华南理工大学SMEP团队和工程中心2004年以来发表的论文

SMEP团队和工程中心2004-2021/22年度发表论文

2022：

1) H.G. Wang, G.C. Lyu, Y.K. Deng, W.L. Hu, B.X. Yang, M.B. Zhou, X.P. Zhang, A comprehensive study of crack initiation and delamination propagation at the Cu/Polyimide interface in fan-out wafer level package during reflow process, IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, May 31 - June 3, 2022（全文已录用，稿号：ECTC 2022-1360）.

2) G.C. Lyu, H.G. Wang, M.B. Zhou, X.P. Zhang, An extensive simulation study of the interfacial delamination in molded underfill flip-chip packages by finite element method based on virtual crack closure technique, IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, May 31 - June 3, 2022（全文已录用，稿号：ECTC 2022-1365）.

3) R.Z. Shi, M.B. Zhou, X.P. Zhang, Novel Sn–Cu based composite solder preforms capable of low temperature reflow for die attachment of high temperature power electronics and the transient liquid phase bonding process, IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, May 31 - June 3, 2022（全文已录用，稿号：ECTC 2022-1456）.

4) B. Hou, H.J. Huang, C.M. Wang, M.B. Zhou, X.P. Zhang, Superb sinterability of the Cu paste consisting of bimodal size distribution Cu nanoparticles for low-temperature and pressureless sintering of large-area die attachment and the sintering mechanism, IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, May 31 - June 3, 2022（全文已录用，稿号：ECTC 2022-1361）.

5) C. Gan, H.J. Huang, B. Hou, M.B. Zhou, X.P. Zhang, Fabrication of wearable strain sensor by using a novel hybrid Cu ink composed of bimodal Cu particle ink and Cu-based metal-organic decomposition ink, IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, May 31 - June 3, 2022（全文已录用，稿号：ECTC 2022-1462）.

6) S.B. Liang, C. Wei, C.B. Ke, S. Cao, M.B. Zhou, X.P. Zhang, Investigation of the interaction effect between the microstructure evolution and the thermo-mechanical behavior of Cu-filled through silicon via, IEEE Transactions on Device and Materials Reliability, 2022 (in press).

7) W.K. Le, M.B. Zhou, X.P. Zhang, The effects of the decreasing joint size on interfacial microstructure and shear behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads, Journal of Materials Science: Materials in Electronics, 2022, 33: 1464–1479.

8) S. Liu, C.B. Ke, S. Cao, X. Ma, Z.X. Zhao, Y.W. Li, X.P. Zhang, An atomistic study of self-accommodation martensite morphologies and microstructure evolution during forward and reverse martensitic transformations in single crystal and bicrystal NiTi alloys, Computational Materials Science, 2022 (in press, https://doi.org/10.1016/j.commatsci.2022.111455)

9)J. Zhong, X.L. Li, Y.T. Yao, J. Zhou, S.S. Cao, X.P. Zhang, Y.T. Jian, K. Zhao, Effect of acid-alkali treatment on serum protein adsorption and bacterial adhesion to porous titanium, Journal of Materials Science: Materials in Medicine, 2022, 33:20-1–11.

10) H. Jiang, M.B. Zhou, X.P. Zhang, Property prediction of Ag-filled isotropic conductive adhesive through the analysis of its curing and decomposition kinetics, Catalysts, 2022, 12, 185-1–13.

11) 周敏波, 赵星飞, 陈明强, 柯常波, 张新平, 电子封装跨尺度凸点结构Sn3.0Ag0.5Cu/Cu微互连焊点界面IMC生长与演化及力学行为的尺寸效应, 机械工程学报, 2022, 58(2): 259–268.

12) 黄海军, 周敏波, 吴雪, 张新平, 芯片互连用粒径双峰分布纳米铜膏的低温无压烧结纳连接机理和接头可靠性, 机械工程学报, 2022, 58(2): 58–65.

13) X. Ma, X.F. Zhao, Y.F. Xu, S. Cao, X.P. Zhang, Reorientation of martensite variants during compressive unloading of martensitic equiatomic NiTi alloy, The 8th International Conference on Solid→Solid Phase Transformations in Inorganic Materials (PTM2022), Xi'an, June 27 - July 1, 2022（论文录用稿号：1707313）

2021：

1) H. J. Huang, X. Ning, M.B. Zhou, T. Sun, X. Wu, X.P. Zhang, A 3D printable liquid metal-like Ag nanoparticle ink for making super-stretchable and highly cyclic durable strain sensor, ACS Applied Materails and Interface, 2021,13(15):18021–18032.

2) H. J. Huang, X. Ning, M.B. Zhou, T. Sun, X. Wu, X.P. Zhang, A 3D printable liquid metal-like Ag nanoparticle ink for making super-stretchable and highly cyclic durable strain sensor, ACS Applied Materails and Interface, 2021,13(15):18021–18032.

3) H.J. Huang, X. Wu, M.B. Zhou, X.P. Zhang, Superior strength and strengthening mechanism of die attachment joints by using bimodal-sized Cu nanoparticle paste capable of low-temperature pressureless sintering, Journal of Materials Science: Materials in Electronics, 2021, 32: 3391–3401.

4) Y.T. Yao, Y. Yang, Q. Ye, S.S. Cao, X.P. Zhang, K. Zhao, Y.T. Jian,Effects of pore size and porosity on cytocompatibility and osteogenic differentiation of porous titanium, Journal of Materials Science: Materials in Medicine, 2021, 32: 72-1–11.

5) W.L. Hu, J.B. Fei, M.B. Zhou, B.X. Yang, X.P. Zhang, Comprehensive characterization of warpage and fatigue performance of fan-out wafer level package by taking into account the viscoelastic behavior of EMC and the dielectric layer, Proceedings of 71st Electronic Components and Technology Conference (ECTC), IEEE, 2021, 2003–2008.

6) B.X. Yang, J.B. Fei, S.B. Liang, M.B. Zhou, W.L. Hu, H.J. Huang, X.P. Zhang, 3D finite element simulation study of chip stacking structure considering different numbers of stacked dies and the effects of underfill and intermetallic compound layer of micro-joints, Proceedings of 71st Electronic Components and Technology Conference (ECTC), IEEE, 2021, 1405–1411.

7) H.J. Huang, M.B. Zhou, X.P. Zhang, Extraordinarily enhanced sintering performance of pressureless sinterable Cu nanoparticle paste for achieving robust die-attach bonding by using reducing hybrid solvent, Proceedings of 71st Electronic Components and Technology Conference (ECTC), IEEE, 2021, 583–589.

8) H.G. Wang, M.B. Zhou, J.B. Fei, L. Sun, B.X. Yang, W.L. Hu, C.B. Ke, X.P. Zhang, Finite element simulation study of interfacial crack propagation in the underfilled FC-BGA package, Proceedings of 22nd International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2021, 412-1–5 (22nd ICEPT Best Student Paper Award/第22届电子封装技术国际会议最佳学生论文奖获奖论文).

9) Y.K. Deng, B.X. Yang, W.L. Hu, X.P. Zhang, A comprehensive simulation study of warpage of fan-out panel-level package using element birth and death technique, Proceedings of 22nd International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2021, 407-1–5.

10) M.Q. Chen, M.B. Zhou, Y.W. Li, X.P. Zhang, Influences of the solder size on growth of interfacial Cu₆Sn₅ and mechanical performance of Sn-3.0Ag-0.5Cu/(111)Cu joints subjected to multiple reflow soldering, Proceedings of 22nd International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2021, 414-1–5 (22nd ICEPT Best Student Paper Award/第22届电子封装技术国际会议最佳学生论文奖获奖论文).

11) R.Z. Shi, M.Q. Chen, H.J. Huang, M.B. Zhou, X.P. Zhang, Solder preforms composed of high Cu-content Sn-xCu alloys for power electronic packaging and characterization of the processing performance and joint's properties, Proceedings of 22nd International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2021, 497-1–5.

12) C.B. Li, X. Ma, H.J. Huang, M.B. Zhou, X.P. Zhang, Fabrication of flexible printed circuits on polyimide substrate by using Ag nanoparticle ink through 3D direct-writing and reliability of the printed circuits, Proceedings of 22nd International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2021, 422-1–5.

2020：

1) W.K. Le, J.Y. Zhou, C.B. Ke, M.B. Zhou, X.P. Zhang, Study of accelerated shear creep behavior and fracture process of micro-scale ball grid array (BGA) structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electro-thermo-mechanical loads, Journal of Materials Science: Materials in Electronics, 2020, 31: 15575–15588.

2) C. Wei, C.B. Ke, S.B. Liang, S. Cao, H.T. Ma, X.P. Zhang, An improved phase field method by using statistical learning theory-based optimization algorithm for simulation of martensitic transformation in NiTi alloy, Computational Materials Science, 2020, 172: 109292-1–8.

3) Z.X. Zhao, X.Ma, S.Cao, Y.Y. Li,C.Y. Zeng, D.X. Wang, X. Yao, Z.J. Deng, X.P. Zhang, Identification of nano-width variants in a fully monoclinic martensitic Ni50Ti50 alloy by scanning electron microscope-based transmission Kikuchi diffraction and improved groupoid structure approach, Materials Letters, 2020, 281: 128624-1–4.

4) S. Cao, C.Y. Zeng, Y.Y. Li, X. Yao, X. Ma, V. Samaee, D. Schryvers, X.P. Zhang, Quantitative FIB/SEM three-dimensional characterization of a unique Ni₄Ti₃ network in a porous Ni50.8Ti49.2 alloy undergoing a two-step martensitic transformation, Materials Characterization, 2020, 169: 110595-1–9.

5) E. Zaiser, X.Y. Zhou, A.M. Manzoni, S. Haas, U. Glatzel, X.P. Zhang, G.B. Thompson, W. Li, F. Vogel, Hierarchical phase separation behavior in a Ni-Si-Fealloy, Acta Materialia, 2020, 195: 327–340.

