丰光银 Feng Guangyin

基本信息

职称:微电子学院副教授、博导、硕导

Title: Associate Professor, Doctoral & Graduate Supervisor, School of Microelectronics   

联系方式:gyfeng88@scut.edu.cn

招生专业

个人简介

丰光银,新加坡南洋理工大学博士,华南理工大学微电子学院副教授(硕导、博导),担任广东省智能通感融合芯片重点实验室常务副主任,兼任鹏城实验室联合培养博士专项计划的博士生导师;曾先后在南洋理工大学和华为新加坡研究院担任博士后研究员和资深工程师。其以新一代信息技术的产业需求为牵引,专注于硅基毫米波前端芯片设计、高能效收发机架构、通感一体化等方面的理论和技术研究;主持或参与科技部国家重点研发计划青年科学家项目、国家自然科学基金面上项目、广东省自然科学基金面上项目等10余项;在毫米波宽带放大器、低功耗毫米波接收机、毫米波雷达收发机、以及亚太赫兹高速通信收发机方向积累了较为丰富的研究经验和科研成果;发表SCI/EI论文70余篇,包含3篇集成电路领域顶级期刊论文JSSC,1篇顶级会议论文ISSCC;授权中国发明专利9项,美国发明专利1项,科研成果转化1项;曾获新加坡经济发展局集成电路设计专项奖学金、粤港澳大湾区高价值专利培育布局大赛银奖;所指导的学生荣获RFIT2024、GSMM2024等国际学术会议最佳学生论文奖项2项。

Dr. Feng received the Ph.D. degree from Nanyang Technological University, Singapore. Since August 2020, he has been with SCUT as an Associate Professor, serving as the executive deputy director of the Guangdong Provincial Key Laboratory of Intelligent ISAC Chips, and concurrently serving as the doctoral supervisor of the Pengcheng Laboratory. Before join in SCUT, he worked as Research Fellow and Staff Engineer in Nanyang Technological University and Huawei Singapore Research Center, respectively. Driven by the industrial demand of the next generation of information technology, his research focuses on the theoretical and technical research of silicon-based millimeter-wave front-end chip design, transceiver architecture, and integrated sensing and communication (ISAC); He has presided over or participated in more than 10 projects, including the National Key R&D Program of the Ministry of Science and Technology, the National Natural Science Foundation of China, the Natural Science Foundation of Guangdong Province and so on. He has accumulated rich research experience and scientific achievements in millimeter-wave wideband amplifiers, low-power millimeter-wave receivers, millimeter-wave radar transceiver front-ends, and sub-THz high-speed communication transceivers. He has published more than 70 SCI/EI papers, including three JSSC papers and one ISSCC paper; Dr. Feng has achieved nine Chinese patents and one US patent with one achievement in technology transfer; He was awarded the integrated circuit design scholarship from Singapore Economic Development Board (EDB) and silver award in the Guangdong-Hong Kong-Macao Greater Bay Area high-value patent cultivation competition. His students have achieved two best student paper awards at international conferences such as RFIT2024 and GSMM2024.

教育经历

2012.01–2016.01,新加坡南洋理工大学,博士

2006.09–2010.06,东北大学,学士

工作经历

2020.08–至今,华南理工大学,副教授(博导、硕导),兼任鹏城实验室博士生导师

2019.09–2020.05,华为新加坡研究院,资深工程师(Staff Engineer)

2016.04–2019.08,新加坡南洋理工大学,博士后研究员(Research Fellow)

研究方向

宽带毫米波收发前端芯片

高能效毫米波收发机架构

通信感知一体化(ISAC)

智能超表面(RIS)

授课课程

本科生必修课《模拟集成电路原理与设计》

本科生必修课《模拟集成电路原理与设计》课程设计

本科生必修课《工程导论I》实践课

研究生必修课《模拟集成电路分析与设计》

学术任职

IEEE会员

中国电子学会会员

珠海市集成电路专业职称评审专家

IEEE JSSC、TMTT、TCAS-I、TCAS-II、MWTL等多个国际期刊审稿人

科研项目

1.国家重点研发计划青年科学家项目,高密度太赫兹多波束芯片,2023.12–2026.11,在研,课题负责人;

2.国家自然科学基金面上项目,面向太赫兹大规模阵列的自零差相干解调机理研究与芯片设计,2025.01-2028.12,在研,主持;

3.广东省自然科学基金面上项目,硅基高能效毫米波数字发射机关键技术研究,2023.01–2025.12,在研,主持;

4.中央高校基本科研业务费优秀青年团队项目,面向6G应用的通感一体化射频前端系统,2023.01–2024.12,在研,参与(核心成员);

5.广东省自然科学基金面上项目,基于极化架构的硅基低功耗毫米波接收机关键技术研究,2021.01–2023.12,结题,主持;

6.广州市基础与应用基础研究项目,基于可变补偿Outphasing架构的高能效功率放大器研究,2022.04–2024.03,结题,主持;

