Kewen Wang, Song Chen*, Xiaoyu Weng, Zelin Liu, Jin Long, Lan Liu*. Large-area, highly thermally conductive, but electrically insulative industrial aramid papers with hierarchical multiscale compositing structures. Composites Part A: Applied Science and Manufacturing, 2023, 172, 107634. 

DOI: 10.1016/j.compositesa.2023.107634

Xiaochan Chen, Song Chen*, Xinyu Chen, Haixun Zheng, Yubing Fu, Fang Liu, Qiang Liu, Guoping Zhang*, Lan Liu*. Robust, high-temperature and solvent tolerant, yet detachable polyimide adhesives enabled by dynamic boroxines. Surfaces and Interfaces, 2023, 41, 103270. 

DOI: 10.1016/j.surfin.2023.103270

Haixun Zheng, Song Chen*, Yubing Fu, Xinyu Chen, Guoping Zhang*, and Lan Liu*. Robust Dynamic Epoxy Adhesives with High Environmental Tolerance Enabled by the Coordination of Small-Molecule Coupling Agents with Boroxine. ACS Applied Polymer Materials, 2023, 5 (11), 9346-9353.

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