个人简历

        李国元 博士毕业于香港城市大学，曾任教于南洋理工大学。研究方向为：集成电路/光电子封装、封装材料、失效分析与可靠性。研究集中于3D封装、微电子机械系统（MEMs）封装、系统级封装(SiP)，倒装芯片封装、表面贴装、光互联封装与材料、大功率器件封装、LED封装、半导体激光器封装等。主持和参与国家、省部级和横向科研项目30余项。在国内外重要会议和期刊上发表论文150余篇，获国家发明专利授权7件。

        Li Guoyuan, got a doctor's degree from the City University of Hong Kong and once taught in Nanyang Technological University. Research directions: IC&optoelectronic packaging, packaging materials, failure analysis and reliability. The research mainly focuses on 3D packaging, MEMS packaging, system level packaging (SIP), flip chip packaging, surface mounting assembly, high-power device packaging, LED packaging, and semiconductor laser packaging, etc. He has presided over and participated in more than 30 national, provincial and enterprise scientific research projects. More than 150 papers have been published in important conferences and journals at home and abroad, and 7 national invention patents have been authorized. 

教育经历

1995/06–1998/12，香港城市大学，电子工程系，博士

1985/09–1988/06，华中理工大学，物理系，理学硕士

1978/02–1982/01，华中工学院，物理系，理学学士

工作经历

 2007/01–今          华南理工大学，电子与信息学院/微电子学院，教授

1999/03–2006/12   新加坡南洋理工大学应用科学学院/材料学院，新加坡经济发展局特聘研究员，助理教授

1993/12–1998/12   香港城市大学电子工程学系，访问学者

研究方向

集成电路/光电子封装、封装材料、失效分析与可靠性

授课课程

本科：集成电路制造技术

研究生：IC fabrication Technology

科研项目

国家自然科学基金青年科学基金项目，低温活性焊料SnAgTi与SiC的表面润湿和界面结合机理研究，2019/01-2021/12，参与

代表性科研成果

[1]       Z.H.Li, Y.Tang, Q.W.Guo, G.Y.Li, “Effects of CeO2 nanoparticles addition on shear properties of low-silver Sn–0.3Ag–0.7Cu-xCeO2 solder alloys”，Journal of Alloys and Compounds, 2019, 789:150-162.

[2]       W. Zhong, G. Li, L. Lan, B. Li, and R. Chen, Effects of annealing temperature on properties of InSnZnO thin film transistors prepared by Co-sputtering, RSC Advances, 2018, 8: 34817-34822.

[3]       J. Xia, L.X. Cheng, G.Y. Li*, B. Li, Reliability study of package-on-package stacking assembly under vibration loading, Microelectronics Reliability, 2017, 78: 285-293

[4]       L.X. Cheng, M.R. Liu, X.Q. Wang, B.H. Yan, G.Y. Li*, Effects of active element Ti on interfacial microstructure and bonding strength of SiO₂/SiO₂ joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler, Mater. Sci. Eng. A, 2017, 680: 317-323

[5]       Z.L. Li, G.Y. Li*, B. Li, L.X. Cheng, J.H. Huang, Y. Tang, Size effect on IMC growth in micro-scale Sn-3.0Ag-0.5Cu-0.1TiO₂ solder joints in reflow process, Journal of Alloys and Compounds, 2016, 685: 983-991

[6]      李国元，杨博新，梁志明，吴朝晖，一种数控分段式交流驱动LED芯片电路及其驱动方法，2018.9.14，中国，ZL201611083468.7