6) J.B. Fei, T. Xu, J.Y. Zhou, C.B. Ke, X.P. Zhang, Interfacial crack initiation and delamination propagation in Cu-filled TSV structure by incorporating cohesive zone model and finite element method, Proceedings of 70th Electronic Components and Technology Conference (ECTC), IEEE, 2020, 1186–1191.

7) J.Y. Zhou, Z. Wang, C. Wei, J.B. Fei, C.B. Ke, X.P. Zhang, Three-dimensional simulation of effects of electro-thermo-mechanical multi- physical fields on Cu protrusion and performance of micro-bump joints in TSVs based high bandwidth memory (HBM) structures, Proceedings of 70th Electronic Components and Technology Conference (ECTC), IEEE, 2020, 1659–1664.

8) H.J. Huang, X. Wu, M. B. Zhou, X.P. Zhang, A highly reliable die bonding approach for high power devices by low temperature pressureless sintering using a novel Cu nanoparticle paste, Proceedings of 70th Electronic Components and Technology Conference (ECTC), IEEE, 2020, 1697–1702.

9) L. Sun, M.B. Zhou, T. Sun, X.P. Zhang, Effects of underfill thickness on mechanical properties and fracture behavior of Si/underfill/Si adhesion structures, Proceedings of 21st International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2020, 271-1–4.

10) 韦昭召, 马骁, 柯常波, 张新平, FCC-BCC 原子尺度台阶型马氏体相界面迁移行为的分子动力学模拟研究, 物理学报, 2020; 69: 136102.

2019：

1) W.K. Le, X. Ning, C.B. Ke, M.B. Zhou, X.P. Zhang, Current density dependent shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads, Journal of Materials Science: Materials in Electronics, 2019, 30: 15184–15197(DOI: 10.1007/s10854-019-01891-z).

2) S.B. Liang, C.B. Ke, C. Wei, J.Q. Huang, M.B. Zhou,.X.P. Zhang, Microstructural evolution and change inmacroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress, Journal of Materials Research, 2019, 34(16): 2775–2788 (DOI: 10.1557/jmr.2019.201).

3) M.B. Zhou, X.F. Zhao, W. Yue, X.P. Zhang, Unique interfacial reaction and so-induced change in mechanical performance of Sn–3.0Ag–0.5Cu/Cu solder joints formed during undercooled and eutectic liquid soldering processes, Journal of Materials Science: Materials in Electronics, 2019, 30: 4770–4781.

4) S.B. Liang, C.B. Ke, M.B. Zhou, X.P. Zhang, Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient, Microelectronics Reliability, 2019, 92: 1–11.

5) S.B. Liang, C.B. Ke, C. Wei, M.B. Zhou, X.P. Zhang, Study of the influence of elastic anisotropy of Cu on thermo-mechanical behavior and Cu protrusion of through silicon vias using combined phase field and finite element methods, IEEE Transactions on Device and Materials Reliability, 2019, 19(2): 322–332.

6) C.Y. Zeng, S. Cao, Y.Y. Li, Z.X Zhao, X.Y. Yao, X. Ma, X.P. Zhang, A hidden single-stage martensitic transformation from B2 parent phase to B19’ martensite phase in an aged Ni51Ti49 alloy, Materials Letters, 2019, 253: 99–101.

7) C.Y. Zeng, S. Cao, Y.Y. Li, Z.X. Zhao, Z.W. Zhu, D.X. Wang, X. Ma, X.P. Zhang, Two-step constrained aging treatment enabled superior two-way shape memory effect and elevated R-phase transformation temperatures in a rapidly solidified Ni₅₁Ti₄₉ alloy, Journal of Alloys and Compounds, 2019, 785: 1180–1188.

8) Y.T. Yao, S. Liu, M.V. Swain, X.P. Zhang, K. Zhao, Y.T. Jian, Effects of acid-alkali treatment on bioactivity and osteoinduction of porous titanium: An in vitro study, Materials Science and Engineering-C, 2019, 94: 200–210.

9) Y.T. Jian, L. Dao, X.D. Wang, X.P. Zhang, M.V. Swain, K. Zhao, Influence of veneer pore defects on fracture behavior of bilayered lithium disilicate glass-ceramic crowns, Dental Materials, 2019, 35(4): e83–e95.

10) 闫丽静，周敏波，赵星飞，凝固条件和应变速率对Sn-58Bi钎料拉伸性能和断裂行为的影响，焊接学报，2019，40(5): 20180131002-1-6. (doi:10.12073/j.hjxb)

11)郭丽娜，王晓东，张新平，简裕涛，赵克,代型材料力学性能对磨牙氧化锆全瓷冠断裂失效行为的影响，中华口腔医学研究杂志，2019，13(1): 7–12.

12) J.Y. Zhou, S.B. Liang, C. Wei, W.K. Le, C.B. Ke, M.B. Zhou, X., Ma, X.P. Zhang, Three-dimensional simulation of the thermo-mechanical interaction between the micro-bump joints and Cu protrusion in Cu-filled TSVs of the high bandwidth memory (HBM) structure, Proceedings of 69th Electronic Components and Technology Conference (ECTC), IEEE, 2019, 410–416.

13) T. Xu, M.B. Zhou, Z.J. Zhang, X.F. Zhao, X.P. Zhang, Solder size effect on interfacial reaction and growth behavior of Cu-Sn intermetallic compounds in cross-scale Sn3.0Ag0.5Cu/Cu joints between stacking TSV chips during step-reflow processes, Proceedings of 20th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2019, 268-1–4.

14) W.K. Le, T. Sun, J.Y. Zhou, M.B. Zhou, X.P. Zhang, Effect of loading rate on the shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads, Proceedings of 20th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2019, 158-1–4.

15)H.J. Huang, X. Wu, X. Ma, M.B. Zhou, X.P. Zhang, A bimodal core-shell structured Cu–Ag nanoparticles based conductive ink capable of low temperature sintering for printed flexible electronics, Proceedings of 20th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2019, 155-1–4.

16)X. Wu, H.J. Huang, Z.J. Zhang, C.B. Chang, M.B. Zhou, X.P. Zhang, Effects of size distributions of copper nanoparticles on the pressureless bonding performance of the copper paste for die attachment, Proceedings of 20th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2019, 254-1–4.

17) T. Sun, M.B. Zhou, Z.J. Zhang, X.P. Zhang, Ultrasound-assisted soldering process performance of Sn-Ag-Ti(Ce, Ga) active solders on thin film ZnO substrate, Proceedings of 20th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2019, 374-1–4.

18) Z.J. Zhang, M.B. Zhou, T. Sun, X. Wu, X.P. Zhang, Influences of Ag and Zn contents on interfacial microstructure and corrosion behavior of Sn–Zn–Ag/6061Al joints in antenna module packages, Proceedings of 20th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2019, 396-1–4.

19) M.B. Zhou, H.Q. Zhang, X.P. Zhang, W. Yue, Shear strength and fracture behavior of locally-melted hybrid Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu joints under different loading rates, Proceedings of 20th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2019, 408-1–4.

2018：

1) S.B. Liang, C.B. Ke, C. Wei, M.B. Zhou, X.P. Zhang, Phase field modeling of grain boundary migration and preferential grain growth driven by electric current stressing, Journal of Applied Physics, 2018, 124(17), 175109-1–10.

2) J.Q. Huang M.B. Zhou, S.B. Liang, X.P. Zhang, Size effect on the interfacial reaction and microstructural evolution of Sn-ball/Sn3.0Ag0.5Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing temperature, Journal of Materials Science: Materials in Electronics, 2018, 29(9): 7651–7660.

3) W.Y. Li, X.P. Zhang, H.B. Qin, Y.W. Mai, Joule heating dominated fracture behavior change in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads, Microelectronics Reliability, 2018, 82(3): 224–227.

4) W.Y. Li, S. Cao, X.P. Zhang, Novel and facile synthesis of nano SnO₂ with various morphologies by electric current stressing, Rare Metal Materials and Engineering, 2018, 47(9): 2647–2651.

5) Y.Y. Li, X.Y. Yao, S. Cao, X. Ma, C.Y. Zeng and X.P. Zhang, An abnormal two-way shape memory effect in a rapidly solidified Ni₅₁Ti₄₉ alloy induced by low temperature constrained aging, Scripta Materialia, 2018, 149:117–120.

6) Z.X. Zhao, X. Ma, S. Cao, C.B. Ke, X.P. Zhang, Anisotropic negative thermal expansion behavior of the as-fabricated Ti-rich and equiatomic Ti-Ni alloys induced by preferential grain orientation, Shape Memory and Superelasticity, 2018, 4(1): 218–223.

7) 韦昭召，马骁，张新平，NiTi合金B2-B19'马氏体相变晶体学的拓扑模拟研究，金属学报，2018, 54(10): 1461–1470.

8) 魏铖，柯常波，马海涛，张新平，基于序参量梯度的改进相场模型及对大尺度体系马氏体相变的模拟研究，金属学报，2018, 54(8): 1204–1214.

9) 马骁，祝星，赵仲勋，曹姗姗，柯常波，张新平，显微组织不均匀性对富Ti含量Ti-Ni 合金负热膨胀行为的影响，中国有色金属学报，2018, 28(3): 446–456.

10)C.Y. Zeng, Z.X. Zhao, Y.Y. Li, S. Cao, X. Ma, X.P. Zhang, Thermal cycling induced instability of martensitic transformation and the micro-mechanism in solution-treated Ni₅₁Ti₄₉ alloy, Proceedings of the International Conference on Martensitic Transformation (ICOMAT), Chicago, 2018, 89–94.

11)Y.Y. Li, C.Y. Zeng, S. Cao, X. Ma and X.P. Zhang, Functional stability of the Ni₅₁Ti₄₉ two-way shape memory alloy as artificial anal sphincter during thermo-mechanical cycling, Proceedings of the International Conference on Martensitic Transformation (ICOMAT), Chicago, 2018, 201–205.

