From August 16 to 19, the 17th International Conference on Electronic Packaging Technology (ICEPT2016) was held in Wuhan, China. Dr. Liang Shuibao, from School of Materials Science and Engineering, whose advisor was Prof. Zhang Xinping, won the CISCO&ASE Best Student Paper Award with his conference paper “Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects”. Besides, Feng Jianqiang, who was undergraduates, won the ICEPT Outstanding Paper Award with the paper “Interfacial reaction and IMC growth between the undercooled liquid lead-free solder and Cu metallization”. We have won the award for 3 years since 2014.
ICEPT was inaugurated in 1994, hosted by the Chinese Institute of Electronics (CIE) and organized by the Electronic Manufacturing and Packaging Technology Society (EMPT) of CIE as well as several participating universities, has been successfully held 15 times in Beijing, Shanghai, Shenzhen, Xi’an, Guilin, Dalian and Chengdu. ICEPT offers attendees, including experts, researchers and engineers from industry and academia, numerous opportunities for discussion on state-of-the-art technologies in electronic packaging field.