Engineering Research Center of Precision Electronic Manufacturing Equipments, Ministry of Education
 
time: 2015-07-16

   The Engineering Research Center of Precision Electronic Manufacturing Equipment (EME), as the third Ministerial Engineering Research Center in the South China Technology of University, was approved in 2007 by the national Ministry of Education. The EME center agglomerates the resources of precision electronic manufacturing field in SCUT, concentrates on the technological innovation and high-level personnel training for precision electronic packaging, assembly and testing equipment.

   The EME center consists of semiconductor packaging and testing, surface mounting technology (SMT) and optical detection technology divisions. There are three research and development departments of high-speed visual detection, high precision control and embedded system, with the excellent research and development platform in SMT production, semiconductor bonding technology and automatic optical inspection.

   Through technological innovation and achievements into the accumulation of many years, the center has completed and responsible for national major 02 projects, 863 major projects, key projects in Guangdong province and Guangzhou science and technology programs, with more than one 170 patents in semiconductor packaging, testing equipment and SMT field. There are three series of independent innovation products in white LED package, ultra precision optical detection and SMT assembly, including:

   (a), The automatic production equipments for high power white LED packaging: automatic intelligent plastic lens molding machine and fluorescent powder coating machine, which provide revolutionary equipments for the WLP, CSP, FC and other advanced LED packaging production.

   (b), The ultra precision optical detection equipments for large scale integrated circuit high density packaging substrate: automatic defect imaging detection instrument. It can only not be applied to the production process of high density flexible package substrate etching, key process and product developing the appearance of defect detection and the production process of quality control, but also can be applied to the detection of LED phosphor coating quality, surface characteristics of rigid flexible circuit board with high density.

   (c), The SMT equipment for the chip components and die attach material: automatic surface mounting and inserting machines, which broke through the automatic placement machine localization problem, especially suitable for flat panel display, LED lighting and other emerging electronic assembly industry.