12)S. Cao, Y.Y. Li, C.Y. Zeng, X.P. Zhang, Porous Ni–Ti–Nb shape memory alloys with tunable damping performance controlled by martensitic transformation, Proceedings of the International Conference on Martensitic Transformation (ICOMAT), Chicago, 2018, 275–279.

13)Z.X. Zhao, X. Ma, C.Y. Zeng, S. Cao, C.B. Ke, X.P. Zhang, Reversible negative thermal expansion response and phase transformation behavior of a Ti-rich Ti₅₄Ni₄₆ alloy prepared by rapid solidification, Proceedings of the International Conference on Martensitic Transformation (ICOMAT), Chicago, 2018, 189–193.

14)S.B. Liang, C.B. Ke, C. Wei, M.B. Zhou, X.P. Zhang, Three-dimensional simulation of effects of microstructure evolution and interfacial delamination on Cu protrusion in copper filled through silicon vias by combined Monte Carlo and finite element methods. Proceedings of 68th Electronic Components and Technology Conference (ECTC), IEEE, 2018, 2134–2141.

15)S.B. Liang, X.P. Zhang, C. Wei1, C.B. Ke, C.Q. Liu, Interaction effects between the preferred growth of β-Sn grains and thermo-mechanical response in microbump interconnects under thermal cycling, Proceedings of 7^th Electronics System-Integration Technology Conference (ESTC), IEEE, 2018, 179-1–7.

16)W.Y. Li, X.P. Zhang, Low and cryogenic temperature mechanical performance and fracture behavior of micro-scale Cu/Sn–3.0 Ag–0.5 Cu/Cu joints with the decreasing dimension, Proceedings of 19th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2018, 324–328.

17)Q.W. Chen, X. Ma, H.J. Huang, C. Yin, M.B. Zhou, X.P. Zhang, Tin nanoparticles modified nano-silver paste for pressureless low-temperature sintering process, Proceedings of 19th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2018, 356–360.

18)J.Y. Zhou, C. Wei, S.B. Liang, X. Ma, X.P. Zhang, Three-dimensional simulation of the effects of Cu protrusion of Cu-filled TSVs on thermal fatigue behavior of micro-bump joints in 3D integration, Proceedings of 19th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2018, 361–366.

19)S.B. Liang, C.B. Ke, C. Wei, M.B. Zhou, X.P. Zhang, Phase field study of the combined effects of electromigration and thermomigration on phase segregation and physical properties of Sn58Bi solder joints under electric current stressing coupled with temperature gradient, Proceedings of 19th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2018, 376–382.

20)J.G. Li, X. Ma, M.B. Zhou, X. Ning, X.P. Zhang, Effects of Sb addition on the microstructure and mechanical performance of Sn58Bi based alloys and the solder joints, Proceedings of 19th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2018, 457–461.

21)H.J. Huang, M.B. Zhou, C. Yin, Q.W. Chen, X.P. Zhang, Preparation of a low temperature sintering silver nanoparticle ink and fabrication of conductive patterns on PET substrate, Proceedings of 19th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2018, 482–485.

22)H.J. Huang, M.B. Zhou, C. Yin, Q.W. Chen, X.P. Zhang, Fabrication of oxidation-resistant submicron copper particles and the conductive ink as well as its sintering behavior on the flexible substrate, Proceedings of 19th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2018, 491–495.

23)J.Q. Huang, M.B. Zhou, X.F. Zhao, X.P. Zhang, Effect of electromigration on the microstructural evolution and shear fracture behavior of mixed assembled Cu/Sn–3.0Ag–0.5 Cu-ball/Sn–58Bi-paste/Cu joints in board-level packaging, Proceedings of 19th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2018, 531–535.

24)X. Ning X, M.B. Zhou, J.G. Li, X.P. Zhang, Effect of some N-heterocyclic inhibitors in the soldering flux on the corrosion behavior of eutectic Sn–58Bi alloy and its solder paste, Proceedings of 19th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2018, 540–545.

25)X.F. Zhao, M.B. Zhou, T. Sun, X.P. Zhang, Size effect on the interfacial reaction and IMC growth of Sn–3.0 Ag–0.5 Cu/Cu joints with the decreasing joint size to several tens of microns during reflowing soldering, Proceedings of 19th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2018, 562–565.

26) W. K. Le, X. Ning X, J.Q. Huang, M.B. Zhou, X.P. Zhang, Effect of electric current stressing on the shear strength and fracture behavior of micro-scale BGA structured Cu/Sn–3.0 Ag–0.5 Cu/Cu joints, Proceedings of 19th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2018, 610–614.

27) W.K. Le, Z.W. Zhu, S.S. Cao, X.P. Zhang,, Shear creep and fracture behavior of micro-scale BGA structured Cu/Sn–3.0 Ag–0.5 Cu/Cu joints under electro-thermo-mechanical coupled loads, Proceedings of 19th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2018, 620–624.

28) H. Jiang, M.B. Zhou, X.P. Zhang, Study of the curing kinetics and heat resistance of isotropic conductive adhesive, Proceedings of 19th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2018, 633–637.

29) K. Wang , G. L. Chen, M.B. Zhou, X.P. Zhang, A cost-effective and high performance assembly technology for interconnecting the Cu/Al bilayer electrode and lead wire of ZnO varistor using a low Ag-containing solder paste, Proceedings of 19th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2018, 642–647.

30)W. Yue, M.B. Zhou, X.P. Zhang, Influence of solder ball volume on mechanical shock reliability of right-angle solder interconnects, Proceedings of 19th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2018, 1472–1475.

2017：

1) Y.Y. Li, S.S. Cao, X. Ma, C.B. Ke, X.P. Zhang, Influence of strongly textured microstructure on the all-round shape memory effect of rapidly solidified Ni₅₁Ti₄₉ alloy, Materials Science and Engineering-A, 2017, 705: 273–281.

2) S.B. Liang, C.B. Ke, W.J. Ma, M.B. Zhou, X.P. Zhang, Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects, Microelectronics Reliability, 2017, 71(4): 71–81.

3) Y.Y. Li, X.Y. Yao, S.S. Cao, X. Ma, C.B. Ke, X.P. Zhang, Rapidly solidified and optimally constraint-aged Ni51Ti49 shape memory alloy aiming at making a purpose-designed bio-actuator, Materials and Design, 2017, 118: 99–106.

4) Y.T Jian, Z.H. He, L. Dao, M.V. Swain, X.P. Zhang, K. Zhao, Three-dimensional characterization and distribution of fabrication defects in bilayered lithium disilicate glass-ceramic molar crowns, Dental Materials, 2017, 33: e178–e185.

5) W.J. Ma, C.B. Ke, S.B. Liang, M.B. Zhou, X.P. Zhang. Morphological evolution and growth kinetics of Kirkendall voids in a binary alloy system during deformation process — A phase field crystal simulation study, Transactions of the Nonferrous Metals Society of China, 2017, 27(3): 599–607.

6) J.Q. Huang, M.B. Zhou and X.P. Zhang. The melting characteristics and interfacial reactions of Sn-ball/Sn–3.0Ag–0.5Cu-paste/Cu joints during reflow soldering, Journal of Electronic Materials, 2017, 46(3): 1504–1515.

7) S.B. Liang, C.B. Ke, B. Li, H. Jiang, M.B. Zhou, X.P. Zhang, Microstructure simulation and thermo-mechanical behavior analysis of copper filled through silicon vias using coupled phase field and finite element methods, Proceedings of 67th Electronic Components & Technology Conference (ECTC), IEEE, 2017, 1599–1604.

8) Z. Zhou, X. Ma, M.B. Zhou, C. Yin, X.P. Zhang, Effect of isothermal aging on mechanical properties and strain rate sensitivity of the eutectic Sn-58Bi solder alloy, Proceedings of 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2017, 1586–1591.

9) C. Yin, H. Jin, Z. Zhou, M.B. Zhou,d X.P. Zhang, Processing and electrical properties of sodium citrate capped silver nanoparticle based inks for flexible electronics, Proceedings of 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2017, 1572–1576.

10) J.Q. Huang, M.B. Zhou, X.F. Zhao, X.P. Zhang, Microstructures and shear properties of mixed assembly BGA structure SnAgCu/SnBi(Ag)/Cu joints in board-level packaging, Proceedings of 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2017, 1649–1654.

11) H. Jiang, M.B. Zhou, J.F. Zhu, X.P. Zhang, Preparation of core-shell structured SiO₂@Ag spheres and their role in improving micro-sized Ag flake filled electrically conductive adhesive for LED packaging, Proceedings of 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2017, 1607–1611.

12) S.B. Liang, C. Wei, C.B. Ke, M.B. Zhou, X.P. Zhang, Microstructure simulation and thermo-mechanical behavior analysis of Cu-filled through silicon vias (TSVs) using combined Monte Carlo and finite element method, Proceedings of 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2017, 1617–1622.

13) S.B. Liang, C.B. Ke, M.B. Zhou, X.P. Zhang, Coupled finite element and phase field modeling of void evolution and physical property change of micro flip-chip solder joints under electromigration and elastic stress field, Proceedings of 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2017, 1631–1636.

14)W.Y. Li, M.B. Zhou, X.P. Zhang, Abnormal creep behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints with different joint thicknesses under electro-thermo-mechanical coupled loads, Proceedings of 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2017, 1642–1648 (18th ICEPT Outstanding Paper Award/第18届电子封装技术国际会议杰出论文奖获奖论文).

15) M.B. Zhou, X.F. Zhao, W. Yue, C.B. K, X.P. Zhang, Size and boundary effects on the growth and morphology evolution of interfacial intermetallic compound of Sn0.3Ag0.7Cu/Cu micro-bump joints, Proceedings of 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2017, 1667–1671.

16) W. Yue, M.B. Zhou, X.P. Zhang, Reliablity and failure analysis of electronic components induced by the reflection of laser beam in the laser jet solder ball bonding process, Proceedings of 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2017, 1658–1662.

