Speaker：Prof. Joachim Loos, South China University of Technology (SCUT)

Part 1: Background & Applications

Time: December 7, 2022 (Wednesday) 4:00 p.m.

Tencent Meeting: 868-808-723

Part 2: Structure-Property Relations & Morphology

Time: December 14, 2022 (Wednesday) 4:00 p.m.

Tencent Meeting: 282-798-057

Venue: AISMST ROOM 324 (Building #2, KeJiYuan, North Campus) 

South China Advanced Institute for

Soft Matter Science and Technology

November 22, 2022

Brief Biography:

Joachim Loos is Chair Professor at the School of Emergent Soft Matter and founder of the advisory company “Morphys” (www.morphys.eu). He has a broad background on materials science and engineering, with focus on soft matter and polymers, and he is an expert for establishing so-called structure-property relations, i.e. fundamental understanding how to tune materials towards their desired performance. Moreover, he has ample experience on morphology characterization, especially with high-resolution microscopy techniques like Scanning and Transmission Electron Microscopy (SEM/TEM) and Atomic Force Microscopy (AFM).

Abstract:

In my seminar, I will provide an overview of past, present, and potential future developments of printed electronics. Focus is on applications, where functionality is based on small or large organic molecules, e.g. organic light emitting diodes (OLEDs), organic photovoltaics (OPVs) or organic field-effect transistors (OFETs), but non-organic components like transparent conductive oxide (TCO) layers or printed metal wires and contacts will be mentioned, too. One important aspect determining the performance of printed electronics is their nanoscale organization, the morphology of the printed structures and devices. I will introduce a toolbox allowing for detailed nanoscale characterization and I provide several examples demonstrating its versatility. Further, several approaches will be introduced for controlling the morphology and thus tuning or optimizing the performance of devices. Finally, during the seminar I will highlight few examples of potential applications making use of integration of PE, OE, FE, StE, SE and conventional electronics, i.e. “Hybrid Electronics (HE)”.