2016

1) W.Y. Li, H. Jin, W. Yue, M.Y. Tan and X.P. Zhang. Creep behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads, Journal of Materials Science: Materials in Electronics, 2016, 27(12): 13022–13033.
2)  X.Y. Yao, B. Amin-Ahmadi, Y.Y. Li, S.S. Cao, X. Ma, X.P. Zhang, D. Schryvers, Optimization of automated crystal orientation mapping in a TEM for Ni4Ti3 precipitation in all-round SMA, Shape Memory and Superelasticity, 2016, 4(2): 286–297.
3) 李望云, 秦红波, 周敏波, 张新平. 电-力耦合作用下Cu/Sn-3.0Ag-0.5Cu/Cu微焊点的拉伸力学性能和断裂行为, 机械工程学报, 2016, 52(10): 46–53.
4) S.B. Liang, C.B. Ke, W.J. Ma, M.B. Zhou and X.P. Zhang. Phase field simulation of segregation of the Bi-riched phase in Cu/Sn-Bi/Cu solder interconnects under electric current stressing. Proceedings of 66th Electronic Components & Technology Conference, IEEE, Las Vegas, 2016, 264–270.
5) M.B. Zhou, J.Q. Feng, W. Yue and X.P. Zhang, Interfacial reaction and IMC growth between the undercooled liquid lead-free solder and Cu metallization, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 1023–1027.
6) H.H. Yuwen and X.P. Zhang. Numerical simulation of the TSV-Cu filling by electroplating process with the accelerator and suppressor, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 721–726.
7) H. Jiang, S.B. Liang, H.H. Yuwen and X.P. Zhang. Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 947–952.
8) J.Q. Huang, M.B. Zhou, W.Y. Li and X.P. Zhang. Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on BGA packaging, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 1010–1014.
9) W.Y. Li, S.S. Cao and X.P. Zhang. Creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan,  2016, 988–993.
10) J.Q. Huang, M.B. Zhou and X.P. Zhang. Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 968–973.
11) S.B. Liang, C.B. Ke, M.Y. Tan, M.B. Zhou and X.P. Zhang. Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 836–840.
12) W.Y. Li, S.S. Cao and X.P. Zhang. Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 860–864.
13) W.J. Ma, C.B. Ke, M.B. Zhou and X.P. Zhang. Phase field crystal simulation of morphological evolution and propagation of microcracks in the intermetallic compound layer of Sn/Cu solder interconnects, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 963–967.
14) S.B. Liang, C.B. Ke, M.B. Zhou and X.P. Zhang. Phase field simulation of morphological evolution and migration of the microvoid in small scale solder interconnects driven by temperature gradient, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 953–957.
15) H. Jin, J.F. Zhu, M.B. Zhou and X.P. Zhang. Fabrication of a hybrid paste consisting of microscale Ag-plated Cu flakes and nanoscale Ag particles and characterization of low-temperature sintered hybrid paste joints, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 927–932.
16) Y.J. Lin, M.B. Zhou, X. Ma and X.P. Zhang. Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al solder joints in packages of LED lighting components and structures, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 1028–1032.
17) M.Y. Tan, M.B. Zhou, J.Q. Huang, F.Q. Ma, X. Ma and X.P. Zhang. Dynamic wetting behavior and solder ball spattering formation of Sn-Bi solder pastes during reflow soldering process, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 974–978.
18) J.F. Zhu, H. Jin, M.B. Zhou and X.P. Zhang. Electrical property of electrically conductive adhesives filled with micro-sized Ag flakes and modified by dicarboxylic acids, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 923–926.
19) L. Zhang, M.B. Zhou, F.S. Qiu, X. Ma and X.P. Zhang. Effects of flux activators and processing parameters on solderability and stability of the aluminum solder paste used for automated assembly of LED lighting components, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 905–909.
20) G.L. Chen, M.B. Zhou, L. Zhang, Y.J. Lin, Y.P. Zhang and X.P. Zhang. Influence of the zinc-oxide/salt content in the aluminum soldering flux on interfacial microstructure and mechanical property of Sn-0.7Cu/Al joints in assembling LED lighting components, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 958–962.
21) W. Yue, M.B. Zhou, X.P. Zhang, Effect of the Au bonding pad contamination on the wettability of Au/Sn-3.0Ag-0.5Cu/Au solder joints in flux-free laser jet solder ball bonding process, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, Wuhan, 2016, 1201–1205.

2015 
1) H.B. Qin, X.P. Zhang, M. B. Zhou, X.P. Li, Y.-W. Mai, Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, Microelectronics Reliability, 2015, 55(8):1214-1225 (doi:10.1016/j.microrel.2015.05.013).
2) C.B. Ke, S.S. Cao, X.P. Zhang, Phase field simulation of coherent precipitation of Ni4Ti3 particles during stress-assisted aging of a porous NiTi alloy, Modelling and Simulation in Materials Science and Engineering, 2015, 23: 055008(1-20).