2016:

1) W.Y. Li, H. Jin, W. Yue, M.Y. Tan, X.P. Zhang. Creep behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads, Journal of Materials Science: Materials in Electronics, 2016, 27(12): 13022–13033.

2) X.Y. Yao, B. Amin-Ahmadi, Y.Y. Li, S.S. Cao, X. Ma, X.P. Zhang, D. Schryvers, Optimization of automated crystal orientation mapping in a TEM for Ni₄Ti₃ precipitation in all-round SMA, Shape Memory and Superelasticity, 2016, 4(2): 286–297.

3) 李望云, 秦红波, 周敏波, 张新平. 电-力耦合作用下Cu/Sn-3.0Ag-0.5Cu/Cu微焊点的拉伸力学性能和断裂行为, 机械工程学报, 2016, 52(10): 46–53.

4) S.B. Liang, C.B. Ke, W.J. Ma, M.B. Zhou, X.P. Zhang. Phase field simulation of segregation of the Bi-riched phase in Cu/Sn-Bi/Cu solder interconnects under electric current stressing. Proceedings of 66th Electronic Components & Technology Conference (ECTC), IEEE, 2016, 264–270.

5) M.B. Zhou, J.Q. Feng, W. Yue, X.P. Zhang, Interfacial reaction and IMC growth between the undercooled liquid lead-free solder and Cu metallization, Proceedings of 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2016, 1023–1027 (17th ICEPT Outstanding Paper Award/第17届电子封装技术国际会议杰出论文奖获奖论文).

6) H.H. Yuwen, X.P. Zhang. Numerical simulation of the TSV-Cu filling by electroplating process with the accelerator and suppressor, Proceedings of 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2016, 721–726.

7) H. Jiang, S.B. Liang, H.H. Yuwen, X.P. Zhang. Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure, Proceedings of 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2016, 947–952.

8) J.Q. Huang, M.B. Zhou, W.Y. Li, X.P. Zhang. Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on BGA packaging, Proceedings of 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2016, 1010–1014.

9) W.Y. Li, S.S. Cao, X.P. Zhang. Creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, 2016, 988–993.

10) J.Q. Huang, M.B. Zhou, X.P. Zhang. Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging, Proceedings of 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2016, 968–973.

11) S.B. Liang, C.B. Ke, M.Y. Tan, M.B. Zhou, X.P. Zhang. Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects, Proceedings of 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2016, 836–840 (17th ICEPT CISCO & ASE Best Student Paper Award/第17届电子封装技术国际会议最佳学生论文奖获奖论文).

12) W.Y. Li, S.S. Cao, X.P. Zhang. Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, Proceedings of 17th International Conference on Electronic Packaging Technology, IEEE, 2016, 860–864.

13) W.J. Ma, C.B. Ke, M.B. Zhou, X.P. Zhang. Phase field crystal simulation of morphological evolution and propagation of microcracks in the intermetallic compound layer of Sn/Cu solder interconnects, Proceedings of 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2016, 963–967.

14) S.B. Liang, C.B. Ke, M.B. Zhou, X.P. Zhang. Phase field simulation of morphological evolution and migration of the microvoid in small scale solder interconnects driven by temperature gradient, Proceedings of 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2016, 953–957.

15) H. Jin, J.F. Zhu, M.B. Zhou, X.P. Zhang. Fabrication of a hybrid paste consisting of microscale Ag-plated Cu flakes and nanoscale Ag particles and characterization of low-temperature sintered hybrid paste joints, Proceedings of 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2016, 927–932.

16) Y.J. Lin, M.B. Zhou, X. Ma, X.P. Zhang. Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al solder joints in packages of LED lighting components and structures, Proceedings of 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2016, 1028–1032.

17) M.Y. Tan, M.B. Zhou, J.Q. Huang, F.Q. Ma, X. Ma, X.P. Zhang. Dynamic wetting behavior and solder ball spattering formation of Sn-Bi solder pastes during reflow soldering process, Proceedings of 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2016, 974–978.

18) J.F. Zhu, H. Jin, M.B. Zhou, X.P. Zhang. Electrical property of electrically conductive adhesives filled with micro-sized Ag flakes and modified by dicarboxylic acids, Proceedings of 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2016, 923–926.

19) L. Zhang, M.B. Zhou, F.S. Qiu, X. Ma, X.P. Zhang. Effects of flux activators and processing parameters on solderability and stability of the aluminum solder paste used for automated assembly of LED lighting components, Proceedings of 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2016, 905–909.

20) G.L. Chen, M.B. Zhou, L. Zhang, Y.J. Lin, Y.P. Zhang, X.P. Zhang. Influence of the zinc-oxide/salt content in the aluminum soldering flux on interfacial microstructure and mechanical property of Sn-0.7Cu/Al joints in assembling LED lighting components, Proceedings of 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2016, 958–962.

21) W. Yue, M.B. Zhou, X.P. Zhang, Effect of the Au bonding pad contamination on the wettability of Au/Sn-3.0Ag-0.5Cu/Au solder joints in flux-free laser jet solder ball bonding process, Proceedings of 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2016, 1201–1205.

2015:

1) H.B. Qin, X.P. Zhang, M. B. Zhou, X.P. Li, Y.-W. Mai, Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, Microelectronics Reliability, 2015, 55(8):1214–1225.

2) C.B. Ke, S.S. Cao, X.P. Zhang, Phase field simulation of coherent precipitation of Ni₄Ti₃ particles during stress-assisted aging of a porous NiTi alloy, Modelling and Simulation in Materials Science and Engineering, 2015, 23: 055008(1–20).

3) S. Cao, Y. Li, X. Ma, X.Y. Yao, X.P. Zhang, Quantitative characterization of pore configuration in a porous Ni50.8a.t.%-Ti SMA, Materials Today: Proceedings, 2015, 2S:S921–S924.

4) C.B. Ke, S.S. Cao, X.P. Zhang, Phase field modeling of Ni-concentration distribution behavior around Ni₄Ti₃ precipitates in NiTi alloys, Computational Materials Science, 2015, 105: 55–65.

5) X. Yao, S. Cao, X.P. Zhang, D. Schryvers, Microstructural characterization and transformation behavior of porous Ni50.8Ti49.2, Materials Today: Proceedings, 2015, 2: S833–S836

6) Y.T. Jian, Y. Yang, T. Tian, X.P. Zhang, K. Zhao, Effect of pore size and porosity on the biomechanical properties and cytocompatibility of porous NiTi alloys, PLoS ONE, 2015, 10(6): e0128138.

7) Z.L. Tang, S.S. Cao, X.P. Zhang, Improvement of microstructure and mechanical properties of a low alloy cast steel processed by direct quenching-partitioning-tempering technique, Steel Research International, 2015, 86(4): 429–435.

8) 马文婧，柯常波，周敏波，梁水保，张新平，Sn/Cu互连体系界面和金属间化合物层Kirkendall空洞演化和生长动力学的晶体相场法模拟，金属学报，2015, 51(7): 873–882.

9) X. Ma, J.P. Luo, S.S. Cao and X.P. Zhang, Design, fabrication and characterization of porous Ti-rich Ti-Ni alloy based composites with near-zero thermal expansion behavior, Poster presentation at the 10th European Symposium on Martensitic Transformations (ESOMAT2015), 14–18 September 2015, Antwerp, Belgium.

10) X. Ma, Y.Y. Li, L.H. Guo, X.Y. Yao, S.S. Cao, and X.P. Zhang, Two-way shape memory NiTi alloy stripes with small transformation hysteresis prepared by rapid solidification and constrained aging, Poster presentation at the 10th European Symposium on Martensitic Transformations (ESOMAT2015), 14–18 September 2015, Antwerp, Belgium.

11) X.Y. Yao, Y.Y. Li, S Cao. X. Ma, X.P. Zhang, D. Schryvers, Ni₄Ti₃ Investigation in an ARSMA using ASTAR orientation imaging microscopy and phase mapping, Oral presentation at the 10th European Symposium on Martensitic Transformations (ESOMAT2015), 14–18 September 2015, Antwerp, Belgium.

12) X.Y. Yao, Y.Y. Li, S Cao. X. Ma, X.P. Zhang, D. Schryvers, Optimization of automated crystal orientation and phase mapping in TEM applied to Ni-Ti all round shape memory alloy. Poster presentation at the 10th European Symposium on Martensitic Transformations (ESOMAT2015), 14–18 September 2015, Antwerp, Belgium.

13) S.B. Liang, C.B. Ke, M.B. Zhou, X.P. Zhang, Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulation, Proceedings of 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, 11–14 August 2015, 260–265.

14) W.J. Ma, C.B. Ke, S.B. Liang, M.B. Zhou, X.P. Zhang, Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic compound layer of Sn/Cu soldering system under cyclic loading, Proceedings of 16th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2015, 301–306.

15) H.H. Yuwen, H.B. Qin, M.B. Zhou, X.P. Zhang, The interfacial thermo-mechanical reliability of 3D memory-chip stacking with through silicon via array, Proceedings of 16th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2015, 568–573.

16) J.Q. Huang, M.B. Zhou, W.Y. Li, X.P. Zhang, Interfacial reactions and formation of intermetallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging, Proceedings of 16th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2015, 307–311.

17) W.Y. Li, M.B. Zhou, X.P. Zhang, Creep behavior of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under tensile stress coupled with DC current stressing, Proceedings of 16th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2015, 187–192 (16th ICEPT CISCO & ASE Best Student Paper Award/第16届电子封装技术国际会议最佳学生论文奖获奖论文).

18) M.B. Zhou, H. Jin, C.B. Ke, X.P. Zhang, Quasi in-situ study of morphological evolution of the interfacial IMC in single-sided interface Sn-0.3Ag-0.7Cu/Cu joints during multiple reflow process, Proceedings of 16th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2015, 333–337.

