Title: A Law Made To Be Broken
Time: 16:00-17:30, May 12, 2025
Location: B1-c101 Meeting Room, International Campus
Speaker: Dr. Chuan Hu
Abstract:Moore's Law stands as a marvel in the development of human civilization. Since the invention of the transistor in 1947, transistor integration density has increased by 11 orders of magnitude (from the Blackwell 200 to 208B). However, as transistor scaling approaches physical limits, packaging technology—a critical element in extending the vitality of Moore's Law—is transitioning from the background to the forefront, becoming a new engine driving leaps in integrated circuit performance. Over the next two decades, advanced packaging technologies centered on heterogeneous integration are expected to achieve at least a thousandfold performance gain to meet the growing demands for computing power, bandwidth, and energy efficiency.
This presentation will examine the developmental journey of packaging technology, focusing on collaborative mechanisms among government bodies, research institutions, industry players, enterprises, and universities. It will analyze how such collaborations drive the advancement of packaging technology and facilitate the industry's shift from computing-centric to bandwidth-centric paradigms. By reviewing significant historical innovation attempts, we will distill the core value and future growth opportunities of packaging technology, offering historical insights and guiding trends. The presentation will also discuss key challenges and potential solutions for future industry development.
Speaker Biography:Dr. Chuan Hu is a researcher, having earned his undergraduate degree from the Department of Physics at Peking University in 1992 and his Ph.D. from the University of Texas in 2000. As a national specially appointed expert and a recipient of the State Council Special Allowance, he participated in the 70th National Day parade and was an invited speaker at the Peking University School of Physics graduation ceremony in 2019.
From 2001 to 2014, Dr. Hu worked at Intel's Fundamental Materials Research Institute (as the only Chinese researcher at the institute), where he was responsible for developing packaging processes that were 6 to 10 years ahead of the industry. He also served as an industry mentor at the DARPA/SRC Interconnect Focus Center (2002–2012), laying the groundwork for the industrialization of heterogeneous integration technologies and establishing extensive collaborations with over 50 universities and hundreds of enterprises worldwide.
In 2018, Dr. Hu joined the Institute of Semiconductors at the Guangdong Academy of Sciences, dedicating himself to advancing the industrialization of heterogeneous integration. He successfully established the Guangdong Heterogeneous Integration Engineering Center. To date, he has published over 50 academic papers in fields such as thermal conduction, electronic packaging, reliability, nanomaterials, and extreme ultraviolet lithography, and holds nearly 200 international patents widely applied in products ranging from smartphones (e.g., Apple A-series processors) and PCs (Intel CPUs) to supercomputers (Tesla Dojo). Additionally, the company founded by Dr. Hu recently completed its Pre-A round of funding, led by the Xinchao Group, further accelerating the commercialization of its scientific and technological achievements.
