Micro & Nano Electronics Platform

Relying on strong support from national key programs, Guangdong Province, and the Guangzhou International Campus, the School of Integrated Circuits and School of Microelectronics at South China University of Technology has established a fully open, domestically leading Micro & Nano Electronics Platform. The platform covers a total area of 3,200 square meters, including 1,729 square meters of cleanroom space, and houses major scientific equipment valued at approximately 378 million RMB.

Catering to research and development needs in multiple interdisciplinary fields such as RF chips, intelligent sensing, AI chips, optoelectronic integration, and power electronics, the platform is equipped with 282 units/sets of equipment, including 151 large-scale instruments (≥400,000 RMB each), comprising:

1. Micro & Nano Fabrication Equipment (47 units): Comprehensive micro-nano fabrication tools, including lithography systems (electron beam lithography, direct laser writing lithography, focused ion beam, two-photon lithography, double-sided mask aligner), etching systems (inductively coupled plasma etcher, reactive ion etcher, ion beam etcher, dry etching), and thin film deposition systems (magnetron sputtering, electron beam evaporation, ALD, MOCVD, piezoelectric film deposition, MPECVD diamond deposition, LPCVD, PECVD, PLD).

2. Chip Testing Equipment (49 units): Internationally advanced chip testing equipment covering a wide frequency range from RF to millimeter-wave to terahertz (110 GHz network analyzer, signal generator, signal analyzer, high-frequency oscilloscope, spectrum analyzer, ultra-wideband MIMO system, 5G wireless test platform, millimeter-wave load-pull system, microwave probe station, etc.).

3. Micro-Nano Device Testing Equipment (35 units): Comprehensive instruments for testing the electrical, optical, magnetic, acoustic, and other multi-physical properties of micro-nano devices (semiconductor parameter analyzer, deep level transient spectroscopy, photocurrent testing system, infrared detection instruments, power device testing equipment, noise analyzer, low-temperature magnetic field high-frequency testing system, memristor performance testing system, etc.).

4. Micro-System Packaging Equipment (10 units): High-end wafer-level alignment and packaging tools (double-sided mask aligner, wafer bonder, chemical mechanical polishing system, wire bonder, wafer dicing system), providing robust hardware support for system integration technology development.

5. Micro-Nano Electronics Simulation Software & Equipment (10 units): Advanced software and hardware platforms (DTCO design platform, logic equivalence verification tools, digital IC front-end/back-end design tools, FPGA development board, hardware simulation acceleration platform), effectively supporting R&D in integrated circuit design.

Cotact Information

For Business Collaboration Inquiries: Mr. Qian （qiancb@scut.edu.cn） Prof. Zhou （zhoucj@scut.edu.cn）

For Process and Fabrication Equipment: Mr. Jiang（jiangchao@scut.edu.cn）

For Chip and Device Testing Equipment: Mr. Wu （wuyouheng@scut.edu.cn）