19) M.B. Zhou, L.B. Zhou, L. Zhang, F.S. Qiu, X. Ma, X.P. Zhang, Influence of metal-oxide/salt content in the aluminum soldering flux on solderability and corrosion resistance of Sn-0.7Cu/6061Al joints, Proceedings of 16th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2015, 323–327.

20) H.B. Qin, W. Yue, X.P. Zhang, D.G. Yang, Size and geometry effects on the electromigration behavior of flip-chip Sn3.5Ag solder joints, Proceedings of 16th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2015, 651–655.

21) W. Yue, X.P. Zhang, Essential factors influencing the wettability of Sn-3.0Ag-0.5Cu solder balls on Au pad of the right-angle solder interconnect in laser jet solder ball bonding, Proceedings of 16th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2015, 930–934.

2014:

1) H.B. Qin, X.P. Zhang, M.B. Zhou, J.B. Zeng, Y.-W, Mai, Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints, Materials Science and Engineering-A, 2014, 617: 14–23.

2) H.B. Qin, W.Y. Li, M. B. Zhou, X.P. Zhang, Low cycle fatigue performance of ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, Microelectronics Reliability, 2014, 54: 2911–2921 (DOI: 10.1016/j.microrel.2014.07.052).

3) C.B. Ke, S. Cao, X.P. Zhang, Three-dimensional phase field simulation of the morphology and growth kinetics of Ni₄Ti₃ precipitates in a NiTi alloy, Modelling and Simulation in Materials Science and Engineering, 2014, 22: 055018 (1–16).

4) Z.Z. Wei, X. Ma, X.P. Zhang, A criterion for determining the optimum value of twist in the topological model. Philosophical Magazine Letter, 2014, 94(5): 288–295.

5) X. Ma, Z.Z. Wei, X.P. Zhang, Theoretical study on the dislocation structure of the parent-martensite interface in a magnetic shape memory alloy. Journal of Materials Science, 2014, 49(13):4648–4655.

6) W. Yue, H.B. Qin, M.B. Zhou, X. Ma, X.P. Zhang, Electromigration Induced microstructure evolution and damage in asymmetric Cu/Sn-58Bi/Cu solder interconnect under current stressing, Transactions of the Nonferrous Metals Society of China, 2014, 24(5): 1619–1628.

7) K. Zhao, Y.R. Wei, Y. Pan, X.P. Zhang, M.V. Swain, P.C. Guess. Influence of veneer and cyclic loading on failure behavior of lithium disilicate glass-ceramic molar crowns. Dental Materials, 2014, 30(2): 164–171.

8) X.D. Wang, Y.T. Jian, P.C. Guess, M.V. Swain, X.P. Zhang, K. Zhao, Effect of core ceramic grinding on fracture behavior of bilayered lithium disilicate glass-ceramic under two loading schemes, Journal of Dentistry, 2014, 42(11):1436–45 (doi: 10.1016/j.jdent. 2014.03.014)。

9) 柯常波，周敏波，张新平，Sn/Cu互连体系界面金属间化合物Cu₆Sn₅演化和生长动力学的相场法模拟，金属学报，2014, 50(3): 294–304.

10) 罗军平, 马骁, 关锐峰, 曹姗姗, 柯常波, 倪东惠, 张新平. 近零膨胀TiNi合金基复合材料的制备及其性能. 中国有色金属学报, 2014，24(2):461–467.

11) 秦红波，李望云，李勋平，张新平，BGA结构无铅微焊点的低周疲劳行为研究，机械工程学报，2014, 50(20): 54–62.

12) X.P. Zhang, A novel Ni-Ti shape memory alloy aiming at making artificial anal sphincter: Design, Fabrication, Characterization and Modeling. 8th International Conference on Advanced Materials Processing (ICAMP8), 27–30 July 2014, Gold Coast, QLD, Australia.

13) H.B. Qin, B. Li, C.B. Ke, W. Yue, M.B. Zhou, X.P. Zhang. Interaction effect between electromigration and microstructure evolution in Cu/Sn-58Bi/Cu solder interconnect. Proceedings of 64^th Electronic Components and Technology Conference (ECTC), Florida, USA, 27–30 May 2014, 2249–2254.

15) L. Zhang, M.B. Zhou, X.P. Zhang, Influence of solder volume and interfacial reaction on the undercooling and solidification microstructure of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints, Proceedings of 15th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2014, 251–255.

16) J.D. Wang, X.Q. He, X.P. Li, Y.F. En, X.P. Zhang, Hermetic packaging of Kovar alloy and low-carbon steel structure in hybrid integrated circuit(HIC) system using parallel seam welding process, Proceedings of 15th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2014, 347–351.

17) H.B. Qin, W. Yue, C.B. Ke, X.P. Zhang, B. Li, Interaction effect between electromigration and microstructure evolution in BGA structure Cu/Sn-58Bi/Cu solder interconnects, Proceedings of 15th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2014, 587–591.

18) W.Y. Li, H.B. Qin, M.B. Zhou, X.P. Zhang, The influence of imposed electric current on the tensile fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, Proceedings of 15th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2014, 1030–1034 （15th ICEPT Cisco & ASE Best Student Paper Award/第15届电子封装技术国际会议最佳学生论文奖获奖论文).

19) S.B. Liang, C.B. Ke, W.J. Ma, M.B. Zhou, X.P. Zhang, Phase field simulation of Kirkendall voids at the interface of microscale Sn/Cu system lead-free interconnects, Proceedings of 15th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2014, 641–645 (15th ICEPT JCAP Outstanding Paper Award/第15届电子封装技术国际会议杰出论文奖获奖论文).

2013：

1) H.J. Jiang, C.B. Ke, S.S Cao, X. Ma, X.P. Zhang, Phase transformation and damping behavior of lightweight porous TiNiCu alloys fabricated by powder metallurgy process, Transactions of the Nonferrous Metals Society of China, 2013, 23(7): 2029–2036.

2) H.J. Jiang, S. Cao, C.B. Ke, X. Ma, X.P. Zhang, Fine grained bulk NiTi shape memory alloy fabricated by rapid solidification process and its mechanical properties and damping performance, Journal of Materials Science and Technology, 2013, 29(9): 855–862.

3) H.J. Jiang, S. Cao, X. C.B. Ke, Ma, X.P. Zhang, Nano-sized SiC particle reinforced NiTi alloy matrix shape memory composite, Materials Letters, 2013, 100: 74–77.

4) B. Li, X.P. Zhang, Y. Yang, L.M. Yin, M.G. Pecht, Size and constraint effects on interfacial fracture behavior of microscale solder interconnects, Microelectronics Reliability, 2013, 53 (1): 154–163.

5) S. Cao, C.B. Ke, X.P. Zhang, D. Schryvers, Morphological characterization and distribution of autocatalytic-grown Ni₄Ti₃ precipitates in a Ni-Ti single crystal, Journal of Alloys and Compounds, 2013, 577: S215–S218.

6) D. Schryvers, S. Cao, W Tirry, H. Idrissi, S. Van Aert, Advanced three-dimensional electron microscopy techniques in the quest for better structural and functional materials, Science and Technology of Advanced Materials, 2013, 14: 014206-1–13.

7) 周敏波，马骁，张新平, BGA结构Sn-3.0Ag-0.5Cu/Cu焊点低温回流时界面反应和IMC生长行为，金属学报，2013, 49 (3): 341–350.

8) 韦昭召，马骁，张新平，Ni2MnGa合金相界面位错结构及马氏体相变晶体学研究，金属学报，2013, 49 (2): 187–198.

9) 柯常波，曹姗姗，马骁，黄平，张新平，NiTi形状记忆合金中Ni₄Ti₃共格沉淀相自催化生长效应的相场法模拟研究，金属学报，2013, 49 (1): 115–122.

10) 魏雅茹，潘娱，曹姗姗，张新平，赵克，饰瓷对磨牙二硅酸锂玻璃陶瓷冠疲劳失效与结构可靠性的影响，中华口腔医学杂志，2013, 48(2): 91-95.

11) 叶琦，石新莹，曹姗姗，赵克，张新平，多孔钛孔隙率和孔隙尺寸对其力学性能及细胞相容性的影响，口腔材料与器械杂志，2013，22(1):7–12, 21.

12) C.B. Ke, S.S. Cao, X. Ma, X.P. Zhang. Phase field simulation of coherent Ni₄Ti₃ precipitation during stress-assisted aging of porous near-equiatomic NiTi shape memory alloys. IUMRS-ICAM2013 International Conference on Advanced Materials, 22–28 Sept. 2013, Qingdao, China.

13) C.Z. Li, M.Y. Yan, M.B. Zhou, X. Ma, X.P. Zhang, Q.S. Ye, Y.R. Huang. Effect of activators and surfactants in halogen-free fluxes on wettability of Sn-0.7Cu-0.05Ni solder on Cu substrate, Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2013, 321–324.

14) G.S. Xu, J.B. Zeng, M.B. Zhou, X.P. Zhang, Undercooling and solidification behavior of Sn-Ag-Cu solder balls and Sn-Ag-Cu/UBM joints, Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2013, 325–329.

15) W.J. Ma, C.B. Ke, M.B. Zhou, X.P. Zhang, Phase field simulation of solidification behavior and microstructure evolution of Sn-58Bi/Cu solder interconnect during reflow soldering process, Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2013, 330–333.

16) C.B. Ke, M.B. Zhou, X.P. Zhang, A multi-phase field study of the role of grain boundary diffusion in growth of Cu₆Sn₅ intermetallic compound during early stage of soldering reaction, Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2013, 572–578.

17) J.B. Zeng, G.S. Xu, M.B. Zhou, X.P. Zhang, Isothermal aging effect on microstructure and mechanical properties of Ni/Sn3.0Ag0.5Cu/Ni interconnects with the decreasing height, Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2013, 997–1004.

18) W. Yue, M.B. Zhou, H.B. Qin, X. Ma, X.P. Zhang. Influence of pre-existing void in the solder joint on electromigration behavior of Cu/Sn58Bi/Cu joints, Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2013, 1005–1009.