3) S. Cao, Y. Li, X. Ma, X.Y. Yao, X.P. Zhang, Quantitative characterization of pore configuration in a porous Ni50.8a.t.%-Ti SMA, Materials Today: Proceedings, 2015, 2S:S921-S924 (DOI 10.1016/j.matpr.2015.07.432).
4) C.B. Ke, S.S. Cao, X.P. Zhang, Phase field modeling of Ni-concentration distribution behavior around Ni4Ti3 precipitates in NiTi alloys, Computational Materials Science, 2015,  105: 55-65.
5) Y.T. Jian, Y. Yang, T. Tian, X.P. Zhang, K. Zhao, Effect of pore size and porosity on the biomechanical properties and cytocompatibility of porous NiTi alloys, PLoS ONE, 2015, 10(6): e0128138. (doi:10.1371/journal.pone.0128138)
6) Z.L. Tang, S.S. Cao, X.P. Zhang, Improvement of microstructure and mechanical properties of a low alloy cast steel processed by direct quenching-partitioning-tempering technique, Steel Research International, 2015, 86(4): 429-435 (DOI: 10.1002/srin.201400244)
7) 马文婧，柯常波，周敏波，梁水保，张新平，Sn/Cu互连体系界面和金属间化合物层Kirkendall空洞演化和生长动力学的晶体相场法模拟，金属学报，2015, 51(7): 873-882.
8) X. Ma, J.P. Luo, S.S. Cao and X.P. Zhang, Design, fabrication and characterization of porous Ti-rich Ti-Ni alloy based composites with near-zero thermal expansion behavior, Poster presentation at the 10th European Symposium on Martensitic Transformations (ESOMAT2015), 14-18 September 2015, Antwerp, Belgium.
9) X. Ma, Y.Y. Li, L.H. Guo, X.Y. Yao, S.S. Cao and and X.P. Zhang, Two-way shape memory NiTi alloy stripes with small transformation hysteresis prepared by rapid solidification and constrained aging, Poster presentation at the 10th European Symposium on Martensitic Transformations (ESOMAT2015), 14-18 September 2015, Antwerp, Belgium.
10) X.Y. Yao, Y.Y. Li, S Cao. X. Ma, X.P. Zhang, D. Schryvers, Ni4Ti3 Investigation in an ARSMA using ASTAR orientation imaging microscopy and phase mapping, Oral presentation at the 10th European Symposium on Martensitic Transformations (ESOMAT2015), 14-18 September 2015, Antwerp, Belgium.
11) X.Y. Yao, Y.Y. Li, S Cao. X. Ma, X.P. Zhang, D. Schryvers, Optimization of automated crystal orientation and phase mapping in TEM applied to Ni-Ti all round shape memory alloy. Poster presentation at the 10th European Symposium on Martensitic Transformations (ESOMAT2015), 14-18 September 2015, Antwerp, Belgium.
12) S.B. Liang, C.B. Ke, M.B. Zhou and X.P. Zhang, Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulation, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 260-265.
13) W.J. Ma, C.B. Ke, S.B. Liang, M.B. Zhou and X.P. Zhang, Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic compound layer of Sn/Cu soldering system under cyclic loading, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 301-306.
14) H.H. Yuwen, H.B. Qin, M.B. Zhou and X.P. Zhang, The interfacial thermo-mechanical reliability of 3D memory-chip stacking with through silicon via array, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 568-573.
15) J.Q. Huang, M.B. Zhou, W.Y. Li and X.P. Zhang, Interfacial reactions and formation of intermetallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 307-311.
16) W.Y. Li, M.B. Zhou, X.P. Zhang, Creep behavior of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under tensile stress coupled with DC current stressing, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 187-192.
17) M.B. Zhou, H. Jin, C.B. Ke and X.P. Zhang, Quasi in-situ study of morphological evolution of the interfacial IMC in single-sided interface Sn-0.3Ag-0.7Cu/Cu joints during multiple reflow process, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 333-337.
18) M.B. Zhou, L.B. Zhou, L. Zhang, F.S. Qiu, X. Ma and X.P. Zhang, Influence of metal-oxide/salt content in the aluminum soldering flux on solderability and corrosion resistance of Sn-0.7Cu/6061Al joints, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 323-327.
19) H.B. Qin, W. Yue, X.P. Zhang and D.G. Yang, Size and geometry effects on the electromigration behavior of flip-chip Sn3.5Ag solder joints, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 651-655.
20) W. Yue and X.P. Zhang, Essential factors influencing the wettability of Sn-3.0Ag-0.5Cu solder balls on Au pad of the right-angle solder interconnect in laser jet solder ball bonding, 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11-14 August 2015, 930-934.