7.企业委托技术开发与合作项目,面向芯粒互连的高能效140GHz收发前端研究与设计,2022.11–2024.12,在研,主持;

8.华南理工大学中央高校基本科研业务费,5G毫米波智能集成通信芯片设计技术及其应用,2021.01–2022.12,结题,参与(核心成员);

9.新加坡国立研究基金会NRF CRP项目,CMOS Terahertz Interconnects Towards Tera-Scale Personalized Cloud Server,2016.09–2021.08,结题,参与;

10.新加坡教育部ARF Tier 2项目,High Thermal Resolution Ultra-Low Power Integrated Imager: Fundamental Issues in CMOS,2013.07–2016.06,结题,参与(核心成员)

代表性科研成果

10篇代表性论文

[1]J. Ke, Z. Lin, G. Feng*, and Y. Wang*, “A 52–73 GHz LNA with Tri-Coupled Transformer for Gm Boosting and Enhanced Noise Canceling,” IEEE Journal of Solid-State Circuits, vol. 59, no. 3, pp. 668-676, Mar. 2024.

[2]G. Feng*, L. Zheng, Y. Wang, and Q. Xue, “A 0.5-V 0.88-mW Low Noise Amplifier with Active and Passive Gm Enhancements in Sub-6 GHz Band”, IEEE Microwave and Wireless Technology Letters, vol. 33, no. 8, pp. 1159-1162, Aug. 2023.

[3]G. Feng and J. J. Sit*, “An Injection-Locked WPT Transmitter with Automatic Maximum Efficiency Tracking,” IEEE Transactions on Industrial Electronics, vol. 68, no. 7, pp. 5733-5743, Jul. 2021.

[4]K. Yang*, C. C. Boon, G. Feng, C. Li, Z. Liu, X. Yi, Y. Dong, A. Zhou, X. Wang, “A 1.75dB NF 25mW 5GHz Transformer-Based Noise Cancelling CMOS Receiver Front-End, International Solid-State Circuits Conference (ISSCC), Feb. 2021.

[5]K. Yang*, X. Yi, C. C. Boon, Z. Liang, G. Feng, C. Li, and B. Liu, “A Parallel Sliding-IF Receiver Front-End with Sub-2 dB Noise Figure for 5-6 GHz WLAN Carrier Aggregation,” IEEE Journal of Solid-State Circuits, vol. 56, no. 2, pp. 392–403, Aug. 2020.

[6]X. Yi, Z. Liang*, G. Feng, F. Meng, C. Li, K. Yang, B. Liu, and C. C. Boon, A 93.4-to-104.8 GHz 57 mW Fractional-N Cascaded Sub-Sampling PLL with True In-Phase Injection-Coupled QVCO in 65 nm CMOS, IEEE Transactions on Microwave Theory and Techniques, vol. 67, no. 3, pp. 2370–2381, Apr. 2019.

[7]G. Feng*, C. C. Boon, F. Meng, X. Yi, K. Yang, C. Li, and H. Luong, “Pole-Converging Intra-Stage Bandwidth Extension Technique for Wideband Amplifiers,” IEEE Journal of Solid-State Circuits, vol. 52, no. 3, pp. 769–780, Mar. 2017. 

[8]Y. Liang, H. Yu*, G. Feng, A. Apriyana, and T. J. Cui, “An Energy-efficient and Low Crosstalk Sub-THz I/O by Surface Plasmonic Polariton Interconnect in CMOS,” IEEE Transactions on Microwave Theory and Techniques, vol. 65, no. 8, pp. 2762–2774, Aug. 2017

[9]G. Feng*, C. C. Boon, F. Meng*, and X. Yi, “A 100-GHz 0.21-K NETD 0.9-mW Charge-Accumulation Super-Regenerative Receiver in 65-nm CMOS,” IEEE Microwave and Wireless Components Letters, vol. 26, no. 7, pp. 531–533, Jul. 2016.

[10]G. Feng*, C. C. Boon, F. Meng, X. Yi, and C. Li, “An 88.5-110 GHz CMOS Low-Noise Amplifier for Millimeter-wave Imaging Applications,” IEEE Microwave and Wireless Components Letters, vol. 26, no. 2, pp. 134–136, Feb. 2016.

* Corresponding Author

5项代表性发明专利

[1]丰光银,刘俊宏,吴仪,等,一种毫米波自零差接收机,中国,ZL202211376071.2;

[2]丰光银,吴仪,刘俊宏,等,一种可重构通信发射机及方法,中国,ZL202211392228.0;

[3]丰光银,刘俊宏,涂峻源,等,一种高数据率的毫米波超再生接收机,中国,ZL202111625684.0;

[4]丰光银,吴仪,涂峻源,等,一种功率放大器,中国,ZL202111142911.4;

[5]Ji-Jon Sit,丰光银,transmitter device, wireless power transfer system, and methods of forming the same,美国,US11296552B2