19)H.B. Qin, H.H. Yuwen, M.B. Zhou, X.P. Zhang, Influence of geometry of microbump interconnection thermal stress and fatigue life of interconnects in copper filled through silicon via structure, Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2013, 1019–1024.

20) C.R. Yang, G.S. Xu, S.W. Lee, X.P. Zhang, Brittle fracture of intermetallic compounds in SAC solder joints under high speed ball pull/pin pull and Charpy impact tests, Proceedings of IEEE Electronic Components and Technology Conference (ECTC), IEEE, 2013, 1294–1299.

21) 秦红波，宇文惠惠，李望云，张新平,TSV结构微凸点互连热疲劳寿命的研究,2013中国力学大会，西安，CSTAM2013-A31-0842.

2012：

1) M.B. Zhou, X. Ma, X.P. Zhang, Undercooling behavior and intermetallic compound coalescence in microscale Sn-3.0Ag-0.5Cu solder balls and Sn-3.0Ag-0.5Cu/Cu joints, Journal of Electronic Materials, 2012, 41(11):3169–3178.

2) S. Cao, S. Pourbabak, D. Schryvers, Quantitative 3D morphologic and distributional study of Ni₄Ti₃ precipitates in a Ni51Ti49 single crystal alloy, Scripta Materialia, 2012, 66: 650–653.

3) M.B. Zhou, X. Ma, X.P. Zhang, Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process, Journal of Materials Science: Materials in Electronics, 2012, 23(8): 1543–1551.

4)K. Zhao, Y. Pan, P. Guess, X.P. Zhang, M.G. Swain, Influence of veneer application on fracture behavior of lithium-disilcate-based ceramic crowns, Dental Materials, 2012, 28(6): 653–660.

5) C.B. Ke, S.S. Cao, X. Ma, X.P. Zhang, Modeling of Ni₄Ti₃ precipitation during stress-free and stress-assisted aging of bi-crystalline NiTi shape memory alloys, Transaction of Nonferrous Metals Society of China, 2012, 22: 2578–2585.

6) 岳武，秦红波，周敏波，马骁，张新平，结构变化对Cu/Sn-58Bi/Cu微焊点电迁移行为和组织演变的影响，金属学报，2012, 48(6): 678–686.

7) 张静娴，洪秋虹，孙学通，张新平，医用多孔TiO₂/HA/TiO₂复合涂层的制备和性能，材料研究学报，2012, 26(6): 572–576.

8) 杜倩，周敏波，张新平，赵克，前牙全瓷冠饰瓷崩裂断口形貌分析，中华口腔医学杂志，2012, 47(4): 1–4.

9) 石新莹，田恬，毛学理，张静娴，张新平，赵克，羟基磷灰石涂层处理的多孔镍钛合金溶血性及细胞粘附性评价，中华口腔医学研究杂志，2012，6(3): 266–271.

10) H.B. Qin, X.P. Zhang, Effect of the growth of interfacial IMC layer on fatigue life of the BGA interconnects, Proceedins of 14th International Conference on Electronics Materials and Packaging (EMAP), IEEE, 2012, 360–366.

11) J.B. Zeng, M.B. Zhou, X.P. Zhang, Volume Effect on interfacial microstructure and mechanical properties of Ni(UBM)-Sn3.0Ag0.5Cu-Ni(UBM) sandwich structure interconnects, Proceedings of 14th International Conference on Electronics Materials and Packaging (EMAP), IEEE, 2012, 182–186.

12) G.S. Xu, J.B. Zeng, M.B. Zhou, S.S. Cao, X. Ma, X.P. Zhang, Influence of soldering temperature and dwelling time on morphological evolution of Cu₆Sn₅ intermetallic compound at the Sn-3.0Ag-0.5Cu/Cu interface, Proceedings of 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), IEEE, 2012, 289–293.

13) J.Q. Huang, M.B. Zhou, C.Z. Li, X. Ma, X.P. Zhang, Processing performance and microstructure of Sn-Zn based solders modified by Bi and mixed rare earth elements, Proceedings of 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), IEEE, 2012, 352–355.

14) X.P. Li, J.M. Xia, H.B. Qin, X.Q. He, X.P. Zhang, Study of critical factors influencing the solidification undercooling behavior of Sn-3.0Ag-0.5Cu (SAC) lead-free solder and SAC/Cu joints, Proceedings of 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), IEEE, 2012, 356–360.

15) H.B. Qin, X.P. Li, X.P. Zhang, Influence of thickness of interfacial IMC layer and solder mask layer on mechanical reliability of micro-scale BGA structure interconnects, Proceedings of 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), IEEE, 2012, 714–719.

16) W. Li, M.B. Zhou, H.B. Qin, X. Ma, X.P. Zhang, Experimental and numerical study of the size effect on microstructure and mechanical behavior of Cu/Sn0.7Cu0.05Ni/Cu joints with very small solder volume, Proceedings of 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), IEEE, 2012, 749–754.

17) M.B. Zhou, J.B. Zeng, X. Ma, X.P. Zhang, Dissolution behavior of Cu UBM in BGA structure Sn-3.0Ag-0.5Cu/Cu joints during liquid isothermal aging at and above the solder’s melting temperature, Proceedings of 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), IEEE, 2012, 872–876.

18) H.B. Qin, X.P. Zhang, Three-dimensional finite element analysis of mechanical and fracture behavior of micro-scale BGA structure solder joints containing cracks in the intermetallic compound layer, Proceedings of 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), IEEE, 2012, 1244–1249.

19) X.P. Li, H.B. Qin, Y.F. En, J.M. Xia, X.P. Zhang, Loading rate and size effect on the fracture behavior of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu interconnects, Proceedings of 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), IEEE, 2012, 1298–1302.

20) J.B. Zeng, G.S. Xu, M.B. Zhou, X. Ma, X.P. Zhang, Microstructural evolution and mechanical behavior of line-type Ni/Sn3.0Ag0.5Cu/Ni interconnects with a small thickness during isothermal aging, Proceedings of 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), IEEE, 2012, 1303–1307.

21) W. Yue, H.B. Qin, M.B. Zhou, G.S. Xu, S.S. Cao, X. Ma, X.P. Zhang, Influences of the initial thickness of the interfacial IMC layer on electromigration behavior of Cu/Sn/Cu microscale joints, Proceedings of 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), IEEE, 2012, 1320–1325.

2011：

1) X.P. Li, J.M. Xia, M.B. Zhou, X. Ma, X.P. Zhang, Solder volume effects on the microstructure evolution and shear fracture behavior of ball grid array structure Sn3.0Ag0.5Cu solder interconnects, Journal of Electronic Materials, 2011, 40(12): 2425–2435.

2) X.T. Sun, Z.X. Kang, X.L. Zhang, H.J. Jiang, R.F. Guan, X.P. Zhang, A comparative study on the corrosion behavior of porous and dense NiTi shape memory alloys in NaCl solution, Electrochimica Acta, 2011, 56: 6389–6396.

3) X. Ma, R.C. Pond, Martensitic interfaces and transformation crystallography in Pu-Ga alloys. Journal of Materials Science, 2011, 46: 4236–4242.

4) J.X. Zhang, R.F. Guan, X.P. Zhang, Synthesis and characterization of sol-gel hydroxyapatite coatings on porous NiTi alloys, Journal of Alloys and Compounds, 2011, 509(13): 4643–4648.

5) Z.Z. Wei, X. Ma, X.P. Zhang, Defect structure and martensitic transformationcrystallography in a Ni2MnGa alloy, Materials Science Forum, 2011, 687: 463–466.

6) M.B. Zhou, X. Ma, X.P. Zhang, Early interfacial reaction and formation of intermetallic compounds in the Sn-3.5Ag/Cu soldering system, Journal of Electronic Materials, 2011, 40(2): 189–194.

7) Z.L. Tang, X.P. Zhang, Effect of rare earth on 30CrMnSi steel investment castings cracking, Advanced Materials Research, 2011, 160: 692–697.

8) 周敏波，马骁，张新平，稀土改性Sn-Cu-Ni无铅钎料的凝固过冷行为与组织演化，稀有金属材料与工程，2011, 40(S2): 25–30.

9) 江鸿杰，柯常波，曹姗姗，马骁，张新平. 纳米SiC颗粒增强NiTi形状记忆复合材料制备及其力学性能和阻尼行为，金属学报, 2011, 47(9): 1105–1111.

10) 孙学通，江鸿杰，杨萌蕾，关锐峰，张新平，多孔NiTi记忆合金的化学氧化和热氧化表面改性的对比研究，功能材料. 2011, 42 (3): 1539–1542.

11) 孙学通，江鸿杰，杨萌蕾，关锐峰，张新平，多孔NiTi合金的化学氧化处理表面改性研究，材料导报，2011, 7: 147–149.

12) 李勋平，周敏波，马骁，张新平. 界面耦合作用对Cu(Ni)/Sn-Ag-Cu/Cu(Ni)BGA焊点界面IMC形成与演化的影响，金属学报, 2011, 47(5): 611-619.

13) 柯常波，马骁，张新平. 孔隙对NiTi形状记忆合金中B2-R相变影响的相场法模拟. 金属学报, 2011, 47(2): 129–139.

14) 张静娴，张新平，孙学通，刘应亮，医用多孔NiTi合金表面溶胶-凝胶法制备TiO2涂层，无机化学学报，2011, 27(2): 264–268.

15) 潘娱，M.V. Swain, 马骁，张新平，赵克，饰瓷对磨牙e.max双层全瓷冠断裂类型的影响，口腔医学研究，2011, 27(2): 97–100.

16) 田恬，关锐峰，赵克，张新平，孔隙尺寸对多孔镍钛合金弹性模量及压缩强度的影响，中华口腔医学研究杂志，2011, 5(3): 268–273.

17) 徐炜，石新莹，关锐峰，张新平，赵克，孔隙率对多孔镍钛合金力学性能及离子析出量的影响，医用生物力学，2011, 26(6): 349–354.

