A research group led by Professor Lin Rongzhou from the School of Mechanical and AutomotiveEngineering at South China University of Technology (SCUT), in collaboration with teams from theNational University of Singapore and Rice University, has proposed a novel soft electronicsmanufacturing method termed 'Particle Engulfment Printing.' The study, titled 'Soft Electronics Basedon Particle Engulfment Printing,' was published in Nature Electronics on January 2.

The particle engulfment printing simplifies the complexity of soft electronics manufacturing processes.It enables precise embedding of diverse functional materials, enhances functional integration andperformance, and is applicable to various polymers and functional micro-nano materials.

The particle engulfment printing holds potential for integrating active materials to develop highlyintegrated flexible bioelectronic devices, thereby opening new research directions and technologicalpathways in the field of flexible electronics.