时间：2015年12月17日（星期四）下午15：00
地点：材料科学与工程学院8号楼201会议室

报告摘要：
       Soldering interconnection has played an essential role in the electronic manufacturing industry, ranging from the board-level packaging to the miniaturized 3D IC integration. Particularly, the continuously decreasing size and pitch of solder joints in the 3D IC stacking interconnection contributes to an increasing possibility of total consumption of Sn-solder during the interfacial reaction, resulting in the full IMCs micro-joints. Therefore, systematical experiments have been conducted to study the microstructural evolution and mechanical properties of that IMCs micro-joints, and two types of IMCs micro-joints including Cu/IMCs/Cu and Cu/IMCs/Ni structures have been prepared and investigated in this work. Based on the results of the microstructure analysis obtained from FEG-SEM, EBSD and TEM, the mechanism governing the control of IMCs’ evolution has been comprehensively studied. Furthermore, specific micro-scale IMCs cantilevers were fabricated within the full IMC interconnection by Focused Ion Beam (FIB), and subsequently tested using the in situ nano-mechanical testing system. This system combines the utilization of nanoindentation and in situ SEM observation, which creates a novel access to characterize the mechanical properties of IMCs, and results generated the establishment of the relationship between the microstructure and mechanical reliability of the micro-scale IMCs interconnects.

附报告人简介：
       Liping Mo, received the Bachelor Degree in Material processing and control engineering from Huazhong University of Science and Technology (HUST), Wuhan, China, in 2009, and then started her PhD study directly in HUST. In 2011, she participated the collaborative PhD project between HUST and Loughborough University (LU), and spent the next four years mainly in Loughborough University, UK. She passed the PhD thesis defense in LU, 2015 June. During her PhD study period, the main research interest focuses on the electronic packaging technology especially the various soldering interconnections. Much efforts have been made to systematically study the fundamental mechanism of the interfacial reaction between lead-free solder and bonding pads for the application of fine or ultra-fine pitch interconnection, as well as the influence of microstructural evolution on the reliability of the interconnection.