18) 潘娱，赵克，张新平，瓷修复体循环疲劳失效行为的实验研究方法，国际口腔医学杂志，2011, 38(3): 34–37.

19) 吴玮琦，程绮婷，张骏，马骁，张新平，赵克，牙科陶瓷的动疲劳性能研究及循环疲劳寿命数值计算，中华口腔医学研究杂志，2011, 5(1): 37–43.

20) W. Li, M.B. Zhou, X. Ma, X.P. Zhang, Influence of mixed rare earth addition on the microstructure of the Sn-Cu-Ni solder and interfacial reaction of Cu/Sn-Cu-Ni/Cu joints, Proceedings of 12^th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE, 2011, 228–232.

21) M.B. Zhou, X. Ma, X.P. Zhang, Size effect on the intermetallic compound coalescence in Sn-Ag-Cu solder and Sn-Ag-Cu/Cu solder joints, Proceedings of 12^th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE, 2011, 248–253.

22) J.M. Xia, X.P. Li, X. Ma, X.P. Zhang, FE simulation of joint volume effect on fracture behavior of BGA structure Cu/Sn3.0Ag0.5Cu/Cu interconnects under lap-shear loading, Proceedings of 12^th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE, 2011, 477–482.

23) X.P. Li, J.M. Xia, X.P. Zhang, The solder volume effect on the creep behavior of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints, Proceedings of 12^th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP),IEEE, 2011, 867–873.

24) W. Yue, M.B. Zhou, H.B. Qin, X.P. Li, X. Ma, X.P. Zhang, A comparative investigation of the electromigration behavior between wedge-type and line-type Cu/Sn3.0Ag0.5Cu/Cu interconnects, Proceedings of 12^th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE, 2011, 971–975.

25) H.B. Qin, B. Li, X.P. Li, X.P. Zhang, Finite element simulation of fracture behavior of BGA structure solder interconnects, Proceedings of 12^th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE, 2011, 991–996.

26) J.X. Zhang, R.F. Guan, X.P. Zhang, TiO₂ anatase coatings on porous NiTi shape memory alloy prepared by a dipping sol–gel method, 5th International Conference on Bioinformatics and Biomedical Engineering, 10–12 May 2011, Wuhan, China.

2010：

1) M.B. Zhou, X. Ma, X.P. Zhang, Undercooling behavior and solidification microstructure evolution of Sn-Cu-Ni solders modified by minute amount of mixed rare earth La-Ce, Materials Science Forum, 2010, 654: 1373–1376.

2) C.B. Ke, X. Ma, X.P. Zhang, Phase field simulation of Ni₄Ti₃ precipitation in porous NiTi shape memory alloys under applied stresses, Materials Science Forum, 2010, 654: 1504–1507.

3) D.S. Li, X.P. Zhang, Z.P. Xiong, Y.W. Mai, Lightweight NiTi shape memory alloy based composites with high damping capacity and high strength, Journal of Alloys and Compounds, 2010, 490(1–2): L15–L19.

4) 关锐峰，李大圣，张新平，采用新型硬脂酸造孔剂烧结制备多孔NiTi合金的结构及性能，机械工程材料，2010, 34(11): 37–41.

5) 刘亮岐，徐金华，陈胜，马鑫，张新平，添加Ag元素对铝软钎焊用Sn-1.5Zn系钎料性能的影响，材料工程，2010, 329: 22–26.

6) 徐炜，赵克，张新平，牙科镍钛形状记忆合金的表面改性，国际口腔医学杂志，2010, 37(2): 221–224.

7) 周敏波，李勋平，马骁，张新平，Sn-3.5Ag/Cu体系早期界面反应及焊点凝固过冷行为的研究，金属学报，2010, 46 (5): 569-574.

8) 黎滨，杨艳，尹立孟，张新平. 无铅微焊点界面断裂行为的尺寸效应，机械工程学报，2010, 46(5): 177–185.

9) 柯常波，马骁，张新平，外应力对NiTi合金中共格Ni₄Ti₃沉淀相长大行为影响的相场法模拟，金属学报，2010, 46(8): 921–929.

10) 柯常波，马骁，张新平，NiTi形状记忆合金中共格Ni₄Ti₃沉淀相生长动力学行为的相场法模拟，金属学报，2010, 46(1): 84–90.

11) 尹立孟, 张新平. 无铅微互连焊点力学行为尺寸效应的实验及数值模拟. 机械工程学报, 2010, 46(2): 55–60.

12) 杨艳，尹立孟，马晓，张新平，电迁移致SnAgCu微焊点强度退化及尺寸效应研究，电子元件与材料，2010, 29(2): 70–73.

13) C.B. Ke, X.P. Zhang, X. Ma, N. Zhou, Y. Wang, Phase field simulation of Ni₄Ti₃ precipitation during aging of bi-crystalline NiTi alloy, 11th IUMRS International Conference in Asia, Oral Presentation, Sept. 25–28, 2010.

14) M.B. Zhou, H.B. Qin, X. Ma, X.P. Zhang, Interfacial Reaction and Melting/solidification Characteristics between Sn and different metallizations of Cu, Ag, Ni and Co, Proceedings of 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE, 2010, 202–207.

15) H.B. Qin, B. Li, X.P. Zhang, Finite element simulation of dynamic fracture behaviour and crack deflection in electronic packaging materials and micro-interconnections, Proceedings of 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE, 2010, 594–600.

16) X.P. Li, J.M. Xia, M.B. Zhou, X. Ma, X.P. Zhang, The influence of solder volume and pad size on the shear fracture behavior of BGA structured Cu/Sn3.0Ag0.5Cu/Cu interconnects, Proceedings of 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE, 2010, 1118–1123.

2009：

1) L.M. Yin, X.P. Zhang, C.S. Lu. Size and volume effects on the strength of microscale lead-free solder joints. Journal of Electronic Materials, 2009, 38(4): 2179–2183.

2) D.S. Li, Y.P. Zhang, X. Ma, X.P. Zhang, Space-holder engineered porous NiTi shape memory alloys with improved pore characteristics and mechanical properties, Journal of Alloys and Compounds, 2009, 474(1–2): L1–L5.

3) D.S. Li, Y.P. Zhang, G. Eggeler, X.P. Zhang, High porosity and high strength porous NiTi shape memory alloys with controllable pore characteristics, Journal of Alloys and Compounds, 2009, 470(1–2): L1–L5.

4) 柯常波，张新平，第二相颗粒对多晶材料晶粒生长影响的元胞自动机(CA)模拟，中国有色金属学报，2009, 19(12): 2173–2178.

5) 王宏芹，D. P. Sekulic，赵慧，张新平，SnPb钎料在铜及金属间化合物基板上润湿动力学研究，中国有色金属学报，2009, 19(12): 2186–2191.

6) 尹立孟，杨艳，刘亮岐，张新平，电子封装微互连焊点力学行为的尺寸效应. 金属学报, 2009, 45(4): 422–427.

7) 张宇鹏，赵四勇，马骁，张新平，高线性超弹性多孔NiTi合金的压缩力学行为，中国有色金属学报，2009, 19(12): 2167–2172.

8) 张宇鹏，张新平，可变孔隙率多孔NiTi合金的内耗行为，中国有色金属学报，2009, 19(10): 1872–1879.

9) 杨艳，尹立孟，张新平，热时效和焊点尺寸对SnAgCu微焊点强度的影响，电子元件与材料，2009, 28(10): 54–56.

10) 马良，尹立孟，冼健威，张新平，高温电子封装无铅化的研究进展，焊接技术，2009, 38(5): 6–10.

11) 吴晓平，李大圣，张骏，马骁，赵克，张新平，不同代型材料对全瓷冠断裂强度和断裂类型的影响，中华口腔医学杂志，2009, 44: 483–487.

12) 黄觉辉，赵克，张新平，全瓷冠桥疲劳行为的有限元分析研究进展，国际口腔医学杂志，2009, 36(3): 347–350.

13) 程绮婷，赵克，张新平，牙科陶瓷力学性能与可靠性的研究方法，中华口腔医学研究杂志，2009, 3(3): 63-66.

14) B. Li, L.M. Yin, Y. Yang, X.P. Zhang. FE simulation of size effects on interface fracture characteristics of microscale lead-free solder interconnects. Proceedings of 10th International Conference on Electronic Packaging Technology-High Density Packaging (ICEPT-HDP), IEEE, 2009, 242–247.

2008：

1) X.P. Zhang, H.Y. Liu, B. Yuan, Y.P. Zhang, Superelasticity decay behavior of the porous NiTi shape memory alloys under cyclic strain controlled fatigue, Materials Science and Engineering, 2008, A481–482: 170–173.

2) X.P. Zhang, L.M. Yin, C.B. Yu, Thermal creep and fracture behaviors of the lead-free Sn-Ag-Cu-Bi solder interconnections under different stress levels, Journal of Materials Science: Materials in Electronics, 2008, 19: 393–398.

3) X. Ma, R.C. Pond. Defect modelling of martensitic interfaces in plate martensite. Materials Science and Engineering, 2008, A481–482: 404–408.

4) 李大圣，张宇鹏，熊志鹏，张新平，轻质高强NiTi形状记忆合金的制备及其超弹性行为,金属学报，2008, 44(8): 995–1000.

5) 尹立孟，张新平. 电迁移致无铅钎料微互连焊点的脆性蠕变断裂行为. 电子学报，2009, 37(2): 253–257.

6) 张新平，尹立孟，于传宝，电子及光子封装无铅钎料研究和应用进展，材料研究学报，2008, 22(1): 1–9.

7) 尹立孟，张新平，电子封装微互连中的电迁移，电子学报，2008, 36(8): 1610–1614.

8) 刘亮歧，尹立孟，张新平，电子垃圾问题面临的挑战与解决途径，材料导报，2008, 22: 1–3.

