[1] “Silicon Interposer Package for MMIC Heterogeneous Integration Based on Gold/Solder Ball Flip-Chip Technique,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 8, pp. 1659–1662, Aug. 2019.

作者：Yongrong Shi, Dengyun Shao, Wenjie Feng*, Junzhi Zhang, Ming Zhou

摘要：Novel silicon interposer package solution is proposed for monolithic microwave integrated circuit (MMIC) heterogeneous integration. The GaAs/InP MMICs are integrated into the high-resistance silicon interposer by the gold ball flip-chip technique. Then, the whole silicon interposer with the heterogeneous integrated MMICs is assembled to the printed circuit board (PCB) top layer by the solder ball flipchip technique. In this proposed silicon interposer package solution, the microwave signal can be transmitted from the PCB to the heterogeneous integrated MMICs without deterioration. For the experimental study, two low-noise amplifier (LNA) MMICs are cascaded to integrate within the high-resistance silicon interposer, and the measured results show that the proposed package solution can succeed in integrating MMICs for system-on-package applications.