zhang. Dynamic wetting behavior and solder ball spattering formation of Sn-Bi solder pastes during reflow soldering process, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 974–978.

18) J.F. Zhu, H. Jin, M.B. Zhou and X.P. Zhang. Electrical property of electrically conductive adhesives filled with micro-sized Ag flakes and modified by dicarboxylic acids, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 923–926.

19) L. Zhang, M.B. Zhou, F.S. Qiu, X. Ma and X.P. Zhang. Effects of flux activators and processing parameters on solderability and stability of the aluminum solder paste used for automated assembly of LED lighting components, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 905–909.

20) G.L. Chen, M.B. Zhou, L. Zhang, Y.J. Lin, Y.P. Zhang and X.P. Zhang. Influence of the zinc-oxide/salt content in the aluminum soldering flux on interfacial microstructure and mechanical property of Sn-0.7Cu/Al joints in assembling LED lighting components, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 958–962.

21) W. Yue, M.B. Zhou, X.P. Zhang, Effect of the Au bonding pad contamination on the wettability of Au/Sn-3.0Ag-0.5Cu/Au solder joints in flux-free laser jet solder ball bonding process, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 1201–1205.

 

2015:  

1) H.B. Qin, X.P. Zhang, M. B. Zhou, X.P. Li, Y.-W. Mai, Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, Microelectronics Reliability, 2015, 55(8):1214-1225 (doi:10.1016/j.microrel.2015.05.013).

2) C.B. Ke, S.S. Cao, X.P. Zhang, Phase field simulation of coherent precipitation of Ni4Ti3 particles during stress-assisted aging of a porous NiTi alloy, Modelling and Simulation in Materials Science and Engineering, 2015, 23: 055008(1-20).

3) S. Cao, Y. Li, X. Ma, X.Y. Yao, X.P. Zhang, Quantitative characterization of pore configuration in a porous Ni50.8a.t.%-Ti SMA, Materials Today: Proceedings, 2015, 2S:S921-S924 (DOI 10.1016/j.matpr.2015.07.432).

4) C.B. Ke, S.S. Cao, X.P. Zhang, Phase field modeling of Ni-concentration distribution behavior around Ni4Ti3 precipitates in NiTi alloys, Computational Materials Science, 2015, 105: 55-65.

5) X. Yao, S. Cao, X.P. Zhang, D. Schryvers, Microstructural characterization and transformation behavior of porous Ni50.8Ti49.2, Materials Today: Proceedings, 2015, 2: S833–S836

6) Y.T. Jian, Y. Yang, T. Tian, X.P. Zhang, K. Zhao, Effect of pore size and porosity on the biomechanical properties and cytocompatibility of porous NiTi alloys, PLoS ONE, 2015, 10(6): e0128138. (doi:10.1371/journal.pone.0128138)

7) Z.L. Tang, S.S. Cao, X.P. Zhang, Improvement of microstructure and mechanical properties of a low alloy cast steel processed by direct quenching-partitioning-tempering technique, Steel Research International, 2015, 86(4): 429-435 (DOI: 10.1002/srin.201400244)

8) 马文婧，柯常波，周敏波，梁水保，张新平，Sn/Cu互连体系界面和金属间化合物层Kirkendall空洞演化和生长动力学的晶体相场法模拟，金属学报，2015, 51(7): 873-882. 

9) X. Ma, J.P. Luo, S.S. Cao and X.P. Zhang, Design, fabrication and characterization of porous Ti-rich Ti-Ni alloy based composites with near-zero thermal expansion behavior, Poster presentation at the 10th European Symposium on Martensitic Transformations (ESOMAT2015), 14-18 September 2015, Antwerp, Belgium.

10) X. Ma, Y.Y. Li, L.H. Guo, X.Y. Yao, S.S. Cao and and X.P. Zhang, Two-way shape memory NiTi alloy stripes with small transformation hysteresis prepared by rapid solidification and constrained aging, Poster presentation at the 10th European Symposium on Martensitic Transformations (ESOMAT2015), 14-18 September 2015, Antwerp, Belgium.

11) X.Y. Yao, Y.Y. Li, S Cao. X. Ma, X.P. Zhang, D. Schryvers, Ni4Ti3 Investigation in an ARSMA using ASTAR orientation imaging microscopy and phase mapping, Oral presentation at the 10th European Symposium on Martensitic Transformations (ESOMAT2015), 14-18 September 2015, Antwerp, Belgium.

12) X.Y. Yao, Y.Y. Li, S Cao. X. Ma, X.P. Zhang, D. Schryvers, Optimization of automated crystal orientation and phase mapping in TEM applied to Ni-Ti all round shape memory alloy. Poster presentation at the 10th European Symposium on Martensitic Transformations (ESOMAT2015), 14-18 September 2015, Antwerp, Belgium.

13) S.B. Liang, C.B. Ke, M.B. Zhou and X.P. Zhang, Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulation, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 260-265.

14) W.J. Ma, C.B. Ke, S.B. Liang, M.B. Zhou and X.P. Zhang, Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic compound layer of Sn/Cu soldering system under cyclic loading, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 301-306.

15) H.H. Yuwen, H.B. Qin, M.B. Zhou and X.P. Zhang, The interfacial thermo-mechanical reliability of 3D memory-chip stacking with through silicon via array, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 568-573.

16) J.Q. Huang, M.B. Zhou, W.Y. Li and X.P. Zhang, Interfacial reactions and formation of intermetallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 307-311.

17) W.Y. Li, M.B. Zhou, X.P. Zhang, Creep behavior of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under tensile stress coupled with DC current stressing, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 187-192.

18) M.B. Zhou, H. Jin, C.B. Ke and X.P. Zhang, Quasi in-situ study of morphological evolution of the interfacial IMC in single-sided interface Sn-0.3Ag-0.7Cu/Cu joints during multiple reflow process, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 333-337.

19) M.B. Zhou, L.B. Zhou, L. Zhang, F.S. Qiu, X. Ma and X.P. Zhang, Influence of metal-oxide/salt content in the aluminum soldering flux on solderability and corrosion resistance of Sn-0.7Cu/6061Al joints, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 323-327.

20) H.B. Qin, W. Yue, X.P. Zhang and D.G. Yang, Size and geometry effects on the electromigration behavior of flip-chip Sn3.5Ag solder joints, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 651-655.
 21) W. Yue and X.P. Zhang, Essential factors influencing the wettability of Sn-3.0Ag-0.5Cu solder balls on Au pad of the right-angle solder interconnect in laser jet solder ball bonding, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 930-934.