9) 杨艳，尹立孟，冼健威，马鑫，张新平，绿色电子制造及绿色电子封装材料，电子工艺技术，2008, 29(5): 256–261.

10) 王勤琴, 张骏,赵克,张新平, 磨牙全瓷冠断裂类型的力学实验与三维有限元分析研究, 中华口腔医学杂志，2008, 43(11): 680-683.

11) 王勤琴，赵克，张新平，全瓷冠桥修复体的应力分布、疲劳及断裂失效分析有限元方法的研究和应用，国际口腔医学杂志，2008, 35: 130–133.

12) 张骏，赵克，王勤琴，范丹妮，吴小平，张新平，不同直径压头对磨牙e.max全瓷冠失效模式的影响，中华口腔医学研究杂志，2008, 2(4): 21–23.

13)吴晓平，程绮婷，赵克，张新平，牙陶瓷材料及修复体循环疲劳的损伤模式，中华口腔医学研究杂志，2008, 2(1): 79–82.

14) D.S. Li, Z.P. Xiong, Y.P. Zhang, X.P. Zhang, Damping behaviors of the second-phase engineered NiTi shape memory alloys, International Conference on Martensitic Transformations, June 29 to July 5, 2008, New Mexico, USA.

15) Y.P. Zhang, D.S. Li, X. Ma, X.P. Zhang, Phase transformation and internal friction behaviors of gradient porosity Ni50.8Ti49.2 shape memory alloys, International Conference on Martensitic Transformations, June 29-July5, 2008, New Mexico, USA.

2007：

1) Y.P. Zhang, D.S. Li, X.P. Zhang, Gradient porosity and large pore size NiTi shape memory alloys, Scripta Materialia, 2007, 57: 1020–1023.

2) Y.P. Zhang, C.Y. Chung, X.P. Zhang, Porous titanium-nickel alloys with adjustable porosity fabricated by use of pore-forming agent and conventional sintering, Journal of Materials Science and Engineering, 2007, 25(6): 938–942.

3) Y.P. Zhang, B. Yuan, M.Q. Zeng, C.Y. Chung, X.P. Zhang, High porosity and large pore-size shape memory alloys fabricated by using pore-forming agent (NH₄HCO₃) and capsule-free hot isostatic pressing, Journal of Materials Processing Technology, 2007, 192: 439–442.

4) X.P. Zhang, C.B. Yu, Y.P. Zhang, S. Shrestha, L. Dorn, Processing treatment of a lead-free Sn-Ag-Cu-Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection, Journal of Materials Processing Technology, 2007, 192: 539–542.

5) X.P. Zhang, C.B. Yu, S. Shrestha, L. Dorn, Creep and fatigue behaviours of the lead-free Sn-Ag-Cu-Bi and Sn60Pb40 solder interconnections at elevated temperatures, Journal of Materials Science: Materials in Electronics, 2007, 18(8): 665–670.

6) 张宇鹏, 张新平, 钟志源，梯度孔隙率与大孔隙尺寸NiTi形状记忆合金制备及其相变和超弹性行为，金属学报，2007, 43(11): 1221–1227.

7) 张新平，张宇鹏，多孔NiTi形状记忆合金研究进展, 材料研究学报, Vol.21, No.6, 2007，1–9.

8) 张新平，于传宝，张宇鹏等，两种无铅钎料的抗蠕变性能与Sn60Pb40钎料的对比分析, 焊接学报, 2007, 28(2): 1–4.

9) 赵克，张新平, 李湘霞等，氧化锆含量对牙科复相铝瓷强度和断裂韧性的影响，华西口腔医学杂志，2007, 25(3): 295–298.

10) Y.P. Zhang, X.P. Zhang, C.Y. Chung, Effects of frequency and phase transition behavior on internal friction of porous Ni50.8Ti49.2 shape memory alloys, The International Conference on Shape Memory and Superelastic Technologies, 3–5 December 2007, Tsukuba, Japan.

11) Y.P. Zhang, C.Y. Chung, D.S. Li, X.P. Zhang, Effects of strain amplitude, thermal dynamic cycle and ageing treatment on internal friction behavior of porous NiTi shape memory alloys, The International Conference on Shape Memory and Superelastic Technologies, 3–5 December 2007, Tsukuba, Japan.

2006:

1) B. Yuan, X.P. Zhang, C.Y. Chung, M. Zhu, The effect of porosity on phase transformation behavior of porous Ti-50.8at.%Ni shape memory alloys prepared by capsule-free hot isostatic pressing, Materials Science and Engineering, 2006, A438–440: 585–588.

2) B. Yuan, X.P. Zhang, C.Y. Chung, M.Q. Zeng, M. Zhu, A comparative study of the porous TiNi shape memory alloys fabricated by three different processes, Metallurgical and Materials Transactions, 2006, A37: 755–761.

3) X.P. Zhang, C.S. H. Lim, Y.W. Mai, Y.W. Shi, Thermal fatigue and creep fracture behaviors of a nanocomposite solder in microelectronic/optoelectronic packaging, Key Engineering Materials, 2006, 312: 237–242.

4) J.H. Yang, X.P. Zhang, Y.W. Mai, W. Yan, Observation of dislocation microstructures and simulation of stress field during fatigue crack initiation in a copper single crystal, Key Engineering Materials, 2006, 312: 71–76.

5) B. Yuan, C.Y. Chung, X.P. Zhang et al, Superelastic porous NiTi shape memory alloy fabricated by capsule-free hot isostatic pressing process, International Conference on Shape Memory and Superelastic Technologies, 7–11 May 2006, Asilomar Conference Grounds Pacific Grove, California USA.

6) Y.P. Zhang, B. Yuan, C.Y. Chung, H.Y. Liu, X.P. Zhang, Superelasticity decay induced by cyclic strain for a porous NiTi shape memory alloy, the International Conference on Structural Integrity and Failure, Sydney, Australia, 27–29 September 2006.

2005:

1) X.P. Zhang, C.H. Wang, L. Ye, Y.W. Mai, A study of the crack wake closure/opening behavior of short fatigue cracks and its influence on crack growth, Materials Science and Engineering,2005, A406(1–2): 195–204.

2) B. Yuan, C.Y. Chung, X.P. Zhang, M.Q. Zeng, M. Zhu, Control of porosity and superelasticity of porous NiTi shape memory alloys prepared by hot isostatic pressing, Smart Materials and Structures, 2005, 14(5): S210–206.

3) Z.F. Wu, M.Q. Zeng, L.Z. Ouyang, X.P. Zhang, M. Zhu, Ostwald ripening of Pb nanocrystalline phase in mechanically milled Al-Pb alloys and the influence of Cu additive, Scripta Materialia, 2005, 53(5): 529–533.

4) J.H. Yang, X.P. Zhang, Y.W. Mai, W.P. Jia, S.X. Li, Environmental effects on deformation mechanism and dislocation microstructure in fatigued copper single crystal, Materials Science and Engineering, 2005, A396: 403–408.

5) J.H. Yang, X.P. Zhang, Y.W. Mai, W.P. Jia, S.X. Li, W. Ke, Saturation dislocation microstructures of double-slip-oriented copper single crystal during the corrosion fatigue in a 0.5 N NaCl aqueous solution, Journal of Materials Science and Technology, 2005, 21(3): 343–346.

6) X.P. Zhang, Y.W. Mai, Y.W. Shi, S. Shrestha and L. Dorn, Creep fracture fracture behavior of joints soldered by a nano-composite solder, lead-free and conventional Sn-Pb solders,11th International Congress on Fracture (ICF11), Turin, Italy, March 20–25, 2005, 331.

2004:

1) X.P. Zhang, H.W. Wang, Y.W. Shi, Influence of elements Bi, Ag and In on surface tension and processing performance of tin-lead based solders, Journal of Materials Science: Materials in Electronics, 2004, 15(8): 511–517.

2) X.P. Zhang, Y.W. Shi, A dissolution model of base metal in liquid brazing filler metal during high temperature brazing, Scripta Materialia, 2004, 50: 1003–1006.

3) X.P. Zhang, S. Galea, L.Ye, Y.W. Mai, Characterization of the effects of applied electric fields on fracture toughness and cyclic electric field induced fatigue crack growth for a piezoceramic PIC151, Smart Materials and Structures, 2004, 13: 9–16.

4) X.P. Zhang, L. Ye, Y.W. Mai, S. Galea, Fatigue crack growth and piezoelectric property decay induced by cyclic electric field for an actuator piezoceramic PIC151, The International Conference on Structural Integrity and Fracture (SIF2004), Brisbane, Australia, 26–29 Sept. 2004, 395–400.

5) X.P. Zhang, Y.W. Mai, Y.W. Shi, Characterization of creep behaviours of soldered joints of a nano-composite solder, lead-free Sn-Ag-Bi and Sn60Pb40 solders, The International Conference on Structural Integrity and Fracture (SIF2004), Brisbane, Australia, 26–29 Sept. 2004, 401–405.

6) J.H. Yang, X.P. Zhang, Y.W. Mai et al., Saturation dislocation microstructures in a copper single crystal during the corrosion fatigue in HClO4 aqueous solutions, The International Conference on Structural Integrity and Fracture (SIF2004), Brisbane, Australia, 26–29 Sept. 2004, 381–386.

7) X.P. Zhang, Q. Yuan, W. Ngatimin, J. Whitbourn, L. Ye, Y.W. Mai, Environment effect of natural sisal fibre reinforced epoxy composites manufactured by resin transfer moulding, Composites Technologies for 2020, Proceedings of 4th Asian-Australasian Conference on Composite Materials (ACCM-4), Sydney, Australia, 6–9 July 2004, 88–93.

8) X.P. Zhang, Y.W. Shi, L. Ye, Y.W. Mai, A tin-based composite solder reinforced by nano-particulates and its soldering ability, Composites Technologies for 2020, Proceedings of the 4th Asian-Australasian Conference on Composite Materials (ACCM-4), Sydney, Australia, 6–9 July 2